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Weekend Semiconductor Wire Bond Jobs (NOW HIRING)

Skyworks

Principal Reliability/FA Engineer

Newbury Park, CA · On-site

$108K - $136K/yr

... semiconductor devices, surface-mount components, printed circuit boards, and wire-bond and flip-chip modules. Design and execute parametric, RF, and system-level test strategies to enable accurate ...

Skyworks

Reliability/FA Engineer 2

Newbury Park, CA · On-site

$77K - $142K/yr

Perform data analysis and troubleshoot electronic components including semiconductor chips, surface mount components, printed circuit boards and wire-bond and flip chip modules. Communicate and ...

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Weekend Semiconductor Wire Bond information

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How much do weekend semiconductor wire bond jobs pay per hour?

As of Aug 7, 2026, the average hourly pay for weekend semiconductor wire bond in the United States is $21.55, according to ZipRecruiter salary data. Most workers in this role earn between $18.27 and $24.52 per hour, depending on experience, location, and employer.

What is the difference between Weekend Semiconductor Wire Bond vs Weekend Semiconductor Die Attach?

AspectWeekend Semiconductor Wire BondWeekend Semiconductor Die Attach
Required SkillsPrecise wire handling, bonding techniques, equipment operationDie placement, adhesive application, equipment operation
Work EnvironmentCleanroom, precision-focusedCleanroom, assembly-focused
CertificationsElectronics manufacturing certifications, safety trainingElectronics manufacturing certifications, safety training

Both roles involve working in cleanroom environments within the semiconductor industry, requiring similar certifications and precision skills. Wire bonding focuses on connecting semiconductor chips with fine wires, while die attaching involves placing and securing dies onto substrates. Understanding these differences helps clarify job responsibilities and required expertise in semiconductor manufacturing.

More about Weekend Semiconductor Wire Bond jobs
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What are the most commonly searched types of Semiconductor Wire Bond jobs? The most popular types of Semiconductor Wire Bond jobs are:
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What job categories do people searching Weekend Semiconductor Wire Bond jobs look for? The top searched job categories for Weekend Semiconductor Wire Bond jobs are:
Weekend Semiconductor Wire Bond jobs near you
Infographic showing various Weekend Semiconductor Wire Bond job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 69% Full Time, 25% Part Time, 4% Contract, and 1% Nights. Highlights an 94% Physical, 1% Hybrid, and 5% Remote job distribution, with an average salary of $44,825 per year, or $21.6 per hour.

Senior OSAT Engineer (Part-Time, Contract)

Altera Corporation

San Jose, CA • On-site

$159K - $230K/yr

Part-time

Re-posted 22 days ago

Job description

Job Details:
Job Description:
About Altera
Altera is a global leader in FPGA and programmable logic solutions, enabling innovation in data center, communications, automotive, aerospace, and industrial markets. As we expand manufacturing capabilities for next-generation programmable devices, we are strengthening our OSAT engineering organization to deliver world-class backend manufacturing performance.
Role Summary
We are seeking a highly skilled Senior OSAT Engineer to drive outsourced assembly and test engineering activities across Altera's global supplier network. You will lead NPI readiness, yield optimization, cost improvements, and qualification activity for packaging and test flows supporting Altera's FPGA/SoC product lineup. This role requires strong semiconductor backend engineering experience, hands-on problem solving, and the ability to collaborate closely with OSAT partners and cross-functional stakeholders.
Key Responsibilities
  • Lead technical engagement with OSAT suppliers on assembly and test process development, yield ramp, quality improvement, and volume manufacturing readiness.
  • Drive new product introduction (NPI) from engineering builds through production release, ensuring OSAT capability meets electrical/thermal/mechanical requirements for FPGA and SoC products.
  • Optimize packaging and test architectures for performance, cost, and reliability: flip-chip BGA, high-pin-count packages, substrate technologies, wafer-level solutions, burn-in/FT coverage.
  • Monitor and improve backend yield performance using data-driven analysis; identify systemic issues and lead root cause / corrective actions.
  • Partner with Test Engineering, Packaging, Product Engineering, DFM, and Quality teams on process optimization, failure analysis, and manufacturability improvements.
  • Implement and maintain process control systems, SPC methodologies, automation improvements, and lean manufacturing principles at OSAT.
  • Support cost reduction initiatives including BOM optimization, process simplification, and cycle time improvements.
  • Track supplier performance metrics (yield, DPPM, cost, cycle time, OEE) and provide updates with risk assessments and mitigation plans.
  • Lead or support reliability testing and package qualification activities aligned to industry standards (JEDEC, IPC, AEC-Q).
  • Maintain strong technical relationship and communication cadence with OSAT partners to ensure transparency, collaboration, and escalation management.

Salary Range
The pay range below is for Bay Area California only. This is a part-time, hourly position that pays the equivalent hourly rate of the below salary range. Actual salary may vary based on a number of factors including job location, job-related knowledge, skills, experiences, trainings, etc.
$159,700 - $230,000 USD
We use artificial intelligence to screen, assess, or select applicants for the position. Applicants must be eligible for any required U.S. export authorizations.
Qualifications:
Qualifications:
Minimum Requirements
  • Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
  • 10+ years of semiconductor assembly, packaging, or test engineering experience.
  • Hands-on experience with OSAT manufacturing environments, including wafer finishing, substrate attach, interconnect packaging, test, and burn-in.
  • Strong technical understanding of backend manufacturing flows: flip-chip, wire bond, underfill, molding, final test, reliability stress and analysis.
  • Proven ability to analyze yield, reliability, and cost data to drive engineering decisions and improvements.
  • Demonstrated success working with international suppliers and cross-functional teams.
  • Strong written and verbal communication skills, including technical reporting and supplier engagement.

Preferred Qualifications
  • FPGA, ASIC, or SoC backend experience, particularly high-pin-count or high-power devices.
  • Experience in automotive or high-reliability product qualifications (AEC-Q / ISO standards).
  • Familiarity with advanced packaging: 2.5D/3D, fan-out WLP, heterogeneous integration.
  • Knowledge of supply chain risk mitigation, dual sourcing, and volume scaling strategies.
  • Experience with automation, traceability systems, and smart factory/manufacturing analytics.

Job Type:
Regular
Shift:
Shift 1 (United States of America)
Primary Location:
San Jose, California, United States
Additional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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