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Weekend Semiconductor Wire Bond Jobs (NOW HIRING)

Senior Process Engineer

San Jose, CA · On-site

$100K - $150K/yr

Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace). * Knowledge in semiconductor manufacturing is a plus. * Self-motivated with the ability to align and ...

Senior Process Engineer

Milpitas, CA · On-site

$100K - $135K/yr

Experience: * Advanced understanding of Semiconductor processes. * Hands-on Experience in ... in Die Attach, Wire Bond or Mold * Knowledge of basic AutoCAD or Solidworks preferred.

Senior Process Engineer

Milpitas, CA · On-site

$100K - $135K/yr

Experience: * Advanced understanding of Semiconductor processes. * Hands-on Experience in ... in Die Attach, Wire Bond or Mold * Knowledge of basic AutoCAD or Solidworks preferred.

Senior Process Engineer

San Jose, CA · On-site

$100K - $150K/yr

Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace). * Knowledge in semiconductor manufacturing is a plus. * Self-motivated with the ability to align and ...

Semiconductor assembly processes such as die attach, wire bond, molding, singulation, wafer thinning/saw, die pick, and related processes * Prototype, NPI (New Product Introduction), or high-mix/low ...

Sr Process Engineer

San Jose, CA · On-site

$100K - $119K/yr

Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace). * Knowledge in semiconductor manufacturing is a plus. * Self-motivated with the ability to align and ...

Showing results 21-40

Weekend Semiconductor Wire Bond information

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How much do weekend semiconductor wire bond jobs pay per hour?

As of Aug 7, 2026, the average hourly pay for weekend semiconductor wire bond in the United States is $21.55, according to ZipRecruiter salary data. Most workers in this role earn between $18.27 and $24.52 per hour, depending on experience, location, and employer.

What is the difference between Weekend Semiconductor Wire Bond vs Weekend Semiconductor Die Attach?

AspectWeekend Semiconductor Wire BondWeekend Semiconductor Die Attach
Required SkillsPrecise wire handling, bonding techniques, equipment operationDie placement, adhesive application, equipment operation
Work EnvironmentCleanroom, precision-focusedCleanroom, assembly-focused
CertificationsElectronics manufacturing certifications, safety trainingElectronics manufacturing certifications, safety training

Both roles involve working in cleanroom environments within the semiconductor industry, requiring similar certifications and precision skills. Wire bonding focuses on connecting semiconductor chips with fine wires, while die attaching involves placing and securing dies onto substrates. Understanding these differences helps clarify job responsibilities and required expertise in semiconductor manufacturing.

More about Weekend Semiconductor Wire Bond jobs
What cities are hiring for Weekend Semiconductor Wire Bond jobs? Cities with the most Weekend Semiconductor Wire Bond job openings:
What are the most commonly searched types of Semiconductor Wire Bond jobs? The most popular types of Semiconductor Wire Bond jobs are:
What states have the most Weekend Semiconductor Wire Bond jobs? States with the most job openings for Weekend Semiconductor Wire Bond jobs include:
What job categories do people searching Weekend Semiconductor Wire Bond jobs look for? The top searched job categories for Weekend Semiconductor Wire Bond jobs are:
Infographic showing various Weekend Semiconductor Wire Bond job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 69% Full Time, 25% Part Time, 4% Contract, and 1% Nights. Highlights an 94% Physical, 1% Hybrid, and 5% Remote job distribution, with an average salary of $44,825 per year, or $21.6 per hour.

Senior Process Engineer

careers@micross.com

San Jose, CA • On-site

$100K - $150K/yr

Full-time

Re-posted 2 days ago


Job description

Job Description: Sr. Process Engineer

Reports To: Process Engineering Supervisor


Summary:

Perform functions to research, develop, document, qualify, and implement production processes for standard and custom packaged DC-DC converter products. Establish stable manufacturing processes at the prototype phase and release to production. Review, develop, and implement process improvements related to both the design and manufacture of Hybrid Microcircuits and PCB based power circuits.


Essential Duties & Responsibilities:

  • Support process technology transfer from Process Engineering to Manufacturing.
  • Support the development of robust manufacturing processes using Design of Experiments (DOEs).
  • Establish validation and verification criteria for new processes & products.
  • Create and revise documentation detailing production processes and equipment.
  • Provide engineering support to facilitate new processes and troubleshoot problems in assembly areas.
  • Stay abreast of best practices and technologies and update processes to enhance or expand manufacturing capabilities.
  • Review new products to ensure they meet Design for Manufacturing (DFM) criteria.
  • Identify, facilitate, and prioritize opportunities for process improvement.
  • Utilize technical skills associated with Six Sigma, Lean, DRM/DFSS and other appropriate techniques to drive continuous improvement.
  • Follow established procedures to create detailed, accurate, and compliant engineering documentation for Master Validation Plans, pFMEA, Equipment Installation, Qualification and Validation activities.

Other Duties & Responsibilities:

  • Perform or assist with any operations to maintain workflow, meet schedules and meet quality requirements.
  • Maintain safe work areas, comply with safety procedures, and follow equipment operating rules.
  • Follow clean room and other environmental precautions and procedures.
  • Participate in meetings and work groups to facilitate cross functional activities, communicate issues, obtain approvals, resolve problems, and maintain knowledge of new developments, requirements, and policies.
  • Comply with all quality and ITAR policies, practices, and procedures.
  • Participate in team efforts to achieve departmental and company goals.
  • Contribute to building a positive team spirit.
  • Communicate effectively with all levels of employees.
  • Protect confidential information by not communicating, disclosing, or using for benefit of 3rd parties.
  • Maintain the highest degree of honesty and integrity at all times.
  • Perform other related duties as assigned.


Job Qualifications:

  • BSMSE, BSMatE, BSME or equivalent 4-year technical degree.
  • 5-10 years of relevant work experience.
  • CAD, SolidWorks software courses, and/or equivalent experience
  • Experience of expertise in Materials Science and Engineering is a plus.
  • Experience in any of the following processes is a plus: thick-film manufacturing, Au/Al wire bonding, die attach, soldering, lead forming, hermetic sealing, degreasing.


Job Skills:

  • Fast technical document generation/modification in CAD, Word, Excel, etc. (PCB software is a plus).
  • Detail oriented with a clear understanding of DOE and failure analysis concepts.
  • Knowledge in military standards is a plus (MIL-PRF38534, MIL-PRF-38535, MIL-STD-883, JSTD-001).
  • Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace).
  • Knowledge in semiconductor manufacturing is a plus.
  • Self-motivated with the ability to align and change priorities in accordance with business goals.
  • Ability to meet deadlines in a fast-paced environment.
  • Team player who enjoys working with different disciplines.


Tools & Equipment:

  • Computer and peripherals.
  • Standard office equipment.
  • Manual and automatic semiconductor manufacturing equipment.
  • Measuring tools and equipment.
  • Required clean room clothing (gloves, mask, smock, shoe covers).
  • IMPORTANT INFORMATION: This position is in an ITAR-registered facility, US Person (US Citizen or US Permanent resident) status is a must.