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Thin Film Process Engineer Jobs in Oregon (NOW HIRING)

Intel Corporation

Senior Thin Films Engineer

Hillsboro, OR · On-site

$113K - $156K/yr

Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development ...

Intel

Senior Thin Films Engineer

Hillsboro, OR

$60.25 - $77.50/hr

Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development ...

Oregonstate

ATAMI Thin Films Engineer

Corvallis, OR

$90K - $102K/yr

The Division of Research and Innovation is seeking an ATAMI Thin Films Engineer. This is a ... Sustaining and development support for thin film processing equipment including sputter deposition ...

ASM

Principal Field Process Engineer

Hillsboro, OR · On-site

Principal Field Process Engineer (Hillsboro, OR) The Principal Field Process Engineer (FPE) is a ... in thin-film deposition (ALD). * Strong expertise in semiconductor device integration, vacuum ...

ASM

Senior Engineer I, Field Process

Hillsboro, OR · On-site

As a Senior Engineer, Field Process, you will help expand ASM's advanced film technologies at our ... Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin film ...

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Thin Film Process Engineer information

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$52.3K

$97.3K

$150.7K

How much do thin film process engineer jobs pay per year?

As of Aug 19, 2026, the average yearly pay for thin film process engineer in Oregon is $97,289.00, according to ZipRecruiter salary data. Most workers in this role earn between $78,800.00 and $108,900.00 per year, depending on experience, location, and employer.

What is a thin film process engineer?

A Thin Film Process Engineer develops and optimizes thin-film deposition processes used in semiconductor, optics, or display manufacturing. They work with techniques such as sputtering, chemical vapor deposition (CVD), and atomic layer deposition (ALD) to create precise coatings on substrates. Their responsibilities include process development, troubleshooting, equipment maintenance, and improving yield and quality. Collaboration with cross-functional teams to enhance production efficiency and implement new technologies is also a key aspect of the role.

What are the key skills and qualifications needed to thrive as a thin film process engineer?

To thrive as a Thin Film Process Engineer, you typically need a degree in materials science, physics, chemical engineering, or a related field, along with hands-on experience in thin film deposition and characterization techniques. Familiarity with tools such as sputtering systems, chemical vapor deposition (CVD), ellipsometry, and statistical process control (SPC) software is highly valued, and certifications like Six Sigma can be advantageous. Strong problem-solving skills, attention to detail, and the ability to effectively communicate and collaborate within multidisciplinary teams help professionals excel in this role. These skills and qualities ensure precise process development, high-quality thin film production, and efficient cross-functional workflow in technology-driven environments.

What are typical challenges faced by thin film process engineers in their daily work?

Thin Film Process Engineers often encounter challenges such as maintaining process consistency, troubleshooting equipment malfunctions, and optimizing deposition parameters for specific material properties. They must carefully monitor and control variables to produce defect-free films, which requires both technical precision and adaptability. Working closely with R&D, production, and quality teams is a regular part of the job, and engineers are often called upon to provide quick solutions to unexpected process issues. These challenges make for a dynamic work environment where attention to detail and proactive problem-solving are keys to success.

What are popular job titles related to Thin Film Process Engineer jobs in Oregon?

For Thin Film Process Engineer jobs in Oregon, the most frequently searched job titles are:

What job categories do people searching Thin Film Process Engineer jobs in Oregon look for?

The top searched job categories for Thin Film Process Engineer jobs in Oregon are:

What cities in Oregon are hiring for Thin Film Process Engineer jobs?

Cities in Oregon with the most Thin Film Process Engineer job openings:

Thin Film Process Engineer jobs near you
Infographic showing various Thin Film Process Engineer job openings in Oregon as of August 2026, with employment types broken down into 1% As Needed, 77% Full Time, 19% Part Time, 2% Contract, and 1% Nights. Highlights an 91% Physical, 3% Hybrid, and 6% Remote job distribution, with an average salary of $97,289 per year, or $46.8 per hour.

Senior Thin Films Engineer

Intel Corporation

Hillsboro, OR • On-site

$113K - $156K/yr

Full-time

Medical, Retirement, PTO

Re-posted 10 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers

Job description

Job Details:
Job Description:
Organization Overview: Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes and process capability from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers.
About This Role: Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a Senior Engineer driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.
Your Mission: Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies. Operating at the nexus of Technology Development and High-Volume Manufacturing, you will drive breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes.
Key Responsibilities
Process Innovation & Excellence
  • Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules
  • Drive defectivity reduction and uniformity improvements through systematic process enhancement
  • Lead technical problem resolution and deliver solutions that meet aggressive technology node targets
  • Optimize equipment performance working with internal teams and key suppliers

Strategic Technical Leadership
  • Align technical vision with customer requirements and business objectives
  • Synthesize complex technical data to formulate and execute strategic responses
  • Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines
  • Deliver rapid execution of innovative solutions to meet challenging development timelines

Cross-Functional Partnership
  • Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups
  • Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers
  • Present technical findings effectively to diverse audiences from engineering teams to executive leadership
  • Foster in-person collaboration to accelerate decision-making and problem resolution

Industry Leadership
  • Stay current with semiconductor industry trends and emerging process technologies
  • Drive strategic initiatives that position Intel at the forefront of manufacturing innovation
  • Contribute to technology roadmaps through hands-on technical expertise and market insight

What We're Looking For
Technical Excellence
  • Results-driven professional with exceptional technical problem-solving abilities
  • Proven track record of significant accomplishments across multiple technology nodes
  • Strong analytical skills with expertise in yield improvement, performance enhancement, and variation reduction
  • Deep understanding of semiconductor manufacturing strategies, fab operations, and technology transfer

Leadership Capabilities
  • Outstanding communication skills for presenting complex technical information to varied audiences
  • Self-motivated with strong initiative and ability to navigate ambiguous technical challenges
  • Demonstrated ability to manage multiple high-priority projects under pressure while maintaining quality focus
  • Experience driving clarity in complex technical situations and leading cross-functional initiatives

Industry Expertise
  • Comprehensive knowledge of process development, materials science, and device physics
  • Ability to interpret industry trends and translate market dynamics into actionable technical strategies
  • Experience with foundry business models and customer engagement requirements
  • Proven capability to work independently while managing diverse technical assignments

Qualifications:
Minimum Qualifications
  • Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field
  • 5+ years semiconductor industry experience with strong focus on thin film deposition processes
  • Proven experience in process development, technical leadership, and manufacturing engineering
  • Extensive background working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization
  • Comprehensive fab startup experience across manufacturing, quality, RandD, and supply chain functions
  • Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems

Preferred Qualifications
  • Doctoral degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies
  • Expertise in Gate All Around (GAA) logic technologies within semiconductor foundry environments
  • Proven track record delivering customized solutions across Technology Development and HVM organizations
  • Cross-functional leadership experience managing diverse stakeholder groups
  • Semiconductor foundry experience

Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
US, Arizona, Phoenix
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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