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Thermal Simulation Jobs (NOW HIRING)

Define the thermal characterization plan and lead simulation-to-hardware correlation to a stated and tracked accuracy tolerance. * Provide thermal requirements and constraints to package layout ...

Define the thermal characterization plan and lead simulation-to-hardware correlation to a stated and tracked accuracy tolerance. * Provide thermal requirements and constraints to package layout ...

About the Role We are seeking a lead thermal simulation engineer to help accelerate the design and development of next-generation robotic systems through modeling, simulation, and analysis. You will ...

This role will be responsible for designing, analyzing and improving product-level thermal performance through simulation-driven design methodologies. The ideal candidate has hands-on experience with ...

Conduct thermal simulation and optimization using advanced tools such as FloTherm, Icepak, and Ansys CFD. * Plan and execute thermal tests, including operating environmental chambers to validate ...

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Thermal Simulation information

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How much do thermal simulation jobs pay per year?

As of Sep 10, 2026, the average yearly pay for thermal simulation in the United States is $104,528.00, according to ZipRecruiter salary data. Most workers in this role earn between $80,000.00 and $129,000.00 per year, depending on experience, location, and employer.

What is thermal simulation?

Thermal simulation is the process of using computer models to predict how heat will move through materials or systems. It helps engineers and designers understand temperature distribution, heat transfer, and cooling requirements in products such as electronic devices, buildings, or automotive components. By simulating thermal behavior, potential issues can be identified and mitigated before physical prototypes are built, saving time and resources. These simulations often use specialized software to analyze real-world conditions and optimize designs for better performance and safety.

What are the key skills and qualifications needed to thrive as a thermal simulation engineer, and why are they important?

To thrive as a Thermal Simulation Engineer, you need a solid background in mechanical or electrical engineering, heat transfer, and thermodynamics, typically supported by a relevant degree. Proficiency with simulation tools such as ANSYS, COMSOL Multiphysics, or SolidWorks Thermal Analysis, and familiarity with CAD software are crucial. Strong analytical thinking, attention to detail, and effective communication skills help in interpreting simulation results and collaborating with multidisciplinary teams. These skills and qualifications are vital for accurately predicting thermal behaviors, optimizing designs, and ensuring product reliability and safety.

What are some common challenges faced by professionals working in thermal simulation, and how can they be addressed?

Professionals in thermal simulation often encounter challenges such as accurately modeling complex systems, managing computational resources, and interpreting large sets of simulation data. To address these, it's important to use validated simulation software, collaborate closely with design and engineering teams to ensure accurate input parameters, and continuously update one's skills with the latest simulation methods. Additionally, working in multidisciplinary teams helps share expertise and improve the reliability of simulation outcomes.

What cities are hiring for Thermal Simulation jobs?

Cities with the most Thermal Simulation job openings:

What other helpful pages are available for Thermal Simulation?

Other pages related to Thermal Simulation:

Infographic showing various Thermal Simulation job openings in the United States as of September 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $104,528 per year, or $50.3 per hour.

Thermal Simulation Engineer

Palo Alto, CA โ€ข On-site

Full-time

Re-posted 6 days ago


Job description

The Role

This position owns thermal modeling for CspeedIO optical engines, from die-level power maps through cooling boundary conditions, and the correlation of those models against measured hardware.

Thermal design here is a functional requirement rather than a reliability margin. Photonic device behavior is temperature-dependent, so wavelength and channel-to-channel uniformity shift with the temperature field across the photonic IC. The assembly also contains a small-footprint, high-flux die whose temperature must be held within a narrow window, and the engine operates adjacent to a host ASIC whose dissipation we do not control. The deliverable is a defensible temperature field, not a junction temperature.

Responsibilities

Thermal modeling and architecture

  • Build and maintain thermal models of the optical engine spanning die, package, interface materials, lid, and cold plate, for air- and liquid-cooled configurations.
  • Establish the cooling boundary condition methodology and its validity limits, and quantify thermal crosstalk from adjacent high-power devices.
  • Resolve the temperature field across the photonic IC to the resolution photonic design requires, and own the resulting gradient and uniformity specifications.

Materials and interfaces

  • Define the heat extraction path for high-flux die within the assembly, die attach, and thermal interface material selection where footprint and power density are constraining.
  • Quantify the sensitivity of engine temperature to material property tolerance and assembly variation.

Correlation and design influence

  • Define the thermal characterization plan and lead simulation-to-hardware correlation to a stated and tracked accuracy tolerance.
  • Provide thermal requirements and constraints to package layout, photonic design, and electrical design during architecture definition rather than after freeze.
  • Generate reduced-order thermal models for system integrators and customers, and engage cold plate, heat sink, and thermal material suppliers.
Required Qualifications
  • MS or PhD in Mechanical Engineering, Electrical Engineering, Physics, or equivalent practical background.
  • 6+ years of thermal simulation for semiconductor packages or electronic systems, including one product carried from architecture through hardware correlation.
  • Expert proficiency in a commercial thermal or CFD tool for electronics: Ansys Icepak or Fluent, Simcenter Flotherm, Cadence Celsius, or equivalent.
  • Command of heat transfer fundamentals sufficient to defend a model rather than only to run one.
  • Demonstrated correlation of thermal simulation against measured hardware, with methodology revised on that basis.
Preferred Qualifications
  • Silicon photonics or optoelectronic thermal work, particularly thermo-optic sensitivity and wavelength stability.
  • Thermal design for small-footprint, high-flux die.
  • Direct-to-chip liquid cooling and cold plate design or specification.
  • 5D/3D package thermal modeling, and coupled electrothermal or thermal-structural workflows.
  • First-generation product experience where the thermal methodology had to be established rather than inherited.
Scope and Impact

The temperature field this position defines sets the operating envelope for the photonic IC and the thermally critical die around it, and therefore constrains link budget, tuning power, and achievable channel density. The methodology does not currently exist in a documented, correlated form.