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Temporary Finite Element Analysis Fea Engineer Jobs

Cspeed

FEA Packaging Engineer

Palo Alto, CA

The Role This position performs finite element analysis for CspeedIO optical engine packages across both thermal and structural domains. It is scoped for a strong FEA engineer: demonstrated depth in ...

System One

Senior Structural Analyst

Bellevue, WA · Remote

This role is responsible for performing structural and finite element analysis (FEA) of reactor ... Develop and maintain engineering analysis documentation and technical reports * Perform peer ...

System One

Senior Structural Analyst

Bellevue, WA · Remote

This role is responsible for performing structural and finite element analysis (FEA) of reactor ... Develop and maintain engineering analysis documentation and technical reports * Perform peer ...

System One

Senior Structural Analyst

Bellevue, WA · Remote

This role is responsible for performing structural and finite element analysis (FEA) of reactor ... Develop and maintain engineering analysis documentation and technical reports * Perform peer ...

Apple

FEA/AI Methods Engineer

San Francisco, CA · On-site

Experience in implicit and explicit finite element analysis (FEA). Attention to detail and ... S. in Mechanical Engineering, Applied Mechanics, Structural Engineering, or a similar discipline ...

Source Mantra Inc

Structural CAE Engineer

Dearborn, MI · On-site

$35 - $40/hr

Graduate-level coursework in Finite Element Analysis (FEA). * Thesis, research, or project ... M.S. in Mechanical Engineering or equivalent. * Experience with: * OptiStruct Non-Linear

Brunswick

Engineering Manager - FEA Lead

Fond Du Lac, WI · On-site

$103K - $164K/yr

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

As an Engineering Manager - Finite Element Analysis (FEA Lead) you will lead a high-performing team of analysis engineers supporting the design and development of conventional marine internal ...

Lund Boats

Engineering Manager - FEA Lead

Fond Du Lac, WI

$103K - $164K/yr

  • Medical

  • Dental

  • Vision

  • Retirement

  • PTO

As an Engineering Manager - Finite Element Analysis (FEA Lead) you will lead a high-performing team of analysis engineers supporting the design and development of conventional marine internal ...

Accord Technologies Inc.

Mechanical engineers

Irvine, CA · On-site

... FEA Engineer - Structural/Thermal Analysis * Develop finite element models for thermal and thermo-mechanical simulations. * Perform steady-state and transient thermal analyses using Finite Element ...

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Temporary Finite Element Analysis Fea Engineer information

What is the difference between Temporary Finite Element Analysis Fea Engineer vs Structural Analysis Engineer?

AspectTemporary Finite Element Analysis (FEA) EngineerStructural Analysis Engineer
CredentialsEngineering degree, FEA software certificationsEngineering degree, structural analysis certifications
Work EnvironmentDesign firms, manufacturing, aerospace, automotiveConstruction, civil engineering, infrastructure projects
Industry UsageProduct development, simulation, testingBuilding design, bridges, infrastructure safety

Both roles involve analyzing structures using engineering principles, but Temporary FEA Engineers focus on finite element simulations for product testing and design optimization, often in manufacturing or aerospace. Structural Analysis Engineers typically work on assessing the safety and stability of physical structures like buildings and bridges. While they share similar credentials and software skills, their industries and project types differ.

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Temporary Finite Element Analysis Fea Engineer jobs near you

FEA Packaging Engineer

Cspeed

Palo Alto, CA

Full-time

Posted 10 days ago

Job description

The Role

This position performs finite element analysis for CspeedIO optical engine packages across both thermal and structural domains. It is scoped for a strong FEA engineer: demonstrated depth in either thermal or mechanical analysis is expected, and the ability to work competently in the other is required.

The analysis supports package architecture decisions and qualification. Temperature governs optical wavelength and channel uniformity. Deformation and interconnect stress govern assembly yield, reliability, and optical coupling, since warpage displaces optical facets. Both sets of results terminate in the same design decisions, which is why the scope is held in one role.

Correlation against measured hardware is a standing expectation. Results are used for design sign-off, so assumptions must be documented and defensible.

Responsibilities

Thermal analysis

  • Build and maintain thermal models spanning die, package, interface materials, lid, and cold plate, and establish cooling boundary conditions and their validity limits.
  • Resolve the temperature field across the photonic IC to the resolution photonic design requires, and define the heat extraction path and interface material selection for high-flux die within the assembly.

Structural analysis

  • Predict warpage through the assembly process, and own the flatness, coplanarity, and facet planarity budgets that assembly and optical coupling depend on.
  • Analyze bump and interconnect stress, chip-package interaction, and fatigue life, supporting qualification against JEDEC or equivalent methodology.

Methodology and correlation

  • Define modeling standards and document assumptions such that results are auditable.
  • Lead correlation against measured temperature, warpage, cross-section, and reliability data, and revise methodology accordingly.

Design and supplier support

  • Provide requirements, constraints, and sign-off criteria during architecture definition rather than after design freeze.
  • Engage substrate suppliers, OSATs, and cooling and material vendors on process assumptions and measured data.
Required Qualifications
  • MS or PhD in Mechanical Engineering, Materials Science, Engineering Mechanics, or equivalent practical background.
  • 6+ years of finite element analysis for semiconductor packaging or electronic systems, including one product carried from architecture through hardware correlation.
  • Expert proficiency in one commercial FEA or CFD tool and working proficiency in a second covering the other domain - for example Ansys Mechanical or Abaqus alongside Icepak, Fluent, Flotherm, or Celsius.
  • Sound FEA fundamentals: meshing judgment, boundary condition selection, convergence, and the ability to defend a model rather than only to run one.
  • Demonstrated correlation of simulation against physical measurement, and the judgment to distinguish a modeling error from a process excursion.
  • Experience with advanced packaging construction: flip chip, 2.5D/3D, interposers, and heterogeneous integration.
Preferred Qualifications
  • Depth in nonlinear and time-dependent material behavior: creep, viscoplasticity, viscoelasticity, and fatigue.
  • Silicon photonics or optoelectronic packaging, including thermo-optic sensitivity or warpage as an optical alignment constraint.
  • Coupled thermal-structural workflows, including transfer of a computed temperature field into a structural model.
  • Direct-to-chip liquid cooling, or chip-package interaction and low-k dielectric stress.
  • Scripting for model automation and parametric studies, and design of experiments methodology.
Scope and Impact

This position provides the physics basis for package architecture decisions and qualification.

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