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Tapeout Integration Engineer Jobs (NOW HIRING)

Senior Staff Engineer, Foundry

San Diego, CA Β· On-site

$58.75 - $75.75/hr

With a strong foundation in RF integration, pSemi's product portfolio now spans power management ... Review tapeout floorplan, frame structures to ensure foundry-related test, assembly and customer ...

Foundry Engineer

Mountain View, CA Β· On-site

$180K - $212K/yr

Provide manufacturing process solutions for integrated digital/analog/photonic/laser devices * Work ... Collaborate with design and /layout team to coordinate product tapeout to foundry. Qualifications

Physical Design Engineer

Frisco, TX Β· On-site

$127K - $131K/yr

About Talent 101 Inc Talent 101 is an Engineering and IT services provider, with clients that range ... tapeout * Ability to collaborate across RTL, verification, and integration teams Talent101 pays ...

Physical Design Engineer- Senior

Austin, TX Β· On-site

$115K - $173K/yr

This role requires strong expertise in physical design flow, tapeout readiness, and Power ... integration, or related work experience. * Master's degree in Science, Engineering, or related ...

Senior Staff Engineer, Foundry

San Diego, CA Β· On-site

$58.75 - $75.75/hr

With a strong foundation in RF integration, pSemi's product portfolio now spans power management ... Review tapeout floorplan, frame structures to ensure foundry-related test, assembly and customer ...

Lead or guide tapeout readiness activities, including final signoff checks, waiver management ... Drive intake, validation, integration, and versioning of foundry rule files and process updates for ...

Product Engineer, Custom

Cambridge, MA Β· On-site +1

$90K - $180K/yr

At the core of our work is the TFLN Chiplet platform - a modular, integrated architecture designed ... You will work cross-functionally to define tapeout windows, validate design rules, and coordinate ...

Mixed-Signal Verification Engineer

San Francisco, CA Β· On-site

$160K - $195K/yr

All of which is driven by a world-class vertically integrated engineering team, spanning RF/Analog ... to-tapeout trade-off. Minimum Qualifications BS and a minimum of 10 years relevant industry ...

Mixed-Signal Verification Engineer

San Francisco, CA Β· On-site

$160K - $195K/yr

All of which is driven by a world-class vertically integrated engineering team, spanning RF/Analog ... tapeout trade-off. Minimum Qualifications Minimum requirement of a bachelors degree 2+ years of ...

Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related ... Tapeout Process * UPF Creation * CDC/RDC Checks * Design Hierarchy Integration Tools & Technologies

Showing results 41-60

Tapeout Integration Engineer information

See salary details

$44.5K

$124.3K

$173.5K

How much do tapeout integration engineer jobs pay per year?

As of Sep 13, 2026, the average yearly pay for tapeout integration engineer in the United States is $124,275.00, according to ZipRecruiter salary data. Most workers in this role earn between $104,000.00 and $140,000.00 per year, depending on experience, location, and employer.

What is a tapeout integration engineer?

A Tapeout Integration Engineer is a professional who oversees the final stages of semiconductor chip design, ensuring that all design components are correctly integrated and ready for fabrication. They coordinate the various aspects of the design flow, including physical layout, verification, and documentation, to prepare the data for manufacturing. The role requires collaboration with design, verification, and manufacturing teams to address any last-minute issues and ensure the tapeout (final design submission) is successful. This position is critical for meeting production deadlines and achieving high-quality silicon results.

What are the key skills and qualifications needed to thrive as a tapeout integration engineer?

To thrive as a Tapeout Integration Engineer, you need a solid background in semiconductor device physics, VLSI design, and process integration, typically supported by a degree in electrical engineering or a related field. Proficiency with EDA tools such as Cadence, Synopsys, and scripting languages like Python or Perl, along with familiarity with tapeout flows, is crucial. Strong problem-solving skills, attention to detail, and effective communication are important soft skills for collaborating with cross-functional teams and managing complex projects. These skills ensure precise data handoff, minimize costly errors, and enable successful delivery of silicon products on schedule.

What are the typical challenges tapeout integration engineers face during the tapeout process and how are they managed?

Tapeout Integration Engineers often encounter challenges such as last-minute design changes, tight deadlines, and coordination among cross-functional teams like design, verification, and manufacturing. Managing these challenges requires strong project management skills, attention to detail, and effective communication to ensure all design specifications are met without errors. Proactive planning, regular status meetings, and maintaining clear documentation help mitigate risks and ensure a smooth handoff to fabrication. Collaboration with both internal and external stakeholders is crucial to address issues quickly and keep the project on schedule.

What is the difference between Tapeout Integration Engineer vs Chip Design Engineer?

AspectTapeout Integration EngineerChip Design Engineer
Required CredentialsBachelor's or Master's in Electrical Engineering, VLSI, or related fields; knowledge of EDA toolsBachelor's or Master's in Electrical Engineering, VLSI, or related fields; proficiency in hardware description languages
Work EnvironmentSemiconductor fabrication facilities, EDA tool environments, collaboration with design and manufacturing teamsDesign labs, CAD environments, collaboration with verification and manufacturing teams
Industry UsageUsed in semiconductor companies during tapeout phase to ensure design integrityUsed in chip design companies during the development phase to create functional hardware

The Tapeout Integration Engineer focuses on preparing and verifying integrated chip designs for manufacturing, ensuring design data is correctly finalized for tapeout. In contrast, the Chip Design Engineer primarily develops and simulates chip architectures and logic. Both roles require similar educational backgrounds and work in overlapping environments, but their core responsibilities differ in the design versus integration phases of chip development.

What are popular job titles related to Tapeout Integration Engineer jobs?

For Tapeout Integration Engineer jobs, the most frequently searched job titles are:

Infographic showing various Tapeout Integration Engineer job openings in the United States as of September 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $124,275 per year, or $59.7 per hour.

Sr. Staff HW Engineer - ASIC Implementation

Los Gatos, CA β€’ On-site

Full-time

Re-posted 25 days ago


Key responsibilities

  • Perform and debug lint, CDC, and RDC checks, including automation and scripting.

  • Drive RTL-to-synthesis implementation flows and develop timing constraints to support timing closure.

  • Coordinate implementation activities with internal teams and external backend partners to ensure design readiness for tapeout.


Job description

About Arycs Technology 
At Arycs Technology, we believe AI infrastructure must scale within realistic power and integration limits. Our systems are engineered for deployment in real networks — not theoretical environments. We prioritize architectural efficiency over hardware multiplication, enabling capacity growth through technology innovation rather than system complexity. Performance and energy efficiency are not trade-offs; they are co-designed outcomes.
Headquartered in Los Gatos, California, with operations in Cleveland, Ohio and Maynard, Massachusetts, Arycs Technologies operates at the intersection of silicon photonics, coherent DSP, and scalable semiconductor manufacturing.
Our geographic presence supports both technology innovation and commercial execution, positioning Arycs Technologies as a key contributor to the advancement and broader adoption of coherent optical technologies.
 

Position Overview

We are seeking an experienced Staff ASIC Implementation Engineer to lead and drive digital implementation across our DSP ASIC programs. This role drives RTL integration through synthesis, timing analysis, and tapeout readiness, including evaluating and optimizing for performance, power, and area (PPA) while working with RTL and verification teams and coordinating with external backend partners responsible for place-and-route through GDS release. This is a hands-on technical leadership role, coordinating implementation efforts across small internal engineering teams and external backend partners to deliver successful first-pass silicon.

Key Responsibilities

Digital Implementation

· Perform and debug lint, CDC, and RDC checks, including development of automation and scripts to run and analyze results

· Drive RTL-to-synthesis implementation flows, including development of automation and scripts to support these flows

· Develop timing constraints (SDC) ensuring correctness and alignment with backend implementation and timing closure objectives

· Perform synthesis to support design exploration and PPA optimization

· Develop and maintain power intent specifications (UPF) and support low-power implementation

· Perform RTL power analysis and optimization, and assist with gate-level power analysis, debug, and RTL-to-gate power correlation

· Analyze timing reports to identify root causes of timing violations and drive timing closure

· Work with RTL engineers to identify and implement RTL changes required to meet timing, power, and implementation requirements

· Support and lead design readiness reviews prior to backend implementation kickoff

Backend Coordination

· Serve as the primary technical interface with external backend implementation teams

· Provide technical oversight of backend place-and-route activities and guide timing, congestion, and implementation closure strategy

· Review backend implementation metrics, timing closure progress, and physical design results

· Track and coordinate resolution of implementation issues identified during physical design

Timing Closure and Tapeout Readiness

· Support timing closure and design optimization across RTL and implementation flows

· Ensure designs meet timing, power, and integration requirements prior to tapeout

· Support final integration, signoff readiness, and tapeout preparation

Cross-Team Collaboration

· Work closely with RTL design teams, verification teams, and backend implementation vendors

· Coordinate implementation activities across small internal engineering teams and external backend partners

· Coordinate implementation activities and track engineering progress using project management tools (e.g., Jira), including organizing engineering sprints and maintaining visibility of implementation tasks across internal and external teams

· Interface with project management teams to support development and tracking of implementation schedules, including defining tasks, milestones, and resource requirements using industry-standard planning tools (e.g., Microsoft Project or similar)

· Identify, communicate, and help drive resolution of technical risks that may impact implementation schedules or tapeout readiness

Implementation Methodology and Tool Flow

· Develop and maintain digital implementation flows, automation, and supporting scripts

· Improve synthesis, timing analysis, and integration methodologies

· Collaborate with EDA vendors to resolve tool issues and improve flow efficiency

Required Qualifications

· Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field

· 10+ years of experience in ASIC digital implementation

· Strong experience with RTL-to-synthesis flows (Design Compiler, Fusion Compiler)

· Deep understanding of static timing analysis and timing closure (PrimeTime)

· Experience with low-power implementation methodologies including UPF

· Experience performing RTL power analysis and optimization (RTL Architect, PrimePower, PrimePower RTL)

· Experience debugging post-layout timing issues and guiding resolution with backend implementation teams

· Experience supporting or driving designs through successful ASIC tapeout

· Strong scripting skills (Tcl, Python) for automation and analysis of implementation flows

Preferred Qualifications

· Familiarity with place-and-route and physical design flows

· Experience working with external backend implementation vendors

· Experience with high-throughput datapath or DSP-based designs

· Familiarity with advanced technology nodes (7nm and below)

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