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Substrate Packaging Engineer Jobs (NOW HIRING)

Talking Rain

Sr. Packaging Engineer

Preston, WA · On-site

$165K - $195K/yr

As a Packaging Engineer, you will play a crucial role in the research, development and ... substrate qualifications across packaging formats. * Create, maintain, and improve packaging ...

Cspeed

FEA Packaging Engineer

Palo Alto, CA · On-site

... packages across both thermal and structural domains. It is scoped for a strong FEA engineer ... Engage substrate suppliers, OSATs, and cooling and material vendors on process assumptions and ...

Axiado

Senior IC Packaging Engineer

San Jose, CA · On-site

$122K - $168K/yr

Define substrate stack-ups, materials, bump/RDL architectures, and DFM guidelines for advanced ... packaging flows. Qualifications * BSEE or MSEE (PhD a plus) in Electrical Engineering, or related ...

TalkingRain Beverage Company

WI · On-site

$165K - $195K/yr

As a Packaging Engineer, you will play a crucial role in the research, development and ... substrate qualifications across packaging formats. * Create, maintain, and improve packaging ...

TalkingRain Beverage Company

$165K - $195K/yr

As a Packaging Engineer, you will play a crucial role in the research, development and ... substrate qualifications across packaging formats. * Create, maintain, and improve packaging ...

Meta

Silicon Packaging Technology Engineer

Sunnyvale, CA · On-site

$212K - $294K/yr

... substrate suppliers, and material suppliers to support package development activities • Influence and align OSAT and foundry partners' roadmaps with Meta's custom silicon packaging roadmap • ...

Mini--circuit

Sr. Packaging Engineer

Carlsbad, CA · On-site

$130K - $165K/yr

The Sr. Packaging Engineer is responsible for leading the development and execution of all ... substrate materials, printed circuit board manufacturing methods and techniques. * Must have ...

New

Talking Rain

Sr. Packaging Engineer

Preston, WA

$165K - $195K/yr

As aPackaging Engineer, you willplay a crucial role in the research,development and implementation ... substrate qualifications across packaging formats. * Create, maintain, and improve packaging ...

Mini-Circuits

Sr. Packaging Engineer

Carlsbad, CA · On-site

$130K - $165K/yr

The Sr. Packaging Engineer is responsible for leading the development and execution of all ... substrate materials, printed circuit board manufacturing methods and techniques. * Must have ...

Mini-Circuits

Sr. Packaging Engineer

Carlsbad, CA · On-site

$130K - $165K/yr

The Sr. Packaging Engineer is responsible for leading the development and execution of all ... substrate materials, printed circuit board manufacturing methods and techniques. * Must have ...

Mini-Circuits

Sr. Packaging Engineer

Carlsbad, CA · On-site

$130K - $165K/yr

The Sr. Packaging Engineer is responsible for leading the development and execution of all ... substrate materials, printed circuit board manufacturing methods and techniques. * Must have ...

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Substrate Packaging Engineer information

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How much do substrate packaging engineer jobs pay per hour?

As of Sep 13, 2026, the average hourly pay for substrate packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What is a substrate packaging engineer?

A Substrate Packaging Engineer is a specialist who designs, develops, and tests the substrates used in semiconductor packaging. These substrates act as the physical base that connects the silicon chip to the external circuit, playing a crucial role in electrical performance, thermal management, and overall reliability of electronic devices. Substrate Packaging Engineers work closely with materials, design, and manufacturing teams to ensure that the substrate meets technical requirements and production standards. Their expertise is vital for advancing chip technology in fields like consumer electronics, automotive, and telecommunications.

What are the key skills and qualifications needed to thrive as a substrate packaging engineer?

To thrive as a Substrate Packaging Engineer, you need a solid background in materials science, electrical engineering, and semiconductor packaging, often supported by a relevant engineering degree. Familiarity with design tools like Cadence or Mentor Graphics, simulation software, and knowledge of industry standards such as IPC are commonly required. Strong problem-solving, attention to detail, and effective communication skills help you collaborate with cross-functional teams and address complex technical challenges. These skills and qualities are crucial for ensuring optimal performance, reliability, and manufacturability of advanced electronic devices.

What are some common challenges faced by substrate packaging engineers during the product development cycle?

Substrate Packaging Engineers often encounter challenges such as balancing electrical performance with thermal management and mechanical reliability. They must collaborate closely with cross-functional teams, including design, manufacturing, and quality assurance, to address issues like material selection, signal integrity, and miniaturization. Tight project timelines and evolving customer requirements can also add complexity, requiring strong problem-solving skills and adaptability. Staying updated on the latest materials and processes is essential for success in this dynamic role.

What are popular job titles related to Substrate Packaging Engineer jobs?

For Substrate Packaging Engineer jobs, the most frequently searched job titles are:

Infographic showing various Substrate Packaging Engineer job openings in the United States as of August 2026, with employment types broken down into 94% Full Time, 2% Part Time, and 4% Contract. Highlights an 85% Physical, 5% Hybrid, and 10% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.

Principal Packaging Engineer

Sunnyvale, CA • On-site

Alpha & Omega Semiconductor
Semiconductor and Electronic Component Manufacturing • 51 - 200 employees
Learn more about Alpha & Omega Semiconductorexternal

$170K - $220K/yr

Full-time

Re-posted 9 days ago

Job description

At Alpha and Omega Semiconductor (AOS), we design, develop and globally supply a broad range of power semiconductors, including a wide portfolio of Power MOSFET, IGBT, IPM, TVS, GaN/SiC, Power IC and Digital Power products. You will find our products in everyday applications including personal computers, graphic cards, gaming consoles, TVs, home appliances, smart phones, power tools, and more! At the center of our innovation is our people who bring passion, talent, and a collaborative atmosphere to our growing company. We offer an impressive benefit package and career development opportunities. If you are ready to take the next step in your career working with a team of passionate and talented people, then take a look at the job opportunity below to POWER your career!
Overall Purpose of Position: To work with Product Lines (both Discrete and PIC and IPM) on the package developments including thermal and stress simulation for internal and external requests.
Primary Job Responsibilities/Duties:
  • Interact with Product Lines, Product Engineers and Silicon Designers in US and overseas on package design.
  • Interact with internal assembly site and external OSAT (Out Sourcing Assembly and Testing) partners on the package designs and carry out from concepts to MP
  • Interact with material suppliers, such as LF, clip, solder, mold compound and assembly tools for assembly process enhancements.

Qualifications:
  • 10+ years of experiences in Power Electronics package design (Si, GaN, SiC; LF based, substrate based)
  • MS degree and above
  • Experience in AutoCAD and SoldWorks for package designs
  • Experiences Ansys for thermal and stress simulation
  • Lead Frame (LF), design, clip design, wire bond
  • Experiences in RD concept development and novel power electronics packaging technologies
  • Experience with assembly manufacturing processes and environment (soldering, die attach, wire bonding and molding
  • Experiences in MIS substrate design and IPM design is a plus
  • Professional communication in technical subjects with internal and external groups.

Alpha and Omega Semiconductor, Inc is committed to diversity in our workplace. Qualified applicants will receive consideration for employment without regard to, and will not be discriminated against based on race, age, color, ethnicity, marital status, sex, religion, national origin, sexual orientation, gender, gender identity, disability, protected veteran status or any other category protected by federal, state or local law.

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