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Substrate Packaging Engineer Jobs (NOW HIRING)

Apple

Packaging Substrate Engineer

San Francisco, CA · On-site

You will be responsible for Apple package substrate including design, technology, manufacturing ... Proven fundamentals in material/chemistry/mechanical engineering field(s). In-depth knowledge of ...

Apple

Packaging Substrate Engineer

Bodega Bay, CA

$184K - $324K/yr

Description • Lead SoC package substrate technology development, pathfinding, and roadmap ... Proven fundamentals in material/chemistry/mechanical engineering field(s). In-depth knowledge of ...

Apple

Packaging Substrate Engineer

Bodega Bay, CA

$184K - $324K/yr

Description • Lead SoC package substrate technology development, pathfinding, and roadmap ... Proven fundamentals in material/chemistry/mechanical engineering field(s). In-depth knowledge of ...

Apple Inc.

Packaging Substrate Engineer

San Francisco, CA · On-site

$129K - $225K/yr

You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package ...

Intel

Substrate Supplier Enablement Engineer

Phoenix, AZ · On-site

$120K - $198K/yr

The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is ... Responsibilities Collaborate with suppliers and internal engineering teams to develop robust ...

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Substrate Packaging Engineer information

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How much do substrate packaging engineer jobs pay per hour?

As of Sep 13, 2026, the average hourly pay for substrate packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What is a substrate packaging engineer?

A Substrate Packaging Engineer is a specialist who designs, develops, and tests the substrates used in semiconductor packaging. These substrates act as the physical base that connects the silicon chip to the external circuit, playing a crucial role in electrical performance, thermal management, and overall reliability of electronic devices. Substrate Packaging Engineers work closely with materials, design, and manufacturing teams to ensure that the substrate meets technical requirements and production standards. Their expertise is vital for advancing chip technology in fields like consumer electronics, automotive, and telecommunications.

What are the key skills and qualifications needed to thrive as a substrate packaging engineer?

To thrive as a Substrate Packaging Engineer, you need a solid background in materials science, electrical engineering, and semiconductor packaging, often supported by a relevant engineering degree. Familiarity with design tools like Cadence or Mentor Graphics, simulation software, and knowledge of industry standards such as IPC are commonly required. Strong problem-solving, attention to detail, and effective communication skills help you collaborate with cross-functional teams and address complex technical challenges. These skills and qualities are crucial for ensuring optimal performance, reliability, and manufacturability of advanced electronic devices.

What are some common challenges faced by substrate packaging engineers during the product development cycle?

Substrate Packaging Engineers often encounter challenges such as balancing electrical performance with thermal management and mechanical reliability. They must collaborate closely with cross-functional teams, including design, manufacturing, and quality assurance, to address issues like material selection, signal integrity, and miniaturization. Tight project timelines and evolving customer requirements can also add complexity, requiring strong problem-solving skills and adaptability. Staying updated on the latest materials and processes is essential for success in this dynamic role.

What are popular job titles related to Substrate Packaging Engineer jobs?

For Substrate Packaging Engineer jobs, the most frequently searched job titles are:

Infographic showing various Substrate Packaging Engineer job openings in the United States as of August 2026, with employment types broken down into 94% Full Time, 2% Part Time, and 4% Contract. Highlights an 85% Physical, 5% Hybrid, and 10% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.

Packaging Substrate Engineer

San Francisco, CA • On-site

Apple
Computer and Electronic Product Manufacturing • 10K+ employees
Learn more about Appleexternal

Full-time

Re-posted 3 days ago

Apple rating

8.1

Company rating: 8.1 out of 10

Based on 684 frontline employees who took The Breakroom Quiz

Job description

Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.
Description
• Lead SoC package substrate technology development, pathfinding, and roadmap definition.
• Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.
• 5% International travel.
Minimum Qualifications
BS and 10+ years of relevant industry experience.
Preferred Qualifications
MS or Ph.D. and 8+ years of relevant industry experience.
Proven fundamentals in material/chemistry/mechanical engineering field(s).
In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc.
Familiarity with package assembly and integration process preferred.
Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
Exceptional technology development & project management skills.
Strong communication & collaborative skills.

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About Apple

Sourced by ZipRecruiter

Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.

Industry

Computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

Cupertino, CA, US

Year founded

1976

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