Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... chemistry/mechanical engineering field(s). In-depth knowledge of substrate technology ...
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... chemistry/mechanical engineering field(s). In-depth knowledge of substrate technology ...
Packaging Substrate Engineer
Bodega Bay, CA · On-site
$184K - $324K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... chemistry/mechanical engineering field(s). In-depth knowledge of substrate technology ...
Packaging Substrate Engineer
Bodega Bay, CA · On-site
$184K - $324K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... chemistry/mechanical engineering field(s). In-depth knowledge of substrate technology ...
Packaging Substrate Engineer
Bodega Bay, CA · On-site
$184K - $324K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... chemistry/mechanical engineering field(s). In-depth knowledge of substrate technology ...
Packaging Substrate Engineer
Bodega Bay, CA · On-site
$184K - $324K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... chemistry/mechanical engineering field(s). In-depth knowledge of substrate technology ...
Packaging Substrate Engineer
San Francisco, CA · On-site
$150 - $200/hr
... electronic packaging solutions for Apple's internal and custom external components of hardware for ... Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution ...
Packaging Substrate Engineer
San Francisco, CA · On-site
$150 - $200/hr
... electronic packaging solutions for Apple's internal and custom external components of hardware for ... Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution ...
Packaging Substrate Engineer (San Francisco)
San Francisco, CA · On-site
$181K - $318K/yr
... electronic packaging solutions for Apple's internal and custom external components of hardware for ... chemistry/mechanical engineering field(s). * In‑depth knowledge of substrate technology ...
Packaging Substrate Engineer (San Francisco)
San Francisco, CA · On-site
$181K - $318K/yr
... electronic packaging solutions for Apple's internal and custom external components of hardware for ... chemistry/mechanical engineering field(s). * In‑depth knowledge of substrate technology ...
Packaging Substrate Development Engineer
Austin, TX · On-site
$150 - $200/hr
P Proven track record in developing advanced packaging technologies at a substrate supplier, OSAT ... engineering or equivalent. This role is not eligible for Visa Sponsorship. #LI-HYBRID #LI-AP1 ...
Packaging Substrate Development Engineer
Austin, TX · On-site
$150 - $200/hr
P Proven track record in developing advanced packaging technologies at a substrate supplier, OSAT ... engineering or equivalent. This role is not eligible for Visa Sponsorship. #LI-HYBRID #LI-AP1 ...
Packaging Substrate Development Engineer
Austin, TX · On-site
$127K/yr
... leading packaging technology development for supply chain bring up of advanced substrate ... product, quality and manufacturing engineering teams to meet various milestones for ...
Packaging Substrate Development Engineer
Austin, TX · On-site
$127K/yr
... leading packaging technology development for supply chain bring up of advanced substrate ... product, quality and manufacturing engineering teams to meet various milestones for ...
Substrate Technologist
Bodega Bay, CA · On-site
$175K - $308K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in the material/chemistry/ or mechanical engineering field(s). In-depth ...
Substrate Technologist
Bodega Bay, CA · On-site
$175K - $308K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in the material/chemistry/ or mechanical engineering field(s). In-depth ...
Substrate Technologist
Bodega Bay, CA · On-site
$175K - $308K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in the material/chemistry/ or mechanical engineering field(s). In-depth ...
Substrate Technologist
Bodega Bay, CA · On-site
$175K - $308K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in the material/chemistry/ or mechanical engineering field(s). In-depth ...
Substrate Technologist
San Francisco, CA · On-site
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in the material/chemistry/ or mechanical engineering field(s). In-depth ...
Substrate Technologist
San Francisco, CA · On-site
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in the material/chemistry/ or mechanical engineering field(s). In-depth ...
Substrate Technologist
Bodega Bay, CA · On-site
$175K - $308K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in the material/chemistry/ or mechanical engineering field(s). In-depth ...
Substrate Technologist
Bodega Bay, CA · On-site
$175K - $308K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in the material/chemistry/ or mechanical engineering field(s). In-depth ...
... leading packaging technology development for supply chain bring up of advanced substrate ... product, quality and manufacturing engineering teams to meet various milestones for ...
... leading packaging technology development for supply chain bring up of advanced substrate ... product, quality and manufacturing engineering teams to meet various milestones for ...
Lead Packaging Substrate Engineer -- Roadmap & Innovation (San Francisco)
San Francisco, CA · On-site
$119K - $157K/yr
A leading technology company in San Francisco is seeking a senior professional to lead SoC package substrate technology development. The ideal candidate will have over 10 years of relevant experience ...
Lead Packaging Substrate Engineer -- Roadmap & Innovation (San Francisco)
San Francisco, CA · On-site
$119K - $157K/yr
A leading technology company in San Francisco is seeking a senior professional to lead SoC package substrate technology development. The ideal candidate will have over 10 years of relevant experience ...
Context As chip sizes increase and packaging technologies become more complex, substrate ... and EDA (Electronic Design Automation) tools, with a passion for innovation in advanced package ...
Context As chip sizes increase and packaging technologies become more complex, substrate ... and EDA (Electronic Design Automation) tools, with a passion for innovation in advanced package ...
Knowledge of electronic packaging techniques and collaboration with mechanical engineering teams to ... Knowledge of substrate materials, stack‐up creation, and packaging architectures * Experience ...
Knowledge of electronic packaging techniques and collaboration with mechanical engineering teams to ... Knowledge of substrate materials, stack‐up creation, and packaging architectures * Experience ...
Knowledge of electronic packaging techniques and collaboration with mechanical engineering teams to ... Knowledge of substrate materials, stackup creation, and packaging architectures * Experience with ...
Knowledge of electronic packaging techniques and collaboration with mechanical engineering teams to ... Knowledge of substrate materials, stackup creation, and packaging architectures * Experience with ...
Knowledge of electronic packaging techniques and collaboration with mechanical engineering teams to ... Knowledge of substrate materials, stack‐up creation, and packaging architectures * Experience ...
Knowledge of electronic packaging techniques and collaboration with mechanical engineering teams to ... Knowledge of substrate materials, stack‐up creation, and packaging architectures * Experience ...
Knowledge of electronic packaging techniques and collaboration with mechanical engineering teams to ... Knowledge of substrate materials, stackup creation, and packaging architectures * Experience with ...
Knowledge of electronic packaging techniques and collaboration with mechanical engineering teams to ... Knowledge of substrate materials, stackup creation, and packaging architectures * Experience with ...
Context As chip sizes increase and packaging technologies become more complex, substrate ... and EDA (Electronic Design Automation) tools, with a passion for innovation in advanced package ...
Context As chip sizes increase and packaging technologies become more complex, substrate ... and EDA (Electronic Design Automation) tools, with a passion for innovation in advanced package ...
Substrate/Package Layout Engineer
San Jose, CA · On-site
$150 - $200/hr
Substrate/Package Layout Engineer page is loaded## Substrate/Package Layout Engineerlocations: USA ... Deep knowledge and expertise with using Cadence layout tools and Electronic Design Automation (EDA ...
Substrate/Package Layout Engineer
San Jose, CA · On-site
$150 - $200/hr
Substrate/Package Layout Engineer page is loaded## Substrate/Package Layout Engineerlocations: USA ... Deep knowledge and expertise with using Cadence layout tools and Electronic Design Automation (EDA ...
Electronic Packaging Substrate Engineer information
See salary details
$19.71 - $24.02
2% of jobs
$24.02 - $28.32
6% of jobs
$32.42 is the 25th percentile. Wages below this are outliers.
$28.32 - $32.63
17% of jobs
$32.63 - $36.93
16% of jobs
The median wage is $39.08 / hr.
$36.93 - $41.24
16% of jobs
$41.24 - $45.54
12% of jobs
$47.59 is the 75th percentile. Wages above this are outliers.
$45.54 - $49.85
11% of jobs
$49.85 - $54.15
6% of jobs
$54.15 - $58.46
5% of jobs
$58.46 - $62.76
4% of jobs
$62.76 - $67.07
3% of jobs
$19
$42
$67
How much do electronic packaging substrate engineer jobs pay per hour?
As of Sep 9, 2026, the average hourly pay for electronic packaging substrate engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.
What does an electronic packaging substrate engineer do?
An Electronic Packaging Substrate Engineer specializes in designing and developing substrates that support and connect electronic components within devices such as semiconductors and circuit boards. They focus on materials selection, thermal management, electrical performance, and mechanical reliability of the substrate. Their role is critical in ensuring that electronic assemblies are compact, durable, and function efficiently under various operating conditions. They often collaborate with design, manufacturing, and quality teams to optimize substrate performance and cost-effectiveness.
What are the key skills and qualifications needed to thrive as an electronic packaging substrate engineer, and why are they important?
To thrive as an Electronic Packaging Substrate Engineer, you need a solid background in materials science, electrical engineering, and substrate design, typically supported by a relevant engineering degree. Familiarity with CAD tools (such as AutoCAD or Altium Designer), simulation software, and industry standards for PCB and substrate manufacturing is essential. Strong problem-solving abilities, attention to detail, and effective teamwork distinguish top performers in this field. These skills and qualities are crucial for ensuring the reliability, performance, and manufacturability of electronic devices.
What are popular job titles related to Electronic Packaging Substrate Engineer jobs?
For Electronic Packaging Substrate Engineer jobs, the most frequently searched job titles are:
Packaging Substrate Engineer
San Francisco, CA • On-site
Apple •
Computer and Electronic Product Manufacturing • 10K+ employees10,000+ employees
Full-time
Re-posted 29 days ago
Apple rating
8.1
Based on 684 frontline employees who took The Breakroom Quiz
6th of 30 rated technology retailers
Job description
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.
Description
• Lead SoC package substrate technology development, pathfinding, and roadmap definition.
• Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.
• 5% International travel.
Minimum Qualifications
BS and 10+ years of relevant industry experience.
Preferred Qualifications
MS or Ph.D. and 8+ years of relevant industry experience.
Proven fundamentals in material/chemistry/mechanical engineering field(s).
In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc.
Familiarity with package assembly and integration process preferred.
Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
Exceptional technology development & project management skills.
Strong communication & collaborative skills.
Description
• Lead SoC package substrate technology development, pathfinding, and roadmap definition.
• Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
• Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions.
• 5% International travel.
Minimum Qualifications
BS and 10+ years of relevant industry experience.
Preferred Qualifications
MS or Ph.D. and 8+ years of relevant industry experience.
Proven fundamentals in material/chemistry/mechanical engineering field(s).
In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc.
Familiarity with package assembly and integration process preferred.
Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
Exceptional technology development & project management skills.
Strong communication & collaborative skills.
About Apple
Sourced by ZipRecruiter
Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.
Industry
Computer and electronic product manufacturing
Company size
10,000+ Employees
Headquarters location
Cupertino, CA, US
Year founded
1976