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Electronic Packaging Substrate Engineer Jobs (NOW HIRING)

Broadcom Inc.

$141K - $226K/yr

Broadcom OSD is looking for an IC Substrate and Package/Interposer Layout Engineer. In the role ... Deep knowledge and expertise with using Cadence layout tools and Electronic Design Automation (EDA ...

Mercury Systems

Senior Substrate Layout Engineer

Phoenix, AZ · On-site

$97K - $134K/yr

Knowledge of electronic packaging techniques and collaboration with mechanical engineering teams to ... Knowledge of substrate materials, stack-up creation, and packaging architectures * Experience with ...

Broadcom

Substrate/Package Layout Engineer

San Jose, CA · On-site

$141K - $226K/yr

Broadcom OSD is looking for an IC Substrate and Package/Interposer Layout Engineer. In the role ... Deep knowledge and expertise with using Cadence layout tools and Electronic Design Automation (EDA ...

Moog, Inc.

Eng., Sr. Electronic Packaging

Santa Barbara, CA · On-site

$135K - $165K/yr

We are seeking a Senior Mechanical Design / Electronics Packaging Engineer to develop ruggedized electronic hardware for military ground vehicle applications. In this role you will collaborate with ...

Moog

Eng., Sr. Electronic Packaging

Santa Barbara, CA · On-site

$135K - $165K/yr

Eng., Sr. Electronic Packaging Reporting To: Head, Engrg. Sect. Work Schedule: Onsite - Santa ... Our experienced team of systems, software, mechanical, and electrical engineers collaborates to ...

Google

Package Design Engineer

Sunnyvale, CA · On-site

$159K/yr

... substrate designs of advanced (2.5D/3.5D) packaging technologies for ML chips. This involves collaborating with SI/PI, Thermal/Mechanical, Assembly, and PCB engineers to create complex, high ...

Intel

EMIB-T Substrate Yield Lead

Phoenix, AZ · On-site

$17.75 - $23.75/hr

Hands-on experience in substrate, advanced packaging, or semiconductor yield engineering, including statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology ...

Apple

IC Package Design Engineer

Los Angeles, CA · On-site

$146K/yr

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability ...

Apple

IC Package Design Engineer

Austin, TX · On-site

$134K/yr

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability ...

Oclaro

Engineers in this role will define and deliver mechanical package solutions from early concept and ... Prior experience developing optoelectronic or high-speed electronic products for data center, AI ...

black.ai

Substrate IC Package Design Engineer

Tempe, AZ · On-site

$130K - $160K/yr

Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by ... Engineering, or a related field * 5+ years of experience in substrate IC package design for high ...

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Electronic Packaging Substrate Engineer information

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How much do electronic packaging substrate engineer jobs pay per hour?

As of Sep 9, 2026, the average hourly pay for electronic packaging substrate engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What does an electronic packaging substrate engineer do?

An Electronic Packaging Substrate Engineer specializes in designing and developing substrates that support and connect electronic components within devices such as semiconductors and circuit boards. They focus on materials selection, thermal management, electrical performance, and mechanical reliability of the substrate. Their role is critical in ensuring that electronic assemblies are compact, durable, and function efficiently under various operating conditions. They often collaborate with design, manufacturing, and quality teams to optimize substrate performance and cost-effectiveness.

What are the key skills and qualifications needed to thrive as an electronic packaging substrate engineer, and why are they important?

To thrive as an Electronic Packaging Substrate Engineer, you need a solid background in materials science, electrical engineering, and substrate design, typically supported by a relevant engineering degree. Familiarity with CAD tools (such as AutoCAD or Altium Designer), simulation software, and industry standards for PCB and substrate manufacturing is essential. Strong problem-solving abilities, attention to detail, and effective teamwork distinguish top performers in this field. These skills and qualities are crucial for ensuring the reliability, performance, and manufacturability of electronic devices.

What are popular job titles related to Electronic Packaging Substrate Engineer jobs?

For Electronic Packaging Substrate Engineer jobs, the most frequently searched job titles are:

Substrate/Package Layout Engineer

San Jose, CA • On-site

Broadcom, Inc.
Semiconductor and Electronic Component Manufacturing • 10K+ employees
Learn more about Broadcom, Inc.external

$141K - $226K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 23 days ago

Broadcom rating

8.7

Company rating: 8.7 out of 10

Based on 23 frontline employees who took The Breakroom Quiz

19th of 162 rated electronics manufacturers

Job description

Please Note:
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Job Description:
Broadcom OSD is looking for an IC Substrate and Package/Interposer Layout Engineer. In the role, you will have primary responsibility for the layout, routing, and functionality of packages and substrates, including design of high-speed lines. Expertise with design tools, such as Calibre/Klayout and Cadence tools (e.g. Allegro Package Design, Innovus, and Virtuoso) is required.
In this role you will work closely with other core members of the design team, mechanical engineers, electrical engineers, power/signal integrity engineers, and project managers. Peer reviews of substrate/package designs is also an important element of the role. You will work with substrate/package vendors to define layout/panel/stack-up design and other specifications. In addition to the front end layout work, you will also help evaluate the parts when they come back from the fab. This includes visual inspection, electrical functionality, and characterization of the high speed electrical lines.
Responsibilities:
  • Design and layout advanced substrates and IC packages
  • Develop and utilize a script-based layout tools.
  • Collaborate with design and verification teams to ensure layout meets specifications and performance requirements.
  • Perform design rule checking (DRC) and layout vs schematic (LVS) check.
  • Contribute to the development and improvement of layout methodologies and flows

Job requirements:
  • Bachelors degree in Material Science/ Electrical/ Computer/Mechanical Engineering or related science/engineering degree with at least 12 years experience.
  • Or Masters degree and 10+ years of related experience or PhD and 7+ years of related experience
  • Deep knowledge and expertise with using Cadence layout tools and Electronic Design Automation (EDA) tools.
  • Broad understanding of multilayer high speed rf-design, package/substrate manufacturing processes and materials, and surface mount technology,
  • Simulations of designs and improvement suggestions.

Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $141,300 - $226,000.
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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