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Substrate Engineer Jobs in Georgia (NOW HIRING)

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA ... Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related ...

Falcomm

Senior IC Packaging Designer

Atlanta, GA

$98K - $104K/yr

Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA ... Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related ...

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA ... Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related ...

IHG Hotels & Resorts

VP, AI Knowledge Engineering

Atlanta, GA · On-site

$176K - $227K/yr

The Role The Vice President, AI Knowledge Engineering will lead the design and delivery of the knowledge substrate on which every AI product in the enterprise depends - the ontologies that define our ...

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Substrate Engineer information

What are some common challenges Substrate Engineers face when working on high-density interconnect (HDI) designs?

Substrate Engineers often encounter challenges related to managing signal integrity, thermal performance, and miniaturization when working with HDI designs. Balancing the need for dense routing with electrical performance can be complex, especially as device sizes shrink and layer counts increase. Collaboration with PCB designers, materials scientists, and manufacturing teams is crucial to address these issues and ensure the substrate meets both design and production requirements. Keeping up with evolving technologies and industry standards is also essential for success in this role.

What engineers make $300,000 a year?

Senior engineers in specialized fields such as software engineering, petroleum engineering, and aerospace engineering can earn $300,000 or more annually, especially with extensive experience, advanced skills, and in high-demand industries. Roles involving leadership, complex technical expertise, or working in lucrative markets tend to have higher compensation levels.

What are the 7 types of engineers?

Engineers are typically categorized into various disciplines based on their specialization, including civil, mechanical, electrical, chemical, software, aerospace, and industrial engineering. Substrate engineers, a specialized role in semiconductor manufacturing, focus on designing and developing substrate materials used in electronic devices. Understanding different engineering types helps in identifying the skills and tools relevant to each field, which can be important for career development and job opportunities.

Are materials engineers in high demand?

Materials engineers, including those working as substrate engineers, are in high demand due to the growth of electronics, semiconductor, and advanced manufacturing industries. They often require knowledge of materials properties, testing, and industry standards, with employment prospects driven by technological innovation and manufacturing needs.

What is a Substrate Engineer?

A Substrate Engineer is a professional who specializes in designing, developing, and optimizing the underlying frameworks, often referred to as substrates, for electronic devices or software platforms. In the context of electronics, they work with materials and technologies that form the physical base for circuits and chips, ensuring performance, reliability, and manufacturability. In software, especially blockchain, a Substrate Engineer focuses on building and customizing blockchains using the Substrate framework, handling core logic, consensus, and runtime modules. Their role is crucial for creating robust and scalable systems tailored to specific application requirements.

What engineers make $500,000 a year?

Highly experienced engineers in specialized fields such as software engineering, data engineering, or systems architecture can earn $500,000 or more annually, especially in senior or executive roles at large technology companies. These positions often require advanced skills, certifications, and extensive industry experience, and may include bonuses, stock options, or profit sharing as part of compensation packages.

What is the difference between Substrate Engineer vs Semiconductor Process Engineer?

AspectSubstrate EngineerSemiconductor Process Engineer
CredentialsBachelor's or Master's in Materials Science, Electrical Engineering, or related fieldsBachelor's or Master's in Electrical Engineering, Chemical Engineering, or related fields
Work EnvironmentResearch labs, fabrication facilities, semiconductor manufacturing plantsCleanrooms, fabrication facilities, process development labs
Industry UsageSemiconductor manufacturing, electronics, integrated circuitsSemiconductor fabrication, chip production, process optimization
Common Search/ComparisonYesYes

Substrate Engineers focus on developing and optimizing the materials and layers used in semiconductor devices, while Semiconductor Process Engineers work on the overall manufacturing processes to produce chips efficiently. Both roles require similar educational backgrounds and often collaborate within the semiconductor industry, but their specific responsibilities differ in scope and focus.

What are the key skills and qualifications needed to thrive as a Substrate Engineer, and why are they important?

To thrive as a Substrate Engineer, you need a strong background in materials science, semiconductor fabrication, and electrical engineering, often supported by a relevant engineering degree. Familiarity with industry-standard design tools like Cadence or Mentor Graphics, as well as experience with substrate modeling, PCB design, and analysis software, is typically required. Excellent problem-solving skills, attention to detail, and effective communication are crucial soft skills for collaborating across multidisciplinary teams. These qualifications are essential for ensuring high-quality, reliable substrate designs that meet performance, manufacturability, and cost requirements in advanced electronics manufacturing.
What are popular job titles related to Substrate Engineer jobs in Georgia? For Substrate Engineer jobs in Georgia, the most frequently searched job titles are:
What job categories do people searching Substrate Engineer jobs in Georgia look for? The top searched job categories for Substrate Engineer jobs in Georgia are:
What cities in Georgia are hiring for Substrate Engineer jobs? Cities in Georgia with the most Substrate Engineer job openings:
Substrate Engineer jobs near you

Dielectric and Polymer Materials Engineer

Absolics Inc

Covington, GA

$100K - $150K/yr

Other

Medical, Dental, Vision, Life, Retirement, PTO

Posted 12 days ago

Job description

Job Title: R&D Engineer - Dielectric and Polymer Materials Expert for Advanced Packaging applications

Location: Covington, GA

Job Type: Full-Time

 

About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.

Job Description:

You will lead efforts to evaluate, down select and integrate the various Advanced Packaging Organic and Polymeric materials critical to advanced packaging process flows, with responsibility spanning material selection, film deposition or lamination, patterning, and cure characterization. In addition, you will oversee evaluation of material performance with respect to reliability testing and collaborate with downstream assembly teams to understand incoming assembly. Requirements. This role requires both materials science depth and process integration awareness. You will evaluate both emerging and established dielectric systems and drive their optimization across electrical, mechanical, and reliability dimensions.

 

Key Responsibilities:

  • Characterize dielectric film properties (electrical, thermal, mechanical) and correlate to process and reliability outcomes
  • Select, qualify, and support process window definition of advanced packaging dielectrics (example ABF, PBO, PSPI, polyimide, inorganic films) for RDL build-up
  • Support determination of optimal processing conditions for these materials across the various process teams critical to the overall fabrication process flow
  • Evaluate emerging dielectric materials and technologies (e.g., low-Dk/Df, glass core compatible systems) for roadmap fit
  • Develop and optimize cure, lamination, or photopatterning sequences for novel dielectric layers being tested
  • Investigate and resolve adhesion, delamination, cracking, or CTE-mismatch failures through materials and process analysis
  • Run reliability qualification testing (HAST, TCT) and interpret dielectric-driven failure mechanisms

Required Skills:

  • Hands-on experience evaluating, processing and/or successful qualification of two or more advanced packaging dielectrics, example ABF, PBO, PSPI, PID, Solder resist or BCB
  • Deep knowledge of dielectric patterning approaches: photoexposure, develop, and cure sequences for photosensitive materials; or lamination and laser drill for non-photosensitive films
  • Extensive experience with film characterization: ellipsometry, FTIR, TGA/DSC, profilometry, nanoindentation
  • Understanding of dielectric-to-metal adhesion, CTE mismatch, and stress management in multilayer stacks
  • Experience with electrical characterization of dielectric films (Dk, Df, leakage, breakdown voltage)
  • Ability to execute reliability testing per JEDEC standards (HAST, uHAST, TCT) and interpret failure mechanisms
  • Fluent in English; proficiency in Korean is a plus.

Preferred Skills

  • Direct experience with glass core or glass interposer dielectric process integration
  • Deep Familiarity with low-Dk/low-Df materials targeting high-frequency and AI/HPC applications
  • Knowledge of plasma-enhanced CVD or PVD inorganic dielectrics for thin-film packaging
  • Experience with CMP of dielectric films in damascene or hybrid bonding contexts
  • Background in failure analysis of dielectric delamination, cracking, or via integrity (FIB-SEM, TEM, laminography)
  • Familiarity with JEDEC and IPC qualification standards for substrate dielectrics
  • Track record of material supplier engagement and collaborative efforts for material testing and qualification
  • Publication record or patent activity in dielectric materials for packaging is a plus

Education

  • Ph.D. in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or related field preferred
  • M.S. with 3+ years of relevant industry or research experience considered

Benefits: 

  • 401K 6% matching (NO vesting period)
  • Healthcare 100% support (Health, Dental, Vision)
  • Life, STD, LTD 100 % support
  • Cell phone allowance
  • PTO and self-development

SALARY:

  • $100,000 - $150,000

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