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Signal Integrity Engineer Jobs in Illinois (NOW HIRING)

Shure

Engineer II, Audio Electronics Design

Niles, IL · On-site

As an Engineer II, Audio Electronics Design , you will contribute to the design, development ... Perform circuit verification, system/subsystem testing, power verification, signal integrity checks ...

Shure

Engineer II, Audio Electronics Design

Niles, IL · Hybrid

As an Engineer II, Audio Electronics Design , you will contribute to the design, development ... Perform circuit verification, system/subsystem testing, power verification, signal integrity checks ...

Shure

Engineer II, Audio Electronics Design

Niles, IL · Hybrid

As an Engineer II, Audio Electronics Design , you will contribute to the design, development ... Perform circuit verification, system/subsystem testing, power verification, signal integrity checks ...

Shure

Engineer II, Audio Electronics Design

Niles, IL · Hybrid

As an Engineer II, Audio Electronics Design , you will contribute to the design, development ... Perform circuit verification, system/subsystem testing, power verification, signal integrity checks ...

Federal Signal

Engineer II - Mechanical

Crete, IL

$68K - $98K/yr

Federal Signal is seeking a driven and innovative Mechanical Engineer II to join our engineering ... Perform and interpret FEA to ensure structural integrity and product reliability * Develop, execute ...

Federal Signal

Engineer II - Mechanical

University Park, IL · On-site

$68K - $98K/yr

Federal Signal is seeking a driven and innovative Mechanical Engineer II to join our engineering ... Perform and interpret FEA to ensure structural integrity and product reliability * Develop, execute ...

Federal Signal

Engineer II - Mechanical

University Park, IL · On-site

$68K - $98K/yr

Federal Signal is seeking a driven and innovative Mechanical Engineer II to join our engineering ... Perform and interpret FEA to ensure structural integrity and product reliability * Develop, execute ...

Hyve Solutions

Hardware Design Engineer

Oregon, IL · Hybrid

$99K - $135K/yr

Hyve Company Overview Hyve Solutions transforms complex engineering challenges into production ... Knowledge of power delivery fundamentals and basic signal integrity concepts. * Strong analytical ...

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All JobsSignal Integrity Engineer JobsSignal Integrity Engineer Jobs in Illinois

Signal Integrity Engineer information

See Illinois salary details

$123.6K

$163.3K

How much do signal integrity engineer jobs pay per year?

As of Aug 7, 2026, the average yearly pay for signal integrity engineer in Illinois is $161,153.00, according to ZipRecruiter salary data. Most workers in this role earn between $161,800.00 and $161,800.00 per year, depending on experience, location, and employer.

What is the difference between Signal Integrity Engineer vs RF Engineer?

AspectSignal Integrity EngineerRF Engineer
Required CredentialsBachelor's or Master's in Electrical Engineering, certifications like IEEEBachelor's or Master's in Electrical Engineering, RF-specific certifications
Work EnvironmentDesign labs, simulation software, PCB testingTesting labs, antenna design, RF measurement equipment
Industry UsageHigh-speed digital design, PCB layout, signal analysisWireless, telecommunications, radar systems

While both roles require electrical engineering knowledge, Signal Integrity Engineers focus on maintaining signal quality in digital systems, whereas RF Engineers specialize in radio frequency systems and wireless communication. The roles often overlap in industries like telecommunications and electronics, but their core responsibilities and tools differ.

What are the key skills and qualifications needed to thrive as a signal integrity engineer?

To thrive as a Signal Integrity Engineer, you need a deep understanding of electrical engineering principles, high-speed circuit design, and electromagnetic compatibility, typically supported by a relevant engineering degree. Familiarity with simulation tools such as HyperLynx, HFSS, and SPICE, as well as PCB layout software and signal measurement instruments, is essential. Strong analytical thinking, problem-solving skills, and effective communication enable collaboration with multidisciplinary teams and interpretation of complex data. These skills are crucial to ensuring reliable, high-performance electronic systems and preventing costly design errors.

What does a signal integrity engineer do?

A signal integrity engineer works within electronics engineering. You design circuit boards and electrical systems. Your responsibilities include finding solutions to problems surrounding electrical current delivery in various devices. Other duties involve creating pathways for current to travel through circuitry. As a signal integrity engineer, you work to keep current free from interference and reflections to provide the highest quality of current to a device or piece of equipment. Using superior troubleshooting skills, you identify design problems and develop solutions.

What are some common challenges signal integrity engineers face when working on high-speed PCB designs?

Signal Integrity Engineers often encounter challenges such as minimizing crosstalk, managing electromagnetic interference (EMI), and ensuring signal quality over long trace lengths or high-frequency applications. They must collaborate closely with hardware designers, PCB layout engineers, and test teams to address these issues early in the design process. Staying updated with evolving standards and simulation tools is essential, as is troubleshooting problems that arise during prototyping and validation phases.

What does a signal integrity engineer do?

A Signal Integrity Engineer is responsible for ensuring that electrical signals in high-speed circuits and systems maintain their quality and integrity as they travel through various components and interconnections. They analyze and address issues like signal loss, noise, crosstalk, and timing errors that can degrade performance in electronic devices, such as computer motherboards, communication systems, and data centers. Their work involves simulation, measurement, and troubleshooting to optimize designs and ensure reliable operation of complex electronic systems.
More about Signal Integrity Engineer jobs
What are the most commonly searched types of Signal Integrity Engineer jobs in Illinois? The most popular types of Signal Integrity Engineer jobs in Illinois are:
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What job categories do people searching Signal Integrity Engineer jobs in Illinois look for? The top searched job categories for Signal Integrity Engineer jobs in Illinois are:
What cities in Illinois are hiring for Signal Integrity Engineer jobs? Cities in Illinois with the most Signal Integrity Engineer job openings:
What are popular job titles related to Signal Integrity Engineer jobs in IL? For Signal Integrity Engineer jobs in IL, the most frequently searched job titles are:
Signal Integrity Engineer jobs near you
Infographic showing various Signal Integrity Engineer job openings in Illinois as of August 2026, with employment types broken down into 60% Full Time, and 40% Contract. Highlights an 60% In-person, and 40% Hybrid job distribution, with an average salary of $161,153 per year, or $77.5 per hour.

Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal

Eliyan

Mundelein, IL

Full-time

Re-posted 21 days ago

Job description

Join the leading chiplet interconnect startup! We are seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join our advanced packaging team. You will develop comprehensive thermal and electrical simulations for next-generation semiconductor packaging solutions, including 2.5D/3D IC integration, chiplet-based systems, and advanced heterogeneous integration technologies. This role is critical in enabling high-performance computing, AI accelerators, and advanced chiplet architectures. We offer a fun work environment with excellent benefits. ONSITE M-F
Key Responsibilities:
  •  Develop detailed thermal models for 2.5D/3D IC packages, chiplets, and multi-die systems; perform steady-state and transient thermal analysis with hotspot identification
  • Execute power integrity (PI) and IR drop analysis; optimize power distribution networks (PDN) and power delivery architectures
  • Conduct electromigration (EM) and reliability analysis for interconnects, bumps, TSVs, and redistribution layers (RDL)
  • Develop chip-package co-simulation workflows using industry-standard EDA tools (ANSYS RedHawk\u0002SC, RHSC-ET, SIwave, Cadence Sigrity/Clarity)
  • Create hierarchical compact macro models (CMM) and reduced-order thermal models for early\u0002stage design optimization
  • Automate simulation workflows using Python, TCL, and Shell scripting; build design space exploration tools
  • Collaborate with silicon design, package design, and manufacturing teams on design-for-reliability (DFR) initiatives
  • Support customer engagements with technical analysis and present findings to stakeholders
Minimum Qualifications:
  •  
Education:
  • PhD in Electrical/Mechanical Engineering, or related field with focus on thermal management, power delivery, or electronic packaging (Master's with 5+ years experience considered)
  • Strong academic background in power integrity, signal integrity, and thermal management for advanced packaging
 
Technical Skills: 
  • Expert proficiency in: ANSYS RedHawk-SC, RHSC Electrothermal, Totem, PathFinder, SIwave, HFSS, Q3D; Cadence Voltus, Sigrity, Clarity; Synopsys RedHawk Fusion, PrimeTime, ICC2
  • Experience with physical design tools (Cadence Innovus, Synopsys ICC2, Siemens Calibre) and RTL\u0002to-GDSII flows
  • Strong programming/scripting: Python, C/C++, Tcl, Shell (bash); Verilog/VHDL/SystemVerilog for verification
  • Knowledge of advanced packaging: 2.5D/3D ICs (CoWoS, InFO, EMIB), chiplets, TSVs, interposers, FOWLP, RDL design
 
Domain Expertise:  
  • Deep understanding of EM/IR analysis, power integrity, thermal physics, and electrothermal co\u0002simulation
  • Expertise in heat transfer principles (conduction, convection, radiation), thermal material properties, and CTE mismatch
  • Knowledge of chiplet standards (UCIe and BoW), die-to-die interfaces, and wafer-scale integration
  • Hands-on experience with semiconductor package thermal/electrical analysis and tape-outs 
Ideal Qualifications:
  • Familiarity with machine learning applications in EDA and design optimization
  • Experience with HPC, AI/ML accelerator packaging, or co-packaged optics (CPO)
  • Background in reliability testing (thermal cycling, HTOL, THB) and measurement correlation
What we are looking for:
  • Strong analytical mindset with expertise across multiple physics domains (thermal, electrical, mechanical)
  • Excellent communication skills to present complex technical concepts to diverse audiences
  • Cross-functional collaboration abilities to work with silicon, package, product, and manufacturing teams
  • Self-motivated professional who thrives in fast-paced environments with minimal supervision
  • Continuous learner staying current with emerging technologies; innovation-driven with creative problem-solving
  • Results-oriented engineer delivering high-quality work to enable product milestones on schedule

We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.