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Sigma Packaging Jobs (NOW HIRING)

Six Sigma Project Manager Location: DeKalb, IL Job Type: Contract (8 Months) Compensation: $55-60 ... package to eligible employees that will allow you to choose the best coverage to meet your family ...

Lean Six Sigma Champion

Mount Pleasant, WI · On-site

$76K - $102K/yr

Lean Six Sigma Champion Department: Supporting Quality Employment Type: Full Time Location: SMC ... Comprehensive benefits package including medical, dental, and vision insurance coverage. * Basic ...

Six Sigma/Design for Six Sigma experience, and/or knowledge of Process Excellence tools. * Working knowledge of SolidWorks or other packaging CAD programs (e.g., TOPS, CREO). * Experience with ...

Package Engineering degree preferred. Minimum of three years of experience working in industry ... The ability to apply Six Sigma and/or lean tools is an asset. Professional judgment to generate ...

Packaging Engineer

Huntington Beach, CA · On-site

$120K - $127K/yr

Apply Lean and Six Sigma methodologies to improve sterilization cycle efficiency and packaging process repeatability * Maintain BOMs, work instructions, process flow charts, and technical reports for ...

Skills in Six Sigma, Continuous Improvement, and Lean Manufacturing methodologies. Ideal Backgrounds: * Food & Beverage Manufacturing * Dairy Processing * Consumer Packaged Goods (CPG) * Beverage ...

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Sigma Packaging information

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How much do sigma packaging jobs pay per hour?

As of Jun 5, 2026, the average hourly pay for sigma packaging in the United States is $16.95, according to ZipRecruiter salary data. Most workers in this role earn between $14.42 and $17.79 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Packaging Machine Operator at Sigma Packaging, and why are they important?

To thrive as a Packaging Machine Operator at Sigma Packaging, you need mechanical aptitude, attention to detail, and a high school diploma or equivalent. Familiarity with automated packaging machinery, basic computer skills, and experience with quality control systems are typically required. Strong problem-solving abilities, teamwork, and good communication skills help operators adapt to production demands and minimize downtime. These competencies ensure efficient operation, product quality, and safety in a fast-paced manufacturing environment.

What are some common challenges faced by professionals working in Sigma Packaging roles, and how can they be addressed?

Professionals in Sigma Packaging roles often encounter challenges such as managing tight production deadlines, ensuring quality control, and adapting to rapidly changing client requirements. Effective communication with cross-functional teams—such as engineering, quality assurance, and logistics—is key to overcoming these hurdles. Staying organized, being proactive in addressing potential bottlenecks, and continuously updating technical skills can help professionals thrive in this dynamic environment.

What is Sigma Packaging?

Sigma Packaging refers to a company that specializes in the manufacturing, distribution, and supply of packaging materials and solutions. They provide a wide range of packaging products used in various industries, including food, beverage, pharmaceuticals, and consumer goods. Sigma Packaging often offers both standard and customized packaging options to meet the specific needs of their clients. Their services may include design consultation, product sourcing, and logistics support to ensure efficient packaging and delivery. As a result, Sigma Packaging plays a crucial role in helping businesses protect, store, and transport their products safely and effectively.

What is the difference between Sigma Packaging vs Packaging Technician?

AspectSigma PackagingPackaging Technician
Required CredentialsHigh school diploma or equivalent; experience in packaging processesHigh school diploma or equivalent; technical training preferred
Work EnvironmentManufacturing or production facilities, often in shiftsManufacturing plants, warehouses, or production lines
Employer & Industry UsagePackaging companies, manufacturing plantsFactories, distribution centers, packaging companies
Common Search & ComparisonYesYes

Both Sigma Packaging and Packaging Technicians work in manufacturing environments focused on packaging products. While Sigma Packaging roles often involve overseeing packaging processes and quality control, Packaging Technicians focus on operating packaging machinery and ensuring proper packaging procedures. The credentials and work environments are similar, making these roles closely related but with different focus areas within the packaging industry.

More about Sigma Packaging jobs
Infographic showing various Sigma Packaging job openings in the United States as of May 2026, with employment types broken down into 97% Full Time, 1% Contract, and 2% Nights. Highlights an 93% Physical, 3% Hybrid, and 4% Remote job distribution, with an average salary of $35,259 per year, or $17 per hour.
Semiconductor Packaging Engineer

Semiconductor Packaging Engineer

Sigma Design

Redmond, WA • On-site

$115K - $145K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Posted 19 days ago


Job description

Semiconductor Packaging Engineer
Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production services to diverse clients around the globe. Sigma Design believes in hiring, developing, and recognizing the best. We offer competitive compensation, a 401(k) with up to 4% company match, quarterly bonus program, 15-days of accrued PTO and 9 company paid holidays. In addition, Sigma Design has multiple options for medical insurance and dental insurance. We also offer voluntary benefits: vision, long-term disability, and life insurance.
Position Details:
  • This position will be In-Office
  • $115,000 - $140,000 annually
  • This is a contract position with an expected duration of 12 months and the opportunity to be extended.

Primary Function:
The Semiconductor Packaging Engineer is responsible for developing, executing, and optimizing semiconductor and advanced packaging assembly and integration processes. This role supports the design, fabrication, and validation of advanced electronic packaging solutions for heterogeneous, flexible, and stretchable electronic systems, while collaborating across research, hardware, and manufacturing teams to improve device performance, reliability, and scalability.
Essential Job Functions - Responsibilities:
  • Lead assembly and integration engineering efforts with emphasis on Surface Mount Technology (SMT), Die Bond/Wire Bond processes, and support activities related to molding, laser fabrication, panel or wafer lamination, and component thinning, planarization, and dicing.
  • Develop and implement advanced packaging solutions to enable heterogeneous, flexible, and stretchable integration of electronic components and devices.
  • Design and oversee internal, external, and hybrid manufacturing workflows to accelerate development, integration, and scale-up of advanced electronic packaging technologies.
  • Develop new methods and processes to close technology gaps, improve device performance, and increase manufacturing yield through process innovation and optimization.
  • Design and execute experiments (DOE), analyze experimental results, and apply findings to improve packaging processes, device performance, and yield.
  • Execute hands-on fabrication workflows using advanced packaging and assembly equipment, identify in-line process issues, and propose solutions or workarounds to improve manufacturing performance.
  • Collaborate closely with researchers, hardware engineers, system integration teams, and external manufacturing partners to support the development and production of advanced electronic packaging solutions.
  • Support the development and use of high-performance electronic materials in advanced packaging environments.
  • Contribute to instrumentation development, process characterization, mechanical or layout design, and data analysis methods used in hardware research and development environments.
  • Follow Business Technology policies to protect sensitive data and reduce information security occurrences.

Education and Experience: (Knowledge, Skills, & Abilities)
  • Bachelor's degree in Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Applied Physics, Materials Science, or related technical field or equivalent professional experience required
  • Minimum of 1+ years of relevant work experience in semiconductor manufacturing, advanced packaging, or related electronics manufacturing environments preferred
  • Strong background in semiconductor or advanced packaging processes, including wafer-level or panel-level manufacturing
  • Hands-on experience working with semiconductor assembly and packaging equipment
  • Experience designing and executing Design of Experiments (DOE), analyzing results, and optimizing manufacturing yield
  • Experience collaborating across research and development, hardware engineering, and manufacturing teams
  • Strong analytical, troubleshooting, and problem-solving skills with an innovation and scalability mindset
  • Experience with advanced packaging technologies such as Flexible Printed Circuits (FPC), Printed Circuit Board Assembly (PCBA), 2.5D/3D integration, or related electronic packaging technologies
  • Experience working with back-end-of-line (BEOL) and advanced packaging processes including technologies such as thinning, grinding, dicing, soldering, eutectic bonding, electrochemical deposition or metal finishing, through-silicon vias (TSV), flip-chip bonding, wire or die bonding, bumping, thermocompression bonding, copper pillar bonding, hybrid bonding, underfill processes, and overmolding or encapsulation
  • Experience handling and integrating thinned electronic components as part of advanced packaging workflows
  • Demonstrated success developing or maturing hardware research processes including instrumentation, characterization, mechanical or layout design, and/or advanced data analysis techniques
  • Experience developing or applying high-performance electronic materials in semiconductor or advanced packaging environments
  • Experience with advanced packaging domains including Flexible Printed Circuits (FPC), Multi-Chip Modules (MCM), System-in-Package (SiP), 2.5D/3D integration, Flexible Hybrid Electronics (FHE), or similar technologies preferred
  • Experience performing reliability testing and failure analysis including die or ball shear testing, wire pull testing, X-ray inspection, C-SAM inspection, thermal cycling, and environmental testing preferred
  • Experience with wearable technologies or technical soft goods preferred
  • Experience with hermetic or MEMS packaging, thermal management materials, or injection/transfer molding processes preferred
  • Experience using Finite Element Analysis (FEA) modeling or simulation tools to accelerate design and prevent failures preferred
  • Experience in System-in-Package (SiP) or Multi-Chip Module (MCM) design, manufacturing, and validation preferred
  • Experience with signal integrity or power integrity simulation tools (e.g., HFSS) and validation preferred
  • Strong written and verbal English language communication skills
  • Excellent teamwork/interpersonal skills and the ability to communicate effectively
  • Demonstrated ability to work collaboratively, both within and outside one's own work group
  • Demonstrate commitment and adherence to Sigma Design Core Values
  • Pass a post-offer background verification

Work Environment
Standard office environment with normal amounts of office related conditions. Occasionally may be required to work in environmental conditions that emulate typical user environments in order to facilitate design testing and validation. Occasionally may be required to travel as required to other facilities, clients, or suppliers.
SigmaDesign is an Equal Opportunity Employer