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Sic Power Engineer Jobs in Utah (NOW HIRING)

Navitas Semiconductor

Lead the development and execution of the SiC power module technology roadmap supporting high ... Partner with Product Engineering, Device Engineering, Test Engineering, Quality, Supply Chain ...

Navitas Semiconductor

... carbide (SiC) technologies. Our products enable faster, more efficient power delivery across AI ... Drive action item closure across engineering, supply chain, quality, and foundry/OSAT teams ...

Navitas Semiconductor

Works with Simulation engineer for thermal and thermo-mechanical stress simulations as part of risk ... power semiconductor device physics and manufacturing processes. * Experience with SiC and/or GaN ...

Navitas Semiconductor

$96K - $130K/yr

... carbide (SiC) technologies. Our products enable faster, more efficient power delivery across AI ... Test Engineering (test strategy, cost drivers, yield improvement) * Ensure procurement is embedded ...

Navitas Semiconductor

... carbide (SiC) technologies. Our products enable faster, more efficient power delivery across AI ... Skills: Advanced Excel VBA programming, data modeling, and professional English communication ...

Raytheon

Senior Motor Controls Engineer

Provo, UT

$98K - $135K/yr

Raytheon's Hardware Electrical Engineering Team is looking for junior engineers who have ... Familiarity with wide bandgap devices (SiC, GaN) in power electronics designs. Simulators such as ...

Raytheon

Motor Controls Engineer II

Provo, UT

$79K - $102K/yr

Raytheon's Hardware Electrical Engineering Team is looking for junior engineers who have ... Familiarity with wide bandgap devices (SiC, GaN) in power electronics designs. Simulators such as ...

Navitas Semiconductor

... carbide (SiC) technologies. Our products enable faster, more efficient power delivery across AI ... Lead searches for a range of positions, which may include technical, engineering, operations, sales ...

All JobsSic Power Engineer JobsSic Power Engineer Jobs in Utah

Sic Power Engineer information

What is a SiC power engineer?

SiC Power Engineers are specialists who design, develop, and optimize electronic systems that use silicon carbide (SiC) semiconductors for power conversion and management. These professionals work on creating highly efficient power electronic devices, such as inverters, converters, and power modules, utilizing the superior properties of SiC materials, like high thermal conductivity and voltage resistance. Their expertise is crucial in industries such as electric vehicles, renewable energy, and industrial automation, where efficient power handling is essential. SiC Power Engineers often collaborate with cross-functional teams to ensure the integration and reliability of SiC-based solutions.

What are some common challenges faced by SiC power engineers when integrating silicon carbide technology into existing power systems?

SiC Power Engineers often encounter challenges when integrating silicon carbide (SiC) devices into established power systems, primarily due to differences in electrical characteristics compared to traditional silicon components. These challenges include managing higher switching speeds, optimizing thermal management, and ensuring compatibility with existing circuitry and control methods. Additionally, engineers must stay updated on evolving industry standards and reliability testing to maximize the benefits of SiC technology. Collaborating closely with design, testing, and manufacturing teams is crucial to address these integration hurdles efficiently.

What are the key skills and qualifications needed to thrive as a SiC power engineer, and why are they important?

To thrive as a SiC Power Engineer, you need a strong background in electrical engineering, with expertise in power electronics, semiconductor device physics, and silicon carbide (SiC) technology, typically supported by a relevant engineering degree. Familiarity with simulation tools (like SPICE), PCB design software, and knowledge of industry standards and SiC device characterization techniques is essential. Strong problem-solving abilities, attention to detail, and effective communication skills set outstanding engineers apart in this field. These skills enable the design and optimization of high-performance, reliable SiC-based power systems that meet industry demands for efficiency and innovation.

What is the difference between Sic Power Engineer vs Electric Power Engineer?

AspectSic Power EngineerElectric Power Engineer
CredentialsTypically requires a degree in electrical engineering and relevant certificationsRequires electrical engineering degree and similar certifications
Work EnvironmentIndustrial plants, power generation facilities, and manufacturing sitesPower plants, electrical substations, and utility companies
Industry UsageCommonly employed in manufacturing and industrial sectorsPrimarily in energy, utilities, and power distribution sectors

The Sic Power Engineer and Electric Power Engineer roles share similar credentials and work environments, often overlapping in industrial and power generation settings. The main difference lies in their specific industry focus, with Sic Power Engineers more involved in manufacturing processes and Electric Power Engineers focusing on power distribution and utility operations.

What are popular job titles related to Sic Power Engineer jobs in Utah?

For Sic Power Engineer jobs in Utah, the most frequently searched job titles are:

What job categories do people searching Sic Power Engineer jobs in Utah look for?

The top searched job categories for Sic Power Engineer jobs in Utah are:

What cities in Utah are hiring for Sic Power Engineer jobs?

Cities in Utah with the most Sic Power Engineer job openings:

Sic Power Engineer jobs near you

Sr. Director, SiC Power Module Development

On-site

Navitas Semiconductor
Semiconductor and Electronic Component Manufacturing • 51 - 200 employees
Learn more about Navitas Semiconductorexternal

Full-time

Posted 8 days ago

Job description

Leadership Roles and Responsibilities
  • Lead the development and execution of the SiC power module technology roadmap supporting high-voltage and ultra-high-voltage product platforms.
  • Build, lead, and develop a global organization of package, module, materials, process, reliability, and manufacturing engineers.
  • Drive the development of advanced power module packaging technologies from concept and prototype through qualification, safe launch, manufacturing ramp, and production release.
  • Establish module architectures, design rules, material strategies, and assembly processes that enable industry-leading performance, reliability, manufacturability, and cost.
  • Own technical execution of power module development programs across all development phases and applicable product development gates.
  • Lead development activities at OSAT partners, ensuring process capability, quality, capacity readiness, documentation, and operational execution.
  • Drive design-for-manufacturing, design-for-reliability, design-for-test, and technical risk mitigation throughout the product development cycle.
  • Establish robust package and module development methods, including requirements management, DFMEA, design reviews, qualification plans, technology readiness assessments, and manufacturing readiness reviews.
  • Partner with Product Engineering, Device Engineering, Test Engineering, Quality, Supply Chain, Operations, and Business Units to ensure successful product execution.
  • Define the long-term OSAT strategy, including technology capability development, supplier qualification, capacity planning, and second-source initiatives.
  • Serve as the senior technical interface with customers, suppliers, and manufacturing partners for SiC power module technologies.
  • Drive continuous improvement in quality, yield, cycle time, cost, and operational performance across module manufacturing operations.
Technical Roles and Responsibilities
  • Define the technology roadmap for next-generation SiC power modules supporting 1.2kV through ultra-high-voltage platforms 2.3kV and higher.
  • Lead development of advanced module architectures, including substrate technologies, high-voltage isolation systems, terminal designs, interconnect structures, current-sharing approaches, and thermal-management solutions.
  • Establish module electrical, thermal, mechanical, reliability, manufacturability, and cost requirements and lead engineering tradeoff decisions throughout development.
  • Drive selection, characterization, and qualification of AMB and DBC substrates; die-attach and sintering materials; wire, ribbon, and clip interconnects; molding and encapsulation materials; thermal-interface materials; housings; and high-voltage insulation systems.
  • Lead electrical, electro-thermal, thermal, and mechanical simulation activities, including parasitic extraction, finite-element analysis, stress and warpage modeling, electric-field analysis, power-cycling life prediction, and partial-discharge assessment.
  • Define assembly process technologies, specifications, controls, and process windows for die attach and sintering, substrate attach, wire and ribbon bonding, clip attach, encapsulation, transfer molding, housing assembly, cleaning, curing, marking, and traceability.
  • Drive structured design of experiments, process characterization, SPC, Cpk improvement, defect reduction, and manufacturing yield improvement at OSATs.
  • Lead root-cause analysis and corrective actions for complex module failures, including delamination, die-attach voiding, sinter fatigue, interconnect degradation, thermal runaway, insulation breakdown, partial-discharge failures, moisture ingress, and housing or substrate cracking.
  • Work with test engineering to define wafer-sort, known-good-die, wafer-level burn-in, reliability screening, module final-test, high-voltage isolation, and partial-discharge test strategies
  • Lead technical evaluations and qualifications of OSATs, substrate suppliers, assembly-equipment vendors, material suppliers, and external reliability laboratories.
  • Own technical release criteria, control plans, safe-launch requirements, manufacturing readiness, and post-release monitoring for new module platforms.
  • Serve as the company technical authority for SiC power module architecture, packaging materials, assembly processes, qualification strategy, reliability, and manufacturing readiness.
Required Qualifications
  • M.S. or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related technical discipline.
  • 15+ years of semiconductor packaging or power module development experience, including significant technical leadership responsibility.
  • Proven experience developing and releasing power semiconductor modules from concept and prototype through qualification and production.
  • Deep knowledge of power module architectures, packaging materials, assembly processes, thermal management, electrical parasitics, high-voltage isolation, and reliability engineering.
  • Demonstrated experience leading module development and industrialization with OSATs or outsourced manufacturing partners.
  • Strong understanding of JEDEC, AEC-Q, and relevant industrial or automotive qualification methodologies.
  • Proven record of building and leading global, multidisciplinary engineering teams.
  • Experience managing complex development programs involving multiple internal functions, suppliers, and manufacturing partners.
  • Excellent leadership, communication, executive presentation, and data-driven decision-making skills.
  • Ability to travel internationally as required.
Preferred Technical Expertise
  • SiC MOSFET power modules across 1.2kV, 1.7kV, 2.3kV, 3.3kV, and higher voltage classes.
  • Ultra-high-voltage insulation design, electric-field management, creepage and clearance, and partial-discharge mitigation.
  • AMB/DBC substrate technology and high-reliability substrate attachment.
  • Pressureless or pressure-assisted silver sintering and advanced die-attach technologies.
  • High-current wire, ribbon, and clip interconnect technologies.
  • Power-module thermal management, electro-thermal modeling, power cycling, and lifetime prediction.
  • Automotive, industrial, renewable-energy, energy-storage, traction, or grid-infrastructure applications.
  • Known-good-die, wafer-level burn-in, and module-level high-voltage test solutions.
  • OSAT power module industrialization, second-source qualification, safe launch, and high-volume manufacturing ramp.
  • Experience developing technology roadmaps and building engineering organizations during rapid growth.
Leadership Expectations
  • Build a high-performance engineering culture focused on technical excellence, accountability, execution, innovation, and continuous improvement.
  • Develop technical leadership capability and succession plans across the global organization.
  • Drive effective collaboration across engineering, operations, quality, supply chain, and business teams.
  • Establish clear goals, metrics, ownership, and development plans to enable organizational success.
  • Foster strong, transparent partnerships with OSATs, material suppliers, equipment vendors, and technology partners.
  • Champion disciplined decision-making, risk management, and on-time closure of technical issues.

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