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Senior Ic Design Engineer Jobs in Georgia (NOW HIRING)

Falcomm

Senior IC Packaging Designer

Atlanta, GA

$98K - $104K/yr

Design and develop RFIC packages and substrates optimized for high-frequency performance, including ... Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related ...

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

Design and develop RFIC packages and substrates optimized for high-frequency performance, including ... Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related ...

Falcomm

Senior IC Packaging Designer

Atlanta, GA · On-site

$98K - $104K/yr

Design and develop RFIC packages and substrates optimized for high-frequency performance, including ... Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related ...

Belcan

Senior Electrical Design Engineer

Atlanta, GA · On-site

$50.38/hr

Job Title: Sr. Electrical Design Engineer II Location: Atlanta, GA Zip Code: 30309 Start Date: Right Away Pay Rate: $50.38/hr. Contract: 4 Months Keywords: #AtlantaJobs; #DesignEngineerjobs; #INDSUB ...

Cypress HCM

Senior Design Engineer (PMIC)

Suwanee, GA

$150K - $200K/yr

Senior Design Engineer - Mixed-Signal (PMIC) Location: Suwanee, GA 30024 | Reporting To: Sr. Director, Engineering Industry: Semiconductor, integrated circuits, memory | Employees: 700 Also open to ...

W3Global Inc.

Design Engineer

Woodstock, GA

$65K - $80K/yr

Staff Engineer → Design Engineer → Project Engineer → Senior Engineer → Leadership * PE licensure support and continuing education budget * 24 paid days off in year one (12 PTO + 5 holidays ...

Cypress HCM

Senior Analog Design Engineer

Suwanee, GA

$140K - $180K/yr

Senior Design Engineer - Analog Location: Suwanee, GA 30024 | Reporting To: Sr. Director, Engineering Industry : Semiconductor, integrated circuits, memory | Employees: 700 Responsibilities:

Magee Technologies

Senior Design Engineer

Kennesaw, GA · On-site

$100K - $115K/yr

The Senior Design Engineer plays a pivotal role in leading the design and development of complex aerospace systems, ensuring alignment with industry standards and regulatory compliance. This position ...

Great Dane LLC

Design Engineer

Savannah, GA · On-site

Design parts and assemblies using Catia based on close guidance by more senior engineers. * Perform stress/thermal analysis on parts and small assemblies using classical (non -FEA) techniques with ...

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Senior Ic Design Engineer information

See Georgia salary details

$59.5K

$113.6K

$164.7K

How much do senior ic design engineer jobs pay per year?

As of Aug 31, 2026, the average yearly pay for senior ic design engineer in Georgia is $113,635.00, according to ZipRecruiter salary data. Most workers in this role earn between $90,800.00 and $133,000.00 per year, depending on experience, location, and employer.

What is a senior IC design engineer?

A Senior IC (Integrated Circuit) Design Engineer is a highly experienced professional who designs and develops complex integrated circuits, such as microchips, for electronic devices. They lead or contribute to the entire design process, including conceptualization, schematic design, simulation, layout, verification, and testing of ICs. Senior engineers often mentor junior team members, collaborate with cross-functional teams, and ensure that designs meet technical specifications, performance targets, and industry standards. Their expertise is crucial in industries such as consumer electronics, telecommunications, automotive, and semiconductors.

What are the key skills and qualifications needed to thrive as a senior IC design engineer, and why are they important?

To thrive as a Senior IC Design Engineer, you need strong expertise in analog and/or digital integrated circuit design, semiconductor physics, and typically a degree in electrical engineering or a related field. Proficiency with EDA tools such as Cadence, Synopsys, and Mentor Graphics, as well as familiarity with industry standards and design verification methodologies, is essential. Strong problem-solving abilities, attention to detail, and effective teamwork and communication skills set outstanding engineers apart. These skills ensure robust, efficient IC designs that meet project requirements and facilitate successful collaboration in complex engineering environments.

What are the main challenges a senior IC design engineer faces when collaborating with cross-functional teams?

As a Senior IC Design Engineer, one of the main challenges is effectively communicating complex technical concepts to colleagues from other disciplines, such as software, hardware, and product management. Ensuring alignment on project requirements and timelines often requires clear documentation and regular meetings. Additionally, balancing design trade-offs—such as performance, power consumption, and manufacturability—while incorporating feedback from different teams can be demanding but is essential for successful chip development.

What are popular job titles related to Senior Ic Design Engineer jobs in Georgia?

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What job categories do people searching Senior Ic Design Engineer jobs in Georgia look for?

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Senior Ic Design Engineer jobs near you
Infographic showing various Senior Ic Design Engineer job openings in Georgia as of August 2026, with employment types broken down into 86% Full Time, 9% Part Time, and 5% Contract. Highlights an 84% Physical, 5% Hybrid, and 11% Remote job distribution, with an average salary of $113,635 per year, or $54.6 per hour.

Senior IC Packaging Designer

Falcomm

Atlanta, GA

$98K - $104K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 22 days ago

Job description

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless systems? At Falcomm, we are transforming innovative semiconductor research into real-world solutions through high-performance, energy-efficient RF power amplifier technologies. Our mission is to deliver cutting-edge wireless solutions that push the boundaries of performance, efficiency, and integration.

Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing and optimizing package architectures that support high-frequency performance, thermal efficiency, and manufacturability. The position requires close collaboration with RFIC designers, layout engineers, testing teams, and manufacturing partners to ensure successful integration of silicon, GaN, or III-V MMICs devices into production-ready packages.

Responsibilities:
  • Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages.
  • Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools.
  • Work with signal integrity, EM, and thermal simulation teams to validate package performance.
  • Generate package documentation, fabrication drawings, and assembly specifications.
  • Participate in design reviews, prototype builds, and failure analysis to improve RF performance and yield.
  • Collaborate with RFIC designers to co-optimize chip and package performance, minimizing parasitics and signal loss.
  • Support package integration with PCB design teams to ensure optimal RF performance at the system level.
  • Coordinate with fabrication and assembly partners.

Requirements

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
  • 3-5 years of experience designing advanced RFIC semiconductor packages up to 50GHz (e.g., wirebond, flip-chip, PoP, or SiP) using tools such as Cadence Allegro APD/SiP or Mentor Xpedition.
  • Strong foundation in electrical, thermal, materials, or mechanical engineering principles relevant to IC packaging.
  • Must be willing to work full-time, onsite, in Atlanta, GA.
Preferred Skills:
  • Familiarity with signal and power integrity analysis tools (e.g., HFSS, Q3D, PowerSI) and understanding of high-speed interface requirements such as DDR or PCIe.
  • Knowledge of substrate manufacturing processes, package layout constraints, and design verification tools including CAM350, Valor, or Calibre.
  • Experience with RFIC or 5G packaging design, along with scripting or automation skills (Python, TCL, Perl, or shell) to support design workflows.
  • Ability to build accurate 3-D models of packages using Ansys Electronics Desktop and EM-simulate them in HFSS and run thermal simulations on them with Icepak

Benefits

  • Competitive Salary and Equity Package
  • Comprehensive Health, Dental, and Vision Insurance
  • 401(k) Retirement Plan
  • Paid Time Off (PTO) and Sick Leave

Disclosure:

  • Falcomm is an Equal Opportunity Employer; employment with Falcomm is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
  • Applicants wishing to view a copy of Falcomm's Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should notify Falcomm.
  • To conform to U.S. Government export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State.

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