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Rf Module Design Engineer Jobs in New Jersey (NOW HIRING)

... generation optical modules. * Own and drive advanced package selection, new product BGA ... Substrate design experience for RF, digital, high speed and mixed signal die * Thorough ...

Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.

RF Design Engineer ( RF Design and Optimization) Location: Bridgewater, NJ Duration: 12+ months with a possible extension based on your performance The RF Engineer is responsible for contributing in ...

Troubleshoot and optimize discrete power amplifier modules and low noise amplifiers (LNAs) at both ... engineering and design engineering leadership. The environment is laboratory and production ...

Troubleshoot and optimize discrete power amplifier modules and low noise amplifiers (LNAs) at both ... engineering and design engineering leadership. The environment is laboratory and production ...

PIC Design Engineer

Matawan, NJ ยท On-site

$170K - $290K/yr

PIXCEL ( develops novel semiconductor-based photonic modules aimed at sensing and imaging ... device design. You are enthusiastic about engineering and seeing your efforts contribute to ...

PIXCEL ( develops novel semiconductor-based photonic modules aimed at sensing and imaging ... device design. You are enthusiastic about engineering and seeing your efforts contribute to ...

PIC Design Engineer

Matawan, NJ ยท On-site

$170K - $290K/yr

PIXCEL ( develops novel semiconductor-based photonic modules aimed at sensing and imaging ... device design. You are enthusiastic about engineering and seeing your efforts contribute to ...

Evaluate, design, or simulate custom RF antenna apertures, microwave and photonic structures, and devise methods to fabricate and experimentally verify performance. * Integrate custom components into ...

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Rf Module Design Engineer information

What does an RF Module Design Engineer do?

An RF Module Design Engineer specializes in designing, developing, and testing radio frequency (RF) modules used in a variety of wireless communication devices. They are responsible for creating circuit layouts, selecting components, and ensuring the modules meet performance, reliability, and regulatory standards. Their work often involves simulation, prototyping, and troubleshooting to optimize signal integrity and minimize interference. RF Module Design Engineers collaborate closely with hardware, software, and testing teams to integrate their modules into larger systems. This role is essential in industries such as telecommunications, aerospace, and consumer electronics.

What is the difference between Rf Module Design Engineer vs RF System Engineer?

AspectRf Module Design EngineerRF System Engineer
CredentialsBachelor's or Master's in Electrical Engineering, RF certificationsBachelor's or Master's in Electrical or RF Engineering, RF certifications
Work EnvironmentDesign labs, R&D departments, manufacturing facilitiesSystem integration labs, testing environments, R&D teams
Industry UsageWireless device manufacturing, telecom, consumer electronicsWireless networks, telecom infrastructure, system-level design

Both roles require strong RF engineering knowledge and similar educational backgrounds. The Rf Module Design Engineer focuses on designing and developing RF modules, while the RF System Engineer works on integrating RF components into complete systems. Understanding these differences helps in choosing the right career path or job search focus.

What are the key skills and qualifications needed to thrive as an RF Module Design Engineer, and why are they important?

To thrive as an RF Module Design Engineer, you need strong expertise in RF circuit design, electromagnetic theory, and a relevant engineering degree, such as electrical or electronics engineering. Familiarity with tools like ADS, HFSS, and network analyzers, plus knowledge of industry standards and certifications such as IPC, is highly valued. Attention to detail, problem-solving abilities, and effective communication are crucial soft skills for collaborating with cross-functional teams and troubleshooting complex issues. These competencies ensure the development of high-performance, reliable RF modules that meet stringent industry requirements.

What are some common challenges faced by RF Module Design Engineers during the product development cycle?

RF Module Design Engineers often encounter challenges such as minimizing interference and signal loss, ensuring compliance with international wireless standards, and integrating modules into compact device enclosures without sacrificing performance. Balancing trade-offs between power consumption, cost, and performance is also a frequent consideration. Collaboration with cross-functional teams, such as PCB layout engineers and system architects, is essential to address these challenges and deliver robust, manufacturable designs.
What cities in New Jersey are hiring for Rf Module Design Engineer jobs? Cities in New Jersey with the most Rf Module Design Engineer job openings:
Principal SI/PI Design Engineer

Principal SI/PI Design Engineer

Ciena

New Providence, NJ โ€ข On-site

$157K - $250K/yr

Other

Medical, Dental, Vision, Retirement, PTO

Posted 8 days ago


Job description

As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We're a technology company that leads with our humanity-driving our business priorities alongside meaningful social, community, and societal impact.

How You Will Contribute:

As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead the electrical package design for custom in-house photonic, analog, and digital ICs supporting next generation optical modules.

  • Own and drive advanced package selection, new product BGA configuration and package structure
  • Responsible for package/SIP layout, optimization, design verification and tapeout
  • Interface and coordinate with cross-functional groups throughout Ciena on new product package selection, feasibility analysis and design
  • Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out
  • Simulate and optimize signal/power integrity and RF performance of the package design
  • Interface and work with CMs and vendors for the sourcing existing designs and future product development

Must Haves:

  • BS in Electrical Engineering or Physics
  • 5+ years hands on experience with IC package design

Assets:

  • Substrate design experience for RF, digital, high speed and mixed signal die
  • Thorough understanding of signal and power integrity fundamentals
  • Proficient in Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS
  • Experience in package design electrical review, SI/PI analysis
  • Experience in package design for manufacturing reviews
  • Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers
  • Problem solver with strong engineering fundamentals

Pay Range:

The annual salary range for this position is $157,100 - $250,900 USD.

Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.

Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.
At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.

Ciena is anEqual Opportunity Employer, including disability and protected veteran status.

If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.