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Job Description:

The successful candidate will be responsible for system-level Analog Mixed-Signal (AMS) verification and Power Integrity (PI/SI) for next-generation SoCs and chiplet-based platforms, integrating analog IP in mature nodes with advanced digital nodes (e.g., 12nm and beyond).

Key Responsibilities

• Lead/contribute to sub-system and chip-level AMS and SPICE simulations for complex SoCs and multi-die (chiplet) architectures
• Drive AMS verification across chiplet boundaries, including cross-node integration (mature analog + 12nm digital)
• Collaborate closely with SoC design, architecture, analog, and advanced-node digital implementation teams
• Review and understand SoC specifications, IO subsystems, and die-to-die interface requirements
• Plan and execute AMS/SPICE simulation strategies, including full-chip and chiplet-level verification.
• Perform PI/SI simulations covering:
• Die pad ring
• Package and interposer (chiplet-based designs)
• PCB interfaces (as applicable)
• Analyze power integrity and signal integrity across chiplet interfaces and multiple power domains
• Develop and enhance AMS and PI/SI methodologies and flows for multi-die/chiplet systems
• Partner with validation teams on silicon bring-up, debug, and simulation-to-silicon correlation

Requirements/Qualifications:

• Bachelor's/Master's degree in electrical engineering or equivalent with 14+ years of experience.
• Proven experience in AMS verification for advanced SoCs, including exposure to 12nm nodes or beyond
• Solid understanding of cross-domain interactions and multi-voltage/power domains
• Hands-on experience with industry-standard tools:
  • Cadence (Virtuoso, Spectre, AMS Designer)
  • Questa ADMS / Symphony
  • HSPICE or equivalent

• Experience in silicon debug and correlation of simulation results with silicon behavior
• Ability to analyze and interpret chip-level electrical specifications and IO requirements.
• Strong communication skills with the ability to work effectively in a global, cross-functional environment

Preferred

• Experience with chiplet architectures or multi-die system integration
• Exposure to die-to-die interfaces and advanced node (12nm and beyond) integration challenges
• Experience in circuit-level debug and modeling

Travel Time:

Physical Attributes:

Physical Requirements:

Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.
For more information on applicable equal employment regulations, please refer to the Know Your Rights: Workplace Discrimination is Illegal Poster.

To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.