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Principal Memory Design Engineer Jobs (NOW HIRING)

Resource Point LLC

Memory Design Engineer

Troy, MI · On-site

Memory Design Engineer Location: Ontario, Canada Duration: 6+ Months with possible extension Qualification Required: * Typically requires minimum of 2 to 5 years of experience in Memory Design with ...

Arm Limited

Memory Design Engineer

Austin, TX · On-site

$130K - $176K/yr

Contribute in all parts of the memory development flow, starting at design specification, circuit ... Master's in Electrical Engineering, Computer Engineering, or other relevant technical fields with ...

ARM

Memory Design Engineer

Austin, TX · Hybrid

$130K - $176K/yr

Contribute in all parts of the memory development flow, starting at design specification, circuit ... Master's in Electrical Engineering, Computer Engineering, or other relevant technical fields with ...

ARM

Memory Design Engineer

Austin, TX · On-site

$130K - $176K/yr

Contribute in all parts of the memory development flow, starting at design specification, circuit ... Master's in Electrical Engineering, Computer Engineering, or other relevant technical fields with ...

Talanto

About the Role • • • • • 's CPU Circuit Technology team is seeking a highly motivated CPU Memory Design Engineer to help develop the next generation of high-performance, power-efficient ...

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How much do principal memory design engineer jobs pay per year?

As of Sep 10, 2026, the average yearly pay for principal memory design engineer in the United States is $147,220.00, according to ZipRecruiter salary data. Most workers in this role earn between $118,500.00 and $173,000.00 per year, depending on experience, location, and employer.

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Infographic showing various Principal Memory Design Engineer job openings in the United States as of August 2026, with employment types broken down into 88% Full Time, 7% Part Time, and 5% Contract. Highlights an 84% Physical, 5% Hybrid, and 11% Remote job distribution, with an average salary of $147,220 per year, or $70.8 per hour.

Principal Memory Design Engineer, HBM

Richardson, TX • On-site

Micron Technology, Inc
Semiconductor and Electronic Component Manufacturing • 10K+ employees
Learn more about Micron Technology, Incexternal

Other

PTO

Re-posted 4 days ago

Micron Technology rating

8.6

Company rating: 8.6 out of 10

Based on 43 frontline employees who took The Breakroom Quiz

28th of 163 rated electronics manufacturers

Job description

Req ID: JR87473 Principal Memory Design Engineer, HBM

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Principal Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while leading layout processes and ensuring robust verification and reliability. This role collaborates cross‑functionally to support manufacturability, drive innovation for future memory generations, and oversee project activities from design through validation and review.

Responsibilities
  • Design and implement DRAM circuits, including digital, analog, and memory core circuitry, based on device specifications.
  • Create and optimize floorplans for circuit placement, signal routing, power delivery, sense margins, timings, and die size.
  • Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, speed, and reliability.
  • Model parasitics in simulation, verify routing and power integrity, and support validation, reticle experiments, and tape‑out revisions.
  • Confirm simulation‑to‑silicon correlation and recommend schematic edits.
  • Contribute to documentation, training, standardization efforts, and cross‑group communication.
  • Manage build and layout resources, monitor task progress, and lead technical reviews.
  • Serve as a primary contact for design, layout, verification, and testing while preparing project status reports.
Requirements
  • Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with knowledge of device reliability.
  • Expertise in Cadence Virtuoso, physical layout, and circuit floor planning.
  • Experience with FINESIM, HSPICE, and VERILOG simulation tools.
  • Strong analytical and problem‑solving abilities with significant technical contributions and innovation history.
  • Deep expertise in DRAM subsystem architecture, specification, operation, or design, including cross‑department technical leadership.
Preferred Qualifications
  • Highly self‑motivated with strong problem‑solving instincts and a passion for discovering new solutions.
  • In‑depth awareness of industry‑specific technologies and trends.
  • Excellent communication and interpersonal skills.
Job Profile(s)

Semiconductor Design Engineer 5 - Semiconductor Design Eng MTS

Relocation Level: TBD

Benefits & Equal Opportunity Statement

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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