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Pecvd Process Engineer Jobs in Portland, OR (NOW HIRING)

ASM

Principal Field Process Engineer

Hillsboro, OR

Principal Field Process Engineer (Hillsboro, OR) The Principal Field Process Engineer (FPE) is a ... Handson experience with ASM ALD, PEALD, PECVD, Epitaxy, or Vertical Furnace LPCVD equipment.

Lam Research Corporation

Process Engineer 5

Tualatin, OR · On-site

The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ... PECVD), Physical Vapor Deposition (PVD), or Pulsed Laser Deposition. * Background in Plasma Physics ...

ASM

Principal Field Process Engineer

Hillsboro, OR · On-site

Principal Field Process Engineer (Hillsboro, OR) The Principal Field Process Engineer (FPE) is a ... Hands-on experience with ASM ALD, PEALD, PECVD, Epitaxy, or Vertical Furnace LPCVD equipment.

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Pecvd Process Engineer information

See Portland, OR salary details

$52.5K

$97.6K

$151.1K

How much do pecvd process engineer jobs pay per year?

As of Jun 16, 2026, the average yearly pay for pecvd process engineer in Portland, OR is $97,585.00, according to ZipRecruiter salary data. Most workers in this role earn between $79,000.00 and $109,200.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a PECVD Process Engineer, and why are they important?

To thrive as a PECVD Process Engineer, you need a solid background in materials science, semiconductor processing, and chemical engineering, often supported by a relevant engineering degree. Familiarity with PECVD equipment, process characterization tools (such as ellipsometry, SEM, and profilometry), and statistical process control systems is typically required. Strong analytical thinking, problem-solving abilities, and effective teamwork are essential soft skills in this role. These competencies are crucial for optimizing process performance, ensuring high product quality, and driving innovation in semiconductor manufacturing environments.

What are some common challenges a PECVD Process Engineer faces when optimizing thin film deposition processes?

PECVD Process Engineers often encounter challenges such as achieving uniform film thickness across large substrates, minimizing defects, and maintaining process stability over long production runs. Balancing deposition rate, film quality, and equipment throughput requires careful tuning of process parameters like gas flow, pressure, and plasma power. Collaboration with equipment maintenance teams and R&D is essential to resolve issues quickly and implement process improvements. Staying up-to-date with advancements in materials and plasma technology also plays a key role in overcoming these challenges.

What are PECVD Process Engineers?

PECVD Process Engineers are specialists who develop, optimize, and maintain Plasma Enhanced Chemical Vapor Deposition (PECVD) processes used in semiconductor manufacturing and related industries. They work with advanced equipment to deposit thin films on substrates, ensuring uniformity and high-quality results. Their responsibilities include process troubleshooting, equipment maintenance, and collaborating with other engineers to improve film performance and yield. PECVD Process Engineers play a critical role in producing microelectronic devices and other components requiring precise material deposition.
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Pecvd Process Engineer jobs near you
Principal Field Process Engineer

Principal Field Process Engineer

ASM

Hillsboro, OR

Other

Posted 11 days ago

Job description

Principal Field Process Engineer (Hillsboro, OR)

The Principal Field Process Engineer (FPE) is a senior individual contributor within ASM's Key Account organization (Global Sales & Services) and serves as the technical authority and escalation owner for customerfacing process applications. This role operates with high autonomy, leading complex new product introductions (NPI), onsite process development, and HVM transfers, while acting as the primary technical interface between ASM Business Units and customer process teams.

What you'll be working on

  • Own technical delivery and escalation for NPI of advanced deposition processes and hardware (thermal ALD, plasma ALD, Area Selective Deposition).
  • Lead complex troubleshooting, root cause analysis, and crossfunctional resolution with customers, Business Units, and field teams.
  • Drive onsite process and hardware development, including DOEbased experiments and continuous improvement initiatives.
  • Identify and advance new ASM technology and film opportunities aligned to customer roadmaps.
  • Lead process transfer to HVM fabs and develop/transfer Best Known Methods (BKMs) to service and manufacturing teams.
  • Capture and feedback technical learnings to influence future ASM hardware, process, and qualification packages.

What we are looking for

  • M.S. or PhD in Chemistry, Chemical Engineering, Materials Science, Physics, or related field.
  • 7-10 years of experience in thinfilm deposition (ALD).
  • Strong expertise in semiconductor device integration, vacuum systems, film metrology, and structured problem solving.
  • Proven ability to independently design experiments, manage escalations, and influence without authority.
  • Excellent technical communication skills and strong IP awareness.
  • Flexibility to travel and support extended hours during qualifications or escalations.

What sets you apart

  • Handson experience with ASM ALD, PEALD, PECVD, Epitaxy, or Vertical Furnace LPCVD equipment.
  • Demonstrated success optimizing deposition processes in development 
  • Experience leading customer-facing technical discussions or escalations.
  • Experience coordinating cross-functional action plans during escalations.

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