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Pecvd Process Engineer Jobs in Washington (NOW HIRING)

Work directly with operators, process technicians, maintenance engineers, and equipment engineers ... Experience with CVD, PECVD, PVD, ALD, or plasma processing equipment. * Knowledge of vacuum systems ...

Pecvd Process Engineer information

What is a PECVD process engineer?

PECVD Process Engineers are specialists who develop, optimize, and maintain Plasma Enhanced Chemical Vapor Deposition (PECVD) processes used in semiconductor manufacturing and related industries. They work with advanced equipment to deposit thin films on substrates, ensuring uniformity and high-quality results. Their responsibilities include process troubleshooting, equipment maintenance, and collaborating with other engineers to improve film performance and yield. PECVD Process Engineers play a critical role in producing microelectronic devices and other components requiring precise material deposition.

What are the key skills and qualifications needed to thrive as a PECVD process engineer?

To thrive as a PECVD Process Engineer, you need a solid background in materials science, semiconductor processing, and chemical engineering, often supported by a relevant engineering degree. Familiarity with PECVD equipment, process characterization tools (such as ellipsometry, SEM, and profilometry), and statistical process control systems is typically required. Strong analytical thinking, problem-solving abilities, and effective teamwork are essential soft skills in this role. These competencies are crucial for optimizing process performance, ensuring high product quality, and driving innovation in semiconductor manufacturing environments.

What are some common challenges a PECVD process engineer faces when optimizing thin film deposition processes?

PECVD Process Engineers often encounter challenges such as achieving uniform film thickness across large substrates, minimizing defects, and maintaining process stability over long production runs. Balancing deposition rate, film quality, and equipment throughput requires careful tuning of process parameters like gas flow, pressure, and plasma power. Collaboration with equipment maintenance teams and R&D is essential to resolve issues quickly and implement process improvements. Staying up-to-date with advancements in materials and plasma technology also plays a key role in overcoming these challenges.

What are popular job titles related to Pecvd Process Engineer jobs in Washington?

For Pecvd Process Engineer jobs in Washington, the most frequently searched job titles are:

What job categories do people searching Pecvd Process Engineer jobs in Washington look for?

The top searched job categories for Pecvd Process Engineer jobs in Washington are:

What cities in Washington are hiring for Pecvd Process Engineer jobs?

Cities in Washington with the most Pecvd Process Engineer job openings:

Infographic showing various Pecvd Process Engineer job openings in Washington as of August 2026, with employment types broken down into 1% As Needed, 78% Full Time, 17% Part Time, 3% Contract, and 1% Nights. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution.

$95K - $145K/hr

Full-time

Re-posted 12 days ago


Job description

Job Description
Microfabrication Engineer
Job Description
The Microfabrication Engineer shall serve as a hands-on technical specialist supporting the development, optimization, and sustainment of microfabrication processes for MEMS devices and advanced spaceflight instrumentation within NASA Goddard Space Flight Center (GSFC) laboratories. The engineer will apply expertise in semiconductor fabrication techniques to enable the production and integration of high-reliability micro-scale devices used in space and scientific missions.
The candidate will operate within a cleanroom environment and collaborate closely with design engineers, systems engineers, and test personnel to translate device requirements into robust fabrication processes. Responsibilities include executing and refining photolithography workflows, thin-film deposition processes, and etching techniques while ensuring consistency, repeatability, and compliance with established process controls.
The engineer will troubleshoot fabrication issues, perform root cause analysis, and implement corrective actions to improve device yield and performance. Responsibilities include conducting process characterization using metrology tools such as optical and electron microscopy, ellipsometry, and electrical test equipment, and interpreting data to support process optimization.
The role includes development and documentation of fabrication procedures, process flows, and technical reports in accordance with NASA and industry standards. The engineer will support process integration efforts, contribute to Design of Experiments (DOE) activities, and provide clear technical assessments to project teams and laboratory management.
The candidate will support ongoing laboratory operations, including adherence to cleanroom protocols, equipment usage, and safety standards. Participation in multidisciplinary teams and contributions to continuous process improvement initiatives are expected. Limited support for external collaborators or project reviews may be required.
Required Qualifications
  • Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical discipline.
  • Minimum 3 years of demonstrated hands-on experience in semiconductor, MEMS, or microfabrication environments.
  • Demonstrated expertise in photolithography processes, including photoresist application, exposure systems (mask aligners, steppers, or e-beam lithography), and pattern development.
  • Experience with thin-film deposition techniques, including PVD, CVD/PECVD, thermal oxidation, and ALD.
  • Proficiency in etching techniques, including wet chemical etching, RIE, DRIE, and vapor phase etching.
  • Experience operating metrology and characterization equipment including microscopy, ellipsometry, and electrical probing.
  • Demonstrated ability to troubleshoot fabrication processes and perform root cause analysis.
  • Ability to work independently and effectively within multidisciplinary teams.
  • Strong organizational and documentation skills.
  • Proficiency in Microsoft Office (Word, Excel, PowerPoint).
  • Strong written and verbal communication skills.
  • US Citizenship or lawful permanent US residency required.
Desired Qualifications
  • Master’s or PhD in a relevant engineering or scientific discipline.
  • Experience working in Class 10–1000 cleanroom environments.
  • Familiarity with MEMS device design principles and fabrication challenges.
  • Experience with process integration and wafer-level fabrication workflows.
  • Knowledge and application of Design of Experiments (DOE) methodologies.
  • Prior experience supporting NASA, aerospace, or government laboratory environments.