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Packaging Design Internship Jobs (NOW HIRING)

Your Team, Your Impact Advanced Packaging Physical Design for Photonic Fabric BU What You Can ... every stage - from internship to retirement and through life's most important moments. Our ...

Your Team, Your Impact Advanced Packaging Physical Design for Photonic Fabric BU What You Can ... every stage - from internship to retirement and through life's most important moments. Our ...

This paid internship is in our Naples, Florida studio. We are always accepting applications for ... Our benefit package includes: * Wellness Programs * Medical, Dental, and Vision Coverage * Profit ...

If you are a design student and are passionate about iconic and vintage inspired womenswear, we ... While the base salary range for this role is $20-$25 per hour, your total compensation package may ...

If you are a design student and are passionate about iconic and vintage inspired womenswear, we ... While the base salary range for this role is $20-$25 per hour, your total compensation package may ...

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Packaging Design Internship information

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How much do packaging design internship jobs pay per hour?

As of Jun 29, 2026, the average hourly pay for packaging design internship in the United States is $19.38, according to ZipRecruiter salary data. Most workers in this role earn between $14.42 and $21.63 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive in the Packaging Design Internship position, and why are they important?

A strong foundation in graphic design, creativity, and attention to detail—often supported by coursework in design or related fields—is essential for a Packaging Design Internship. Familiarity with design software such as Adobe Creative Suite (Illustrator, Photoshop, InDesign) and an understanding of print production processes are typically required. Excellent communication, teamwork skills, and the ability to receive and implement feedback help interns collaborate effectively within multidisciplinary teams. These qualifications ensure interns can create appealing packaging concepts that meet branding requirements and practical constraints.

What is a Packaging Design Internship job?

A Packaging Design Internship is a temporary role where interns assist in creating and developing packaging designs for products. Interns typically work with design teams to conceptualize, prototype, and refine packaging that aligns with branding and functional requirements. They may use design software like Adobe Illustrator or Photoshop and collaborate with marketing and production teams. This internship helps build practical experience in graphic design, material selection, and sustainability considerations in packaging.

What kinds of projects and responsibilities can I expect as a Packaging Design Intern?

As a Packaging Design Intern, you will typically support senior designers in creating and refining packaging concepts, developing dielines, choosing materials, and preparing files for print production. You may participate in brainstorming sessions, conduct research on packaging trends and sustainability, and assist with mockups and prototype testing. Interns often have opportunities to present their ideas to cross-functional teams and receive feedback from design, marketing, and production departments. This hands-on involvement helps you understand the end-to-end packaging development process and build a strong professional portfolio.

More about Packaging Design Internship jobs
What cities are hiring for Packaging Design Internship jobs? Cities with the most Packaging Design Internship job openings:
What are the most commonly searched types of Packaging Design jobs? The most popular types of Packaging Design jobs are:
What states have the most Packaging Design Internship jobs? States with the most job openings for Packaging Design Internship jobs include:
Infographic showing various Packaging Design Internship job openings in the United States as of June 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $40,304 per year, or $19.4 per hour.
Package Design Engineer

Package Design Engineer

Marvell Technology, Inc.

Santa Clara, CA • On-site

$159K/yr

Full-time

Life, Retirement

Posted 3 days ago


Key responsibilities

  • Lead Si/package/PCB/system co-design work collaborating with system design teams and ASIC designers to develop packages for various performance design points.

  • Plan and execute Silicon interposer and RDL based design layout solutions for advanced packaging architectures.

  • Support pre and post silicon bring up, yield improvement activities, qualification, failure analysis, and system implementation.


Job description

About Marvell
Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
Advanced Packaging Physical Design for Photonic Fabric BU
What You Can Expect
  • Package Design:
    • Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC designers to develop a portfolio of packages that meets a huge range of performance design points, while optimizing re-use in other Marvell products.
    • Scope all aspects of package design feasibility at Silicon interposer and substrate level for multi-chip SiP packaging.
    • Support pre/post silicon bring up, yield improvement activities, qualification, failure analysis, and system implementation.
  • Package Layout Expertise:
    • Lead all aspects of package layout based on I/O, SI-PI and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing.
    • Meet specifications for high-speed interfaces such as HBM, DDR, PCIe and 56G/112G SerDes.
  • 2.5D and 3D Package Design Planning and Execution:
    • Plan and execute Silicon interposer and RDL based design layout solutions for advanced packaging architectures.
    • Netlist management for heterogeneous chiplet assemblies using latest EDA solutions.
  • Substrate Manufacturing and OSAT Assembly Engagement:
    • Supporting activities related to production and assembly of IC packages with substrate suppliers and OSATs.
    • Work with cross-functional teams and support package integration and architecture efforts with vendors.
    • Actively participate in qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability, driving appropriate test vehicle definition and design.
    • Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Marvell

What We're Looking For
  • Education: BS/MS/PhD in EE/ECE/MSE/ME/ChemE or related disciplines.
  • Experience: 5-10 years of experience in Semiconductor Packaging Design of heterogeneous architectures, including silicon interposer and RDL designs.
  • Technical Expertise:
    • Extensive experience working with advanced packaging design tools such as Cadence APD.
    • Experience working with MCAD tools such as SolidWorks, AutoCAD and interconversion of package design databases to MCAD files.
    • Knowledge and insights to deliver high density/high performance interconnects in various 2.5D/3D packaging technologies including InFO, CoWoS, FoCoS and EMIB.
    • Good understanding of cross-functional packaging areas: Si floor plan, package, board layout and architecture, design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, assembly, reliability, and cost.
    • Familiarity with photonics packaging is a plus but not necessary.
  • Substrate Vendor and OSAT Engagement:
    • Proven track record of working with substrate vendors to meet design for manufacturing, yield, and reliability.
    • Proven track record of engagement with OSATs to meet assembly requirements and drive new developments to meet new product requirements.
  • Industry Knowledge: Experience in High Speed Signaling best practices, Signal and Power integrity requirements.
  • Soft Skills: Strong analytical, problem-solving, cross-functional collaboration, project management, and technical presentation skills.

Expected Base Pay Range (USD)
166,520 - 249,500, $ per annum
The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.
Additional Compensation and Benefit Elements
Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life's most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.
Interview Integrity
To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.
This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.
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