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Package Design Manager Jobs (NOW HIRING)

Broadcom Inc.

Package Design Engineer

San Jose, CA · On-site

$141.30 - $226/hr

## Package Design EngineerApplylocations: USA-CA San Jose Innovation Drive: USA-TX-Austin - River ... Project management and customer interface for your design projects* Contribute to efficiency ...

Broadcom

Package Design Engineer

San Jose, CA

$141K - $226K/yr

Project management and customer interface for your design projects * Contribute to efficiency ... Knowledge of package-level signal integrity and power integrity, to apply to package designs

Broadcom

Package Design Engineer

Austin, TX

$134K/yr

Project management and customer interface for your design projects * Contribute to efficiency ... Knowledge of package-level signal integrity and power integrity, to apply to package designs

Broadcom, Inc.

Package Design Engineer

San Jose, CA · On-site

$159K/yr

Project management and customer interface for your design projects * Contribute to efficiency ... Knowledge of package-level signal integrity and power integrity, to apply to package designs

Google

Package Design Engineer

Sunnyvale, CA · On-site

$159K/yr

Experience in chip package substrate layout, design verification, DFM and taping out for production ... You will manage all phases of the design process, including routing feasibility, test vehicle ...

Google Inc.

Package Design Engineer

Sunnyvale, CA · On-site

$142.20 - $237/hr

You will manage all phases of the design process, including routing feasibility, test vehicle ... As a Chip Package Designer on the Silicon Integration team, your role is to develop package ...

Cesna Group

Package Design Associate

Rancho Cucamonga, CA · On-site

$50K - $100K/yr

Lead end-to-end package design development for new and existing products, including dielines ... Strong communication and collaboration skills with the ability to manage multiple projects and ...

Nutanix

Package Design Engineer - Staff

San Diego, CA · On-site

$154 - $252.80/hr

Familiar in using Constraint Manager in Package design tool for setting up DFM rules and electrical rulesExperience in using in-line DRC checking, DFM verification, Electrical Rule Checking (ERC ...

Posted today

Qualcomm

Package Design Engineer - Staff

San Diego, CA · On-site

Familiar in using Constraint Manager in Package design tool for setting up DFM rules and electrical rules * Experience in using in-line DRC checking, DFM verification, Electrical Rule Checking (ERC ...

Campbell Soup Company

Design Manager

Camden, NJ · On-site

The Design Manager is responsible for leading the execution of design work across assigned brands or categories, ensuring high-quality, consistent, and on-strategy delivery across packaging ...

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Package Design Manager information

See salary details

$42K

$114.5K

$201.5K

How much do package design manager jobs pay per year?

As of Aug 21, 2026, the average yearly pay for package design manager in the United States is $114,491.00, according to ZipRecruiter salary data. Most workers in this role earn between $83,500.00 and $144,000.00 per year, depending on experience, location, and employer.

What does a package design manager do?

A Package Design Manager oversees the development and execution of packaging concepts for products, ensuring that designs are both visually appealing and functional. They collaborate with marketing, engineering, and production teams to create packaging that protects products, meets branding guidelines, and adheres to regulatory standards. Their role often includes managing a team of designers, coordinating project timelines, and staying updated on packaging trends and sustainability initiatives. Ultimately, Package Design Managers help products stand out on shelves while balancing cost, safety, and environmental considerations.

What are the key skills and qualifications needed to thrive as a package design manager, and why are they important?

To thrive as a Package Design Manager, you need expertise in graphic and industrial design, project management, and a relevant degree in design or packaging engineering. Familiarity with design software like Adobe Creative Suite, CAD systems, and knowledge of packaging materials and regulatory standards is essential. Strong leadership, creativity, and collaboration skills are crucial for guiding teams and communicating with clients and stakeholders. These skills ensure innovative, practical, and cost-effective packaging solutions that meet brand, safety, and sustainability requirements.

What are some common challenges faced by a package design manager when balancing creativity with cost-effectiveness?

As a Package Design Manager, one of the main challenges is striking the right balance between innovative, eye-catching designs and the practical constraints of manufacturing costs and material limitations. You'll often need to collaborate closely with marketing, procurement, and production teams to ensure that your designs not only stand out on the shelf but are also feasible within budget and sustainability goals. Navigating feedback from multiple stakeholders while maintaining brand consistency and adhering to regulatory requirements is also a frequent aspect of the role.

What is the difference between Package Design Manager vs Packaging Designer?

AspectPackage Design ManagerPackaging Designer
ResponsibilitiesOversees entire packaging projects, manages teams, develops strategies, and ensures brand consistency.Creates and designs packaging concepts, focusing on aesthetics and functionality.
Required SkillsLeadership, project management, design knowledge, communication skills.Creative design skills, proficiency in design software, understanding of materials.
Work EnvironmentCollaborative, managerial, often in corporate or agency settings.Design studios, corporate offices, freelance environments.
Common Search IntentComparing roles with managerial oversight and strategic responsibilities.Looking for creative design roles and portfolio development.

The Package Design Manager focuses on overseeing packaging projects, managing teams, and aligning strategies with brand goals. In contrast, a Packaging Designer primarily concentrates on creating visual and functional packaging designs. Both roles require design skills, but the manager role emphasizes leadership and project management, while the designer role emphasizes creativity and technical design expertise.

Is a package design manager a stressful job?

A package design manager oversees the development of packaging solutions, which can involve tight deadlines, collaboration with multiple departments, and attention to detail. The role may be stressful during project deadlines or when managing multiple projects simultaneously, but it also offers opportunities for creative problem-solving and process improvement. Stress levels vary depending on workload, company culture, and individual skills.

Is packaging design in demand?

Packaging design is in high demand as companies seek innovative and sustainable solutions to attract consumers and differentiate their products. The role often requires skills in graphic design, knowledge of materials, and proficiency with design software like Adobe Illustrator or Photoshop. The industry is expected to grow with the expansion of e-commerce and retail sectors.

What cities are hiring for Package Design Manager jobs?

Cities with the most Package Design Manager job openings:

What are the most commonly searched types of Package Design jobs?

The most popular types of Package Design jobs are:

What states have the most Package Design Manager jobs?

States with the most job openings for Package Design Manager jobs include:

Package Design Manager jobs near you
Infographic showing various Package Design Manager job openings in the United States as of August 2026, with employment types broken down into 88% Full Time, 11% Part Time, and 1% Contract. Highlights an 81% Physical, 2% Hybrid, and 17% Remote job distribution, with an average salary of $114,491 per year, or $55 per hour.

Manager, Package Design Engineering

Astera Labs

San Jose, CA • On-site

Full-time

Re-posted 27 days ago

Job description

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs' Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company's custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.
Role Overview
Astera Labs is seeking a Manager, Package Design Engineering to lead and scale our Package Design team in San Jose. In this high-impact role, you'll own the end-to-end delivery of advanced IC packaging solutions-from early architecture definition through production ramp-enabling the next generation of AI infrastructure and connectivity products.
As the semiconductor industry races toward chiplet-based architectures, 2.5D/3D integration, and ever-increasing bandwidth demands, packaging has become a critical differentiator. You'll build and mentor a high-performing team while driving cross-functional execution with silicon architecture, SIPI, PCB, validation, manufacturing, and external partners including substrate vendors and OSATs. Your work will directly impact Astera Labs' ability to deliver industry-leading PCIe, CXL, and Ethernet connectivity solutions to the world's most demanding hyperscale and AI customers.
This role offers the opportunity to shape design methodology, establish scalable standards, and enable chip-package-board co-design frameworks across multiple product lines in a fast-moving, innovation-driven environment.
Key Responsibilities
  • Team Leadership & Execution
    • Build, mentor, and scale a high-performing package design engineering team with clear ownership, accountability, and execution flows
    • Establish design templates, standards, and best-known methods (BKMs) across multiple concurrent programs
    • Lead design reviews, audits, and issue resolution through bring-up and production ramp
  • Package Design Delivery
    • Own end-to-end package design execution including FCBGA/FCCSP, monolithic, multi-die, and chiplet-based designs from concept feasibility through tape-out and production
    • Define and review substrate stack-ups, pad stacks, routing strategies, and design constraints to meet electrical, thermal, mechanical, and manufacturability requirements
    • Drive technical tradeoffs across performance, cost, yield, and schedule, ensuring high-quality design closure and on-time delivery
  • Cross-Functional Collaboration
    • Partner with SIPI, silicon architecture, system/board design, and product teams to drive chip-package-board co-design and resolve system-level challenges
    • Collaborate with OSATs and substrate vendors to ensure design feasibility, manufacturability, and alignment with evolving design rules and technology roadmaps
    • Support adoption of advanced packaging technologies such as 2.5D, chiplet, CPO/CPC, and heterogeneous integration platforms
  • Methodology & Automation
    • Develop and scale design methodologies and automation flows to improve efficiency, quality, and repeatability across the organization

Basic Qualifications
  • Bachelor's degree in Electrical Engineering, Materials Science, or related field
  • 10+ years of progressive experience in IC package design using tools such as Cadence Allegro APD/SiP
  • 5+ years of leadership experience managing teams or technical organizations in IC packaging environments
  • Strong hands-on expertise in end-to-end package design with proven delivery of HVM-ready FCBGA/FCCSP packages using Cadence APD tool
  • Experience with high-speed SerDes systems (PCIe Gen5/6/7, CXL, Ethernet 100G/200G/400G+) and advanced nodes (7nm, 5nm, 3nm)
  • Deep understanding of substrate technologies, stack-ups, routing constraints, assembly processes, and SI/PI fundamentals
  • Proven experience working with OSATs and substrate vendors through development and production ramp
  • Experience working with OSATs and substrate vendors through development and production ramp
  • Experience with advanced packaging architectures such as 2.5D/3D, chiplet, or heterogeneous integration

Preferred Qualifications
  • Master's degree in Electrical Engineering or related field
  • Experience with advanced packaging architectures such as 2.5D/3D, chiplet, or heterogeneous integration
  • Experience implementing automation, scripting (Python, SKILL, Tcl), or workflow optimization
  • Background in early package feasibility, platform evaluation, and technology roadmap development
  • Familiarity with chip floor planning, architecture, and system-level tradeoffs
  • Exposure to SIPI modeling and analysis, thermal, and mechanical performance considerations

The base salary range is $230,000 USD - $265,000 USD. This position can be hired as a Manager Level or Director Level. Your base salary will be determined based on location, experience, and employees' pay in similar positions.
We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.

Apply