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Package Design Engineer Jobs (NOW HIRING)

Etched

IC Package Engineer

Cupertino, CA · On-site

$2K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

Etched

IC Package Engineer

Cupertino, CA · On-site

$2K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

K2 Space

Senior ASIC Package Design Engineer

$180K - $260K/yr

The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

Etched

IC Package Engineer

Cupertino, CA · On-site

$2K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

TransPak

Packaging Design Engineer I

Hayward, CA · On-site

$72K/yr

Packaging Design Engineer I is primarily responsible for developing custom packaging designs and ... package testing/qualification, and resolving packaging related issues. * Knowledge of packaging ...

transpak

Packaging Design Engineer I

San Jose, CA

$159K/yr

Packaging Design Engineer I is primarily responsible for developing custom packaging designs and ... package testing/qualification, and resolving packaging related issues. * Knowledge of packaging ...

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Package Design Engineer information

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$90K

$136.5K

How much do package design engineer jobs pay per year?

As of Jun 12, 2026, the average yearly pay for package design engineer in the United States is $135,040.00, according to ZipRecruiter salary data. Most workers in this role earn between $136,000.00 and $136,000.00 per year, depending on experience, location, and employer.

How does a Package Design Engineer typically collaborate with cross-functional teams during a product development cycle?

Package Design Engineers regularly work with product development, manufacturing, and marketing teams to ensure that packaging solutions meet technical specifications, production capabilities, and branding requirements. This collaboration often involves attending design review meetings, sharing prototypes, and integrating feedback from multiple stakeholders. Effective communication and adaptability are crucial, as engineers must balance functional, cost, and aesthetic considerations throughout the development process.

What is the difference between Package Design Engineer vs Packaging Designer?

AspectPackage Design EngineerPackaging Designer
CredentialsBachelor's in Packaging Engineering, Mechanical Engineering, or related fieldsBachelor's in Graphic Design, Industrial Design, or Packaging Design
Work EnvironmentManufacturing facilities, R&D labs, engineering teamsDesign studios, marketing departments, creative agencies
Industry UsageConsumer goods, electronics, pharmaceuticals, food productsConsumer products, branding, marketing campaigns

The Package Design Engineer focuses on developing functional, cost-effective, and manufacturable packaging solutions, often working closely with engineering teams. Packaging Designers primarily concentrate on the visual appeal, branding, and creative aspects of packaging. Both roles may collaborate, but their core responsibilities and skill sets differ significantly.

What are the key skills and qualifications needed to thrive as a Package Design Engineer, and why are they important?

To thrive as a Package Design Engineer, a strong background in engineering, materials science, and design principles—often supported by a bachelor's degree in mechanical, packaging, or industrial engineering—is essential. Familiarity with CAD software, prototyping tools, and simulation systems, as well as knowledge of industry standards like ISTA or ASTM, is typically required. Creativity, problem-solving, and effective communication distinguish top performers in this field. These skills are crucial for developing innovative, cost-effective, and functional packaging solutions that meet product, manufacturing, and regulatory requirements.

What does a Package Design Engineer do?

A Package Design Engineer is responsible for designing and developing packaging solutions for products, ensuring that they are both functional and visually appealing. This role involves selecting appropriate materials, considering factors like cost, durability, and environmental impact, as well as collaborating with product development, marketing, and manufacturing teams. Package Design Engineers also conduct tests to ensure packaging protects the product during shipping and storage, and they often use computer-aided design (CAD) software to create prototypes. Their work is crucial for both product safety and brand image.
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What job categories do people searching Package Design Engineer jobs look for? The top searched job categories for Package Design Engineer jobs are:
Package Design Engineer jobs near you
Sr. IC Package Design Engineer (Silicon Engineering)

Sr. IC Package Design Engineer (Silicon Engineering)

SpaceX

Austin, TX • On-site

Full-time

Posted 22 days ago

SpaceX rating

8.7

Company rating: 8.7 out of 10

Based on 144 frontline employees who took The Breakroom Quiz

13th of 60 rated aerospace companies

Job description

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.
SR. IC PACKAGE DESIGN ENGINEER (SILICON ENGINEERING)
At SpaceX we're leveraging our experience in building rockets and spacecraft to deploy Starlink, the world's most advanced broadband internet system. Starlink is the world's largest satellite constellation and is providing fast, reliable internet to millions of users worldwide. We design, build, test, and operate all parts of the system - thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We've only begun to scratch the surface of Starlink's potential global impact and are looking for best-in-class engineers to help maximize Starlink's utility for communities and businesses around the globe.
We are seeking a motivated, proactive, and intellectually curious engineer who will work alongside world-class cross-disciplinary teams (systems, firmware, architecture, design, validation, product engineering, ASIC implementation). In this role, you will be developing cutting-edge next-generation ASICs for deployment in space and ground infrastructures around the globe. These chips are enabling connectivity in places it has previously not been available, affordable or reliable. As an IC Package Design Engineer, you will be an integral part of the IC design team and lead packaging for custom in-house ASICs and RFICs for digital beam formers and modems.
RESPONSIBILITIES:
  • Own and drive advanced package selection, new product BGA configuration and package structure
  • Responsible for package/SIP layout, optimization, design verification and tapeout
  • Interface and coordinate with cross-functional groups throughout SpaceX on new product package selection, feasibility analysis and design
  • Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out
  • Simulate and optimize signal/power integrity and RF performance of the package design
  • Drive methodology, innovations, and productivity improvements in package design

BASIC QUALIFICATIONS:
  • Bachelor's degree in electrical engineering, computer engineering, or physics
  • 5+ years of experience with IC package design

PREFERRED SKILLS AND EXPERIENCE:
  • Experience with Co-packaged Optics (CPO)
  • Thorough understanding of signal and power integrity fundamentals
  • Substrate design experience for RF, digital, high-speed and mixed signal die
  • Experience with Cadence APD+/SIP or similar design tools
  • Experience in package design electrical review, SI/PI analysis
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, ADS
  • Experience in package design for manufacturing reviews
  • Familiar with BGA package substrate technologies
  • Strong problem solving skills with strong engineering fundamentals

ADDITIONAL REQUIREMENTS:
  • Ability to work extended hours or weekends as needed to meet mission critical deadlines

ITAR REQUIREMENTS:
  • To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.

SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX's Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to EEOCompliance@spacex.com.

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