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Package Design Engineer Jobs (NOW HIRING)

K2 Space

Senior ASIC Package Design Engineer

Seattle, WA · On-site

$180K - $260K/yr

The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

K2 Space

OR · On-site

$180K - $260K/yr

The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

K2 Space

Principal ASIC Package Design Engineer

$200K - $280K/yr

The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...

K2 Space

Senior ASIC Package Design Engineer

$180K - $260K/yr

The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

K2 Space

Senior ASIC Package Design Engineer

Seattle, WA · On-site

$180K - $260K/yr

The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

Etched

IC Package Engineer

Cupertino, CA · On-site

$2.0K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

Etched

IC Package Engineer

Cupertino, CA

$2.0K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

Etched

IC Package Engineer

Cupertino, CA

$2.0K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

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Package Design Engineer information

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$90K

$136.5K

How much do package design engineer jobs pay per year?

As of Jul 23, 2026, the average yearly pay for package design engineer in the United States is $135,040.00, according to ZipRecruiter salary data. Most workers in this role earn between $136,000.00 and $136,000.00 per year, depending on experience, location, and employer.

What engineers make $300,000 a year?

Senior engineers in specialized fields such as petroleum, aerospace, or software engineering can earn $300,000 or more annually, especially with extensive experience, advanced skills, and leadership roles. High compensation often involves working in high-demand industries, holding managerial or executive positions, or possessing rare expertise and certifications.

What engineers make $200,000 a year?

Senior engineers in fields such as petroleum, aerospace, software, and data engineering often earn $200,000 or more annually, especially with extensive experience, advanced skills, and relevant certifications. High-paying roles typically require specialized knowledge, leadership responsibilities, and often involve working in high-demand industries or locations with a high cost of living.

What does a packaging design engineer do?

A packaging design engineer develops and creates packaging solutions that protect products, are functional, and meet branding requirements. They use design software, collaborate with manufacturing teams, and consider factors like material selection, sustainability, and cost efficiency throughout the design process.

How does a Package Design Engineer typically collaborate with cross-functional teams during a product development cycle?

Package Design Engineers regularly work with product development, manufacturing, and marketing teams to ensure that packaging solutions meet technical specifications, production capabilities, and branding requirements. This collaboration often involves attending design review meetings, sharing prototypes, and integrating feedback from multiple stakeholders. Effective communication and adaptability are crucial, as engineers must balance functional, cost, and aesthetic considerations throughout the development process.

What is the difference between Package Design Engineer vs Packaging Designer?

AspectPackage Design EngineerPackaging Designer
CredentialsBachelor's in Packaging Engineering, Mechanical Engineering, or related fieldsBachelor's in Graphic Design, Industrial Design, or Packaging Design
Work EnvironmentManufacturing facilities, R&D labs, engineering teamsDesign studios, marketing departments, creative agencies
Industry UsageConsumer goods, electronics, pharmaceuticals, food productsConsumer products, branding, marketing campaigns

The Package Design Engineer focuses on developing functional, cost-effective, and manufacturable packaging solutions, often working closely with engineering teams. Packaging Designers primarily concentrate on the visual appeal, branding, and creative aspects of packaging. Both roles may collaborate, but their core responsibilities and skill sets differ significantly.

What are the key skills and qualifications needed to thrive as a Package Design Engineer, and why are they important?

To thrive as a Package Design Engineer, a strong background in engineering, materials science, and design principles—often supported by a bachelor's degree in mechanical, packaging, or industrial engineering—is essential. Familiarity with CAD software, prototyping tools, and simulation systems, as well as knowledge of industry standards like ISTA or ASTM, is typically required. Creativity, problem-solving, and effective communication distinguish top performers in this field. These skills are crucial for developing innovative, cost-effective, and functional packaging solutions that meet product, manufacturing, and regulatory requirements.

What does a Package Design Engineer do?

A Package Design Engineer is responsible for designing and developing packaging solutions for products, ensuring that they are both functional and visually appealing. This role involves selecting appropriate materials, considering factors like cost, durability, and environmental impact, as well as collaborating with product development, marketing, and manufacturing teams. Package Design Engineers also conduct tests to ensure packaging protects the product during shipping and storage, and they often use computer-aided design (CAD) software to create prototypes. Their work is crucial for both product safety and brand image.

What engineer makes $500,000 a year?

While most package design engineers earn less than $200,000 annually, some senior or specialized engineers in high-demand industries or with executive responsibilities can reach or exceed $500,000 per year, often through bonuses, stock options, or profit sharing. Achieving this level typically requires extensive experience, advanced skills, and leadership roles within large corporations or innovative companies.
More about Package Design Engineer jobs
What states have the most Package Design Engineer jobs? States with the most job openings for Package Design Engineer jobs include:
What job categories do people searching Package Design Engineer jobs look for? The top searched job categories for Package Design Engineer jobs are:
Package Design Engineer jobs near you
Infographic showing various Package Design Engineer job openings in the United States as of July 2026, with employment types broken down into 88% Full Time, 9% Part Time, and 3% Contract. Highlights an 85% Physical, 4% Hybrid, and 11% Remote job distribution, with an average salary of $135,040 per year, or $64.9 per hour.
Senior ASIC Package Design Engineer

Senior ASIC Package Design Engineer

K2 Space

Seattle, WA • On-site

$180K - $260K/yr

Other

Medical, Dental, Vision, Life, PTO

Posted 21 days ago

Job description

The Role 

We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions. This role supports the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp. You will collaborate with internal teams for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.  

Responsibilities 

  • Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
  • Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
  • Establish package design standards, methodologies, and best practices.  
  • Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
  • Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
  • Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces. 
  • Support package-level SI/PI strategy, including high-speed digital interfaces, power delivery network (PDN) design, and decoupling strategy
  • Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling. 
  • Drive material selection, substrate technology choices, and assembly process optimization.  

Qualifications 

  • Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
  • 5+ years of experience in ASIC package design, with deep expertise in FC-BGA.
  • Proven experience delivering high-pin-count, high-performance ASIC packages into production.
  • Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
  • Experience working directly with OSATs and substrate vendors.
  • Knowledge of packaging qualification and test methodologies. 

Nice to Have

  • Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates). 
  • Background in high-speed digital or mixed-signal SoCs. 
  • Familiarity with aerospace, space, or high-reliability electronics. 

Compensation and Benefits:

  • Base salary range for this role is $180,000 - $260,000 + equity in the company
  • Salary will be based on several factors including, but not limited to: knowledge and skills, education, and experience level
  • Comprehensive benefits package including paid time off, medical/dental/vision/ coverage, life insurance, paid parental leave, and many other perks
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About K2 Space

Sourced by ZipRecruiter

Industry

Guided missile and space vehicle manufacturing

Company size

11 - 50 Employees

Headquarters location

Los Angeles, CA, US

Year founded

2022

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