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Package Design Engineer Jobs (NOW HIRING)

As a Senior Package Design Engineer, you will be responsible for supporting the design and layout of new products from early concept to tape out, focusing primarily on several elements that enable ...

We are seeking a Staff Package Design Engineer to join our dynamic team in Austin, TX. In this role, you'll work closely with internal and external customers to develop cutting-edge packaging ...

Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.

As a Senior Package Design Engineer, you will lead co-design activities that bridge silicon design, package architecture, and product development for advanced DRAM and memory products targeting ...

OR

$200K - $280K/yr

The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...

OR · On-site

$180K - $260K/yr

The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...

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Package Design Engineer information

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$90K

$136.5K

How much do package design engineer jobs pay per year?

As of Jul 2, 2026, the average yearly pay for package design engineer in the United States is $135,040.00, according to ZipRecruiter salary data. Most workers in this role earn between $136,000.00 and $136,000.00 per year, depending on experience, location, and employer.

What engineers make $300,000 a year?

Senior engineers in specialized fields such as petroleum, aerospace, or software engineering can earn $300,000 or more annually, especially with extensive experience, advanced skills, and leadership roles. High compensation often involves working in high-demand industries, holding managerial or executive positions, or possessing rare expertise and certifications.

What engineers make $200,000 a year?

Senior engineers in fields such as petroleum, aerospace, software, and data engineering often earn $200,000 or more annually, especially with extensive experience, advanced skills, and relevant certifications. High-paying roles typically require specialized knowledge, leadership responsibilities, and often involve working in high-demand industries or locations with a high cost of living.

What does a packaging design engineer do?

A packaging design engineer develops and creates packaging solutions that protect products, are functional, and meet branding requirements. They use design software, collaborate with manufacturing teams, and consider factors like material selection, sustainability, and cost efficiency throughout the design process.

How does a Package Design Engineer typically collaborate with cross-functional teams during a product development cycle?

Package Design Engineers regularly work with product development, manufacturing, and marketing teams to ensure that packaging solutions meet technical specifications, production capabilities, and branding requirements. This collaboration often involves attending design review meetings, sharing prototypes, and integrating feedback from multiple stakeholders. Effective communication and adaptability are crucial, as engineers must balance functional, cost, and aesthetic considerations throughout the development process.

What is the difference between Package Design Engineer vs Packaging Designer?

AspectPackage Design EngineerPackaging Designer
CredentialsBachelor's in Packaging Engineering, Mechanical Engineering, or related fieldsBachelor's in Graphic Design, Industrial Design, or Packaging Design
Work EnvironmentManufacturing facilities, R&D labs, engineering teamsDesign studios, marketing departments, creative agencies
Industry UsageConsumer goods, electronics, pharmaceuticals, food productsConsumer products, branding, marketing campaigns

The Package Design Engineer focuses on developing functional, cost-effective, and manufacturable packaging solutions, often working closely with engineering teams. Packaging Designers primarily concentrate on the visual appeal, branding, and creative aspects of packaging. Both roles may collaborate, but their core responsibilities and skill sets differ significantly.

What are the key skills and qualifications needed to thrive as a Package Design Engineer, and why are they important?

To thrive as a Package Design Engineer, a strong background in engineering, materials science, and design principles—often supported by a bachelor's degree in mechanical, packaging, or industrial engineering—is essential. Familiarity with CAD software, prototyping tools, and simulation systems, as well as knowledge of industry standards like ISTA or ASTM, is typically required. Creativity, problem-solving, and effective communication distinguish top performers in this field. These skills are crucial for developing innovative, cost-effective, and functional packaging solutions that meet product, manufacturing, and regulatory requirements.

What does a Package Design Engineer do?

A Package Design Engineer is responsible for designing and developing packaging solutions for products, ensuring that they are both functional and visually appealing. This role involves selecting appropriate materials, considering factors like cost, durability, and environmental impact, as well as collaborating with product development, marketing, and manufacturing teams. Package Design Engineers also conduct tests to ensure packaging protects the product during shipping and storage, and they often use computer-aided design (CAD) software to create prototypes. Their work is crucial for both product safety and brand image.

What engineer makes $500,000 a year?

While most package design engineers earn less than $200,000 annually, some senior or specialized engineers in high-demand industries or with executive responsibilities can reach or exceed $500,000 per year, often through bonuses, stock options, or profit sharing. Achieving this level typically requires extensive experience, advanced skills, and leadership roles within large corporations or innovative companies.
More about Package Design Engineer jobs
What states have the most Package Design Engineer jobs? States with the most job openings for Package Design Engineer jobs include:
Infographic showing various Package Design Engineer job openings in the United States as of June 2026, with employment types broken down into 3% As Needed, 76% Full Time, 16% Part Time, and 5% Contract. Highlights an 86% Physical, 4% Hybrid, and 10% Remote job distribution, with an average salary of $135,040 per year, or $64.9 per hour.
Package Design Engineer

Package Design Engineer

Marvell Technology, Inc.

Santa Clara, CA • On-site

$159K/yr

Full-time

Life, Retirement

Posted 6 days ago


Job description

About Marvell
Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
Advanced Packaging Physical Design for Photonic Fabric BU
What You Can Expect
  • Package Design:
    • Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC designers to develop a portfolio of packages that meets a huge range of performance design points, while optimizing re-use in other Marvell products.
    • Scope all aspects of package design feasibility at Silicon interposer and substrate level for multi-chip SiP packaging.
    • Support pre/post silicon bring up, yield improvement activities, qualification, failure analysis, and system implementation.
  • Package Layout Expertise:
    • Lead all aspects of package layout based on I/O, SI-PI and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing.
    • Meet specifications for high-speed interfaces such as HBM, DDR, PCIe and 56G/112G SerDes.
  • 2.5D and 3D Package Design Planning and Execution:
    • Plan and execute Silicon interposer and RDL based design layout solutions for advanced packaging architectures.
    • Netlist management for heterogeneous chiplet assemblies using latest EDA solutions.
  • Substrate Manufacturing and OSAT Assembly Engagement:
    • Supporting activities related to production and assembly of IC packages with substrate suppliers and OSATs.
    • Work with cross-functional teams and support package integration and architecture efforts with vendors.
    • Actively participate in qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability, driving appropriate test vehicle definition and design.
    • Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Marvell

What We're Looking For
  • Education: BS/MS/PhD in EE/ECE/MSE/ME/ChemE or related disciplines.
  • Experience: 5-10 years of experience in Semiconductor Packaging Design of heterogeneous architectures, including silicon interposer and RDL designs.
  • Technical Expertise:
    • Extensive experience working with advanced packaging design tools such as Cadence APD.
    • Experience working with MCAD tools such as SolidWorks, AutoCAD and interconversion of package design databases to MCAD files.
    • Knowledge and insights to deliver high density/high performance interconnects in various 2.5D/3D packaging technologies including InFO, CoWoS, FoCoS and EMIB.
    • Good understanding of cross-functional packaging areas: Si floor plan, package, board layout and architecture, design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, assembly, reliability, and cost.
    • Familiarity with photonics packaging is a plus but not necessary.
  • Substrate Vendor and OSAT Engagement:
    • Proven track record of working with substrate vendors to meet design for manufacturing, yield, and reliability.
    • Proven track record of engagement with OSATs to meet assembly requirements and drive new developments to meet new product requirements.
  • Industry Knowledge: Experience in High Speed Signaling best practices, Signal and Power integrity requirements.
  • Soft Skills: Strong analytical, problem-solving, cross-functional collaboration, project management, and technical presentation skills.

Expected Base Pay Range (USD)
166,520 - 249,500, $ per annum
The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.
Additional Compensation and Benefit Elements
Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life's most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.
Interview Integrity
To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.
This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.
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