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Microelectronics Packaging Engineer Jobs (NOW HIRING)

NCSU

CLAWS Packaging Engineer

Raleigh, NC

... Packaging Engineer Anticipated Hiring Range Commensurate with Education and Experience Work ... Microelectronics Commons regional innovation hub, Commercial Leap Ahead for Wide Bandgap ...

Quantinuum

Chief Packaging Engineer - 906

Broomfield, CO · On-site

$208K - $260K/yr

A successful candidate will have a broad and deep understanding of microelectronic and photonic ... Provide technical guidance to a team of packaging engineers to interface with broader Quantinuum ...

Mercury Systems

Principal Electrical Engineer

Phoenix, AZ

$130K - $159K/yr

Manage the design of microelectronic digital and RF packaged circuits that meet system and customer ... Bachelor's or higher-level degree in Electrical Engineering, Computer Engineering, or equivalent

Mini-Circuits Careers

Sr. Packaging Engineer

Carlsbad, CA · On-site

$130K - $165K/yr

The Sr. Packaging Engineer is responsible for leading the development and execution of all ... Must have strong knowledge of microelectronic chip-and-wire manufacturing methods and techniques ...

Mini--circuit

Sr. Packaging Engineer

Carlsbad, CA · On-site

$130K - $165K/yr

The Sr. Packaging Engineer is responsible for leading the development and execution of all ... Must have strong knowledge of microelectronic chip-and-wire manufacturing methods and techniques ...

New

Mini-Circuits Careers

Sr. Packaging Engineer

Melville, NY · On-site

$130K - $165K/yr

The Sr. Packaging Engineer is responsible for leading the development and execution of all ... Must have strong knowledge of microelectronic chip-and-wire manufacturing methods and techniques ...

Mercury Systems

Principal Electrical Engineer

Phoenix, AZ · On-site

$130K - $159K/yr

Manage the design of microelectronic digital and RF packaged circuits that meet system and customer ... Bachelor's or higher-level degree in Electrical Engineering, Computer Engineering, or equivalent

Mini-Circuits

Sr. Packaging Engineer

Carlsbad, CA · On-site

$130K - $165K/yr

The Sr. Packaging Engineer is responsible for leading the development and execution of all ... Must have strong knowledge of microelectronic chip-and-wire manufacturing methods and techniques ...

Mini-Circuits

Sr. Packaging Engineer

Carlsbad, CA · On-site

$130K - $165K/yr

The Sr. Packaging Engineer is responsible for leading the development and execution of all ... Must have strong knowledge of microelectronic chip-and-wire manufacturing methods and techniques ...

mercury

Principal Electrical Engineer

Phoenix, AZ · On-site

$130K - $159K/yr

Manage the design of microelectronic digital and RF packaged circuits that meet system and customer ... Bachelor's or higher-level degree in Electrical Engineering, Computer Engineering, or equivalent

Mini-Circuits

Sr. Packaging Engineer

Carlsbad, CA · On-site

$130K - $165K/yr

The Sr. Packaging Engineer is responsible for leading the development and execution of all ... Must have strong knowledge of microelectronic chip-and-wire manufacturing methods and techniques ...

3M HEALTHCARE

R&D Product Development Engineer

Atlanta, GA · On-site

$55K - $110K/yr

Advanced degree in engineering, MEMS, microelectronics, packaging, mechanical systems, or a related technical field. * Experience applying machine learning, AI, or advanced data‑analysis methods to ...

Intel

Silicon Packaging Design Engineer

Phoenix, AZ · On-site

$105K - $149K/yr

As a Silicon Packaging Design Engineer, you will play a pivotal role in driving the development of ... Experience and/or familiarity with microelectronic package or PCB physical layout design and ...

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Microelectronics Packaging Engineer information

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How much do microelectronics packaging engineer jobs pay per hour?

As of Sep 11, 2026, the average hourly pay for microelectronics packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What is a microelectronics packaging engineer?

A Microelectronics Packaging Engineer is a professional who designs, develops, and evaluates the packaging of microelectronic devices such as integrated circuits and semiconductor chips. Their work involves creating solutions that protect delicate electronics, manage heat, and ensure reliable electrical connections within compact spaces. They collaborate with design, manufacturing, and quality teams to optimize packaging for performance, cost, and manufacturability. This role is crucial in industries like consumer electronics, automotive, aerospace, and telecommunications.

What are the key skills and qualifications needed to thrive as a microelectronics packaging engineer?

To thrive as a Microelectronics Packaging Engineer, you typically need a background in electrical or materials engineering, strong knowledge of semiconductor processes, and experience with microelectronic packaging design. Familiarity with CAD software, simulation tools like ANSYS or COMSOL, and industry standards such as IPC or JEDEC is often required. Strong problem-solving skills, attention to detail, and effective cross-functional communication help engineers address complex design and manufacturing challenges. These competencies are crucial for ensuring reliable, high-performance electronic products and successful collaboration in a fast-evolving technological field.

What are some common challenges faced by microelectronics packaging engineers in managing thermal and mechanical stresses during the design process?

Microelectronics Packaging Engineers often encounter challenges in balancing thermal management and mechanical reliability when designing packages for high-performance devices. These challenges include mitigating heat dissipation to prevent overheating, managing thermal expansion mismatches between different materials, and ensuring the integrity of connections under repeated temperature cycling. Collaboration with materials scientists and simulation specialists is common to identify optimal materials and design structures that address these stresses. Staying current with evolving materials and simulation tools is essential for success in this dynamic field.

What is the difference between Microelectronics Packaging Engineer vs Semiconductor Process Engineer?

AspectMicroelectronics Packaging EngineerSemiconductor Process Engineer
CredentialsBachelor's or Master's in Electrical, Materials, or Mechanical EngineeringBachelor's or Master's in Electrical, Materials, or Chemical Engineering
Work EnvironmentDesigning and testing packaging solutions in labs or manufacturingDeveloping and optimizing semiconductor fabrication processes in cleanrooms
Industry UsageElectronics manufacturing, focusing on device protection and integrationSemiconductor fabrication plants, focusing on chip production processes

While both roles require engineering backgrounds and are vital in electronics manufacturing, Microelectronics Packaging Engineers focus on designing and testing packaging solutions to protect and connect chips, whereas Semiconductor Process Engineers concentrate on developing fabrication processes for semiconductor wafers. Their work environments and industry applications overlap but serve different stages of the electronics production chain.

What are popular job titles related to Microelectronics Packaging Engineer jobs?

For Microelectronics Packaging Engineer jobs, the most frequently searched job titles are:

Infographic showing various Microelectronics Packaging Engineer job openings in the United States as of August 2026, with employment types broken down into 94% Full Time, 2% Part Time, and 4% Contract. Highlights an 85% Physical, 5% Hybrid, and 10% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.

CLAWS Packaging Engineer

Raleigh, NC

NCSU
Colleges, Universities, and Professional Schools • 5 - 10K employees
Learn more about NCSUexternal

Full-time, Part-time

Medical, Dental, Vision, Life, Retirement, PTO

Re-posted 27 days ago

Key responsibilities

  • Lead packaging of wide bandgap semiconductor devices, including RF devices, high power electronic devices, and photonic devices.

  • Specify package solutions, define scalable workflows, and participate in cross-functional design initiatives to improve performance, manufacturability, yield, or reliability.

  • Lead the development and integration of processes such as die attach, wire bonding, and encapsulation, and analyze package and module performance.

North Carolina State University rating

6.8

Company rating: 6.8 out of 10

Based on 33 frontline employees who took The Breakroom Quiz

Job description

Posting Information
Posting Number PG194604EP Internal Recruitment No Working Title CLAWS Packaging Engineer Anticipated Hiring Range Commensurate with Education and Experience Work Schedule Monday - Friday, 8am - 5pm Job Location Raleigh, NC Department Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS) About the Department
North Carolina State University is leading the charge as the recipient of a $39.4 million award from the Department of Defense to establish the regional Microelectronics Commons regional innovation hub, Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS). This initiative, part of the larger $238 million investment through the Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act, aims to revolutionize the field of wide bandgap semiconductors.

Hub leadership, Distinguished Professors John Muth and Fred Kish, are dedicated to the "lab to fab" journey-translating laboratory advancements into fabrication capabilities for wide bandgap semiconductors. The hub brings together a dynamic partnership with N.C. A&T State University and industry leaders, including Wolfspeed, Coherent Corp., General Electric, Bluglass, Adroit Materials, and Kyma Technologies, Inc. This collaborative effort will propel the development of semiconductors crucial for national defense, electric vehicles, power grid technologies, 5G/6G, quantum technologies, and artificial intelligence applications
Wolfpack Perks and Benefits
As a Pack member, you belong here, and can enjoy exclusive perks designed to enhance your personal and professional well-being. As you consider this opportunity, we encourage you to review our Employee Value Proposition and learn more about what makes NC State the best place to learn and work for everyone.

What we offer:
  • Medical, Dental, and Vision
  • Flexible Spending Account
  • Retirement Programs
  • Disability Plans
  • Life Insurance
  • Accident Plan
  • Paid Time Off and Other Leave Programs
  • 12 Holidays Each Year
  • Tuition and Academic Assistance
  • And so much more!

Attain Work-life balance with our Childcare benefits, Wellness & Recreation Membership, and Wellness Programs that aim to build a thriving wolfpack community.
Disclaimer: Perks and Benefit eligibility is based on Part-Time or Full-Time Employment status. Eligibility and Employer Sponsored Plans can be found within each of the links offered.
Essential Job Duties
We are seeking an experienced semiconductor device Packaging Engineer to join our research foundry team, supporting the development of advanced RF, Power, and Photonic devices and integrated circuits. The ideal candidate will have expertise in the development and integration of packaging processes as well as package design and assembly. The engineer will work closely with device, process, and test engineers to define interconnect strategies, perform thermal and mechanical analysis, and ensure compatibility with wafer-level processes and test infrastructure.
Key Responsibilities:

Lead packaging of wide bandgap semiconductor devices (30%)
  • RF devices including HEMTs and MMICs
  • High power electronic devices including HEMTs, FETs, and diodes
  • Visible spectrum optoelectronic devices and Photonic Integrated Circuits.
Packaging Design and Assembly Workflows (25%)
  • Specify package solutions that meet the performance requirements of new technology platforms in collaboration with CLAWS teams.
  • Define scalable workflows to realize packaged discrete devices, integrated circuits, or modules.
  • Participate in cross-functional design initiatives that improve performance, manufacturability, yield, or reliability.
Process Integration (25%)
  • Lead the development and integration of processes in, for example, die attach, wire bonding, and encapsulation.
  • Analyze package and module performance. Inform electrical, thermal, and mechanical simulations with design and characterization data.
  • Troubleshoot process integration challenges related to defectivity, yield, and reliability.
Cross-functional Collaboration (20%)
  • Collaborate with circuit designers, applications engineers, and product development teams to realize integrated system-level advantages.
  • Stay up to date with emerging technology trends, competitive landscape, and industry benchmarks.
Other Responsibilities
The successful candidate will:
  • Comply with stated workplace policies.
  • Communicate results, plans, and other updates to a variety of audiences.
  • Adhere to and mentor others in known best practices.
  • Support CLAWS activities such as tours, meetings, and conferences.
Qualifications
Minimum Education and Experience
  • Ph.D. or relevant terminal degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; or
  • Master's degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; with at least 5 years of experience in high power, RF, or photonics device packaging and process integration (industry or research).
  • Bachelor's degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; with at least 8 years of experience in high power, RF, or photonics device packaging and process integration (industry or research).
Other Required Qualifications
The successful candidate must demonstrate:
  • Experience designing and implementing packaging processes for high power, RF, or photonics applications.
  • Excellent communication and interpersonal skills.
  • Ability to multitask and meet deadlines with moderate supervision.
  • Ability to follow safe procedures for working with semiconductor packaging or fabrication equipment, chemicals, and compressed gas cylinders.
  • Comfort in collaborating with students, faculty, and staff of varying experience and backgrounds.
  • Eligibility to obtain clearance upon request of the US government.
Preferred Qualifications
The successful candidate would preferably have additional experience in:
  • Modeling thermal, electrical, or mechanical behavior(s) in packaged devices
  • Characterization of devices and processes, including failure analysis and defect inspection.
  • RF or optical signal integrity.
  • Advanced packaging architectures.
  • Design for reliability and reliability testing.
  • MES and SPC systems.
  • Statistical methods (e.g., DOE, GR&R) and tools (e.g., JMP, Minitab).
  • Material specification and vendor management.
Required License(s) or Certification(s)
  • N/A
Valid NC Driver's License required No Commercial Driver's License required No
Recruitment Dates and Special Instructions
Job Open Date 04/17/2026 Anticipated Close Date Open Until Filled Special Instructions to Applicants
Please include as attachments a resume/CV, cover letter, and contact information for at least 3 professional references.
Position Details
Position Number 00112012 Position Type EPS/SAAO Full Time Equivalent (FTE) (1.0 = 40 hours/week) 1.0 Appointment 12 Month Recurring Mandatory Designation - Adverse Weather Non Mandatory - Adverse Weather Mandatory Designation - Emergency Events Non Mandatory - Emergency Event Department ID 140110 - CLAWS EEO
NC State University is an equal opportunity employer. All qualified applicants will receive equal opportunities for employment without regard to age, color, disability, gender identity, genetic information, national origin, race, religion, sex (including pregnancy), sexual orientation, and veteran status. The University encourages all qualified applicants, including protected veterans and individuals with disabilities, to apply. Individuals with disabilities requiring disability-related accommodations in the application and interview process are welcome to contact 919-513-0574 to speak with a representative of the Office of Equal Opportunity.
If you have general questions about the application process, you may contact Human Resources at (919) 515-2135 or workatncstate@ncsu.edu.
Final candidates are subject to criminal & sex offender background checks. Some vacancies also require credit or motor vehicle checks. Degree(s) must be obtained prior to start date in order to meet qualifications and receive credit.
NC State University participates in E-Verify. Federal law requires all employers to verify the identity and employment eligibility of all persons hired to work in the United States.

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About North Carolina State University

Sourced by ZipRecruiter

North Carolina State University (NCSU), located in Raleigh, NC, US, is a leading educational institution with a strong emphasis on research, academics, and public service. Established in 1887, NCSU operates in the education industry and endeavors to foster student success, and promote economic development by providing high-quality, affordable education, and conducting groundbreaking research across a variety of disciplines. With more than 100 majors, its academic offerings range from undergraduates to postgraduates along with doctoral studies - in various fields like engineering, natural resources, humanities, and social sciences. NCSU is firmly anchored on the core values of respect, responsibility, integrity, and innovation. Its mission is to create economic, societal, and intellectual prosperity for the people of North Carolina and the nation.

Industry

Colleges, universities, and professional schools

Company size

5,001 - 10,000 Employees

Headquarters location

Raleigh, NC, US

Year founded

1887

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