$86K - $146K/yr
Our team needs engineers interested in designing and developing the Microelectronics packages ... Microelectronics packaging materials and materials properties * Electronic component reliability ...
$86K - $146K/yr
Our team needs engineers interested in designing and developing the Microelectronics packages ... Microelectronics packaging materials and materials properties * Electronic component reliability ...
$86K - $146K/yr
Our team needs engineers interested in designing and developing the Microelectronics packages ... Microelectronics packaging materials and materials properties * Electronic component reliability ...
MATERIALS ENGINEER, AI SATELLITES (STARMIND) SpaceX is leveraging its experience deploying and ... Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware ...
MATERIALS ENGINEER, AI SATELLITES (STARMIND) SpaceX is leveraging its experience deploying and ... Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware ...
MS in electrical engineering, mechanical engineering, materials science and engineering, or a ... device packaging * Experience with design of experiments, device testing, data and analysis ...
MS in electrical engineering, mechanical engineering, materials science and engineering, or a ... device packaging * Experience with design of experiments, device testing, data and analysis ...
MATERIALS ENGINEER, AI SATELLITES (STARMIND) SpaceX is leveraging its experience deploying and ... Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware ...
MATERIALS ENGINEER, AI SATELLITES (STARMIND) SpaceX is leveraging its experience deploying and ... Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware ...
MATERIALS ENGINEER, AI SATELLITES (STARMIND) SpaceX is leveraging its experience deploying and ... Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware ...
MATERIALS ENGINEER, AI SATELLITES (STARMIND) SpaceX is leveraging its experience deploying and ... Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware ...
MATERIALS ENGINEER, AI SATELLITES (STARMIND) SpaceX is leveraging its experience deploying and ... Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware ...
MATERIALS ENGINEER, AI SATELLITES (STARMIND) SpaceX is leveraging its experience deploying and ... Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware ...
MATERIALS ENGINEER, AI SATELLITES (STARMIND) SpaceX is leveraging its experience deploying and ... Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware ...
MATERIALS ENGINEER, AI SATELLITES (STARMIND) SpaceX is leveraging its experience deploying and ... Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware ...
Bastrop, TX · On-site
$103K - $142K/yr
SR. MATERIALS ENGINEER, AI SATELLITES (STARMIND) SpaceX is leveraging its experience deploying and ... Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware ...
Bastrop, TX · On-site
$103K - $142K/yr
SR. MATERIALS ENGINEER, AI SATELLITES (STARMIND) SpaceX is leveraging its experience deploying and ... Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware ...
We're looking for a Principal Microelectronic Packaging Engineer to lead the development of next ... Establish improved material and material sets that will create more robust microelectronic ...
New
We're looking for a Principal Microelectronic Packaging Engineer to lead the development of next ... Establish improved material and material sets that will create more robust microelectronic ...
New
The individual is fully conversant with microelectronics packaging technologies and has in-depth ... Prepares design documentation and bill of materials for both chip fabrication, backend wafer ...
The individual is fully conversant with microelectronics packaging technologies and has in-depth ... Prepares design documentation and bill of materials for both chip fabrication, backend wafer ...
... microelectronics, and advanced materials applications aligned with the organization's long-term ... with scientists, engineers, and cross-functional technical teams. The role requires strong ...
... microelectronics, and advanced materials applications aligned with the organization's long-term ... with scientists, engineers, and cross-functional technical teams. The role requires strong ...
The Packaging Materials Senior Engineer is part of our technical services team and delivers customer-oriented support and results for Supply Chain in focus areas of packaging materials, cost savings ...
The Packaging Materials Senior Engineer is part of our technical services team and delivers customer-oriented support and results for Supply Chain in focus areas of packaging materials, cost savings ...
... microelectronics, and advanced materials applications aligned with the organization's long-term ... with scientists, engineers, and cross-functional technical teams. The role requires strong ...
... microelectronics, and advanced materials applications aligned with the organization's long-term ... with scientists, engineers, and cross-functional technical teams. The role requires strong ...
MS in electrical engineering, mechanical engineering, materials science and engineering, or a ... device packaging * Experience with design of experiments, device testing, data and analysis ...
MS in electrical engineering, mechanical engineering, materials science and engineering, or a ... device packaging * Experience with design of experiments, device testing, data and analysis ...
MS in electrical engineering, mechanical engineering, materials science and engineering, or a ... device packaging * Experience with design of experiments, device testing, data and analysis ...
MS in electrical engineering, mechanical engineering, materials science and engineering, or a ... device packaging * Experience with design of experiments, device testing, data and analysis ...
MS in electrical engineering, mechanical engineering, materials science and engineering, or a ... device packaging * Experience with design of experiments, device testing, data and analysis ...
MS in electrical engineering, mechanical engineering, materials science and engineering, or a ... device packaging * Experience with design of experiments, device testing, data and analysis ...
The Packaging Materials Senior Engineer is part of our technical services team and delivers customer-oriented support and results for Supply Chain in focus areas of packaging materials, cost savings ...
The Packaging Materials Senior Engineer is part of our technical services team and delivers customer-oriented support and results for Supply Chain in focus areas of packaging materials, cost savings ...
The Packaging Materials Senior Engineer is part of our technical services team and delivers customer-oriented support and results for Supply Chain in focus areas of packaging materials, cost savings ...
The Packaging Materials Senior Engineer is part of our technical services team and delivers customer-oriented support and results for Supply Chain in focus areas of packaging materials, cost savings ...
The individual is fully conversant with microelectronics packaging technologies and has in-depth ... Prepares design documentation and bill of materials for both chip fabrication, backend wafer ...
The individual is fully conversant with microelectronics packaging technologies and has in-depth ... Prepares design documentation and bill of materials for both chip fabrication, backend wafer ...
Boulder, CO · On-site
Bachelor's degree in Engineering, Physics, Materials Science or a related technical discipline. * Minimum of 10 years of experience in advanced semiconductor packaging development, microelectronics ...
Boulder, CO · On-site
Bachelor's degree in Engineering, Physics, Materials Science or a related technical discipline. * Minimum of 10 years of experience in advanced semiconductor packaging development, microelectronics ...
$19.71 - $24.02
2% of jobs
$24.02 - $28.32
6% of jobs
$32.42 is the 25th percentile. Wages below this are outliers.
$28.32 - $32.63
17% of jobs
$32.63 - $36.93
16% of jobs
The median wage is $39.08 / hr.
$36.93 - $41.24
16% of jobs
$41.24 - $45.54
12% of jobs
$47.59 is the 75th percentile. Wages above this are outliers.
$45.54 - $49.85
11% of jobs
$49.85 - $54.15
6% of jobs
$54.15 - $58.46
5% of jobs
$58.46 - $62.76
4% of jobs
$62.76 - $67.07
3% of jobs
$19
$42
$67
For Microelectronics Packaging Materials Engineer jobs, the most frequently searched job titles are:

On-site
$86K - $146K/yr
Other
Medical, Dental, Vision, Life, Retirement, PTO
Posted 12 days ago
Participate in microelectronics product development activities including packaging concept, preliminary/detailed board design, and packaging road mapping efforts
Coordinate prototype package builds and evaluation efforts
Conduct failure analysis for microelectronics packages
Company:
BAE Systems
Category:
Maintenance
Job Type:
Permanent
City:
Cedar Rapids
State:
Country:
United States
Job Description Because this role involves a combination of collaborative/in-person and independent work, it will take the form of a hybrid work format, with time split between working onsite and remotely. You don’t see it, but it’s there. Our employees work on the world’s most advanced electronics – from saving emissions in the City of Lights to powering the Mars Rover to protecting the F35 fighter jet. At Electronic Systems, you’ll be among the brightest minds, working on the aerospace and defense industry’s most difficult problems. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our missions: “We Protect Those Who Protect Us®” and “We Innovate For Those Who Move The WorldTM.” Sound like a team you want to be a part of? Come build your career with BAE Systems In Navigation and Sensor Systems, we design and manufacture state-of-the-art systems and technology that enable our customers to execute their precision navigation missions. BAE Systems is looking for an experienced Mechanical Engineer with a passion for engineering and the desire to work in the world of Microelectronics Packaging Design. Our team needs engineers interested in designing and developing the Microelectronics packages needed for supporting the next generation of Global Positioning (GPS) products and other platforms that support the war fighter. The position offers abundant opportunity to design and develop state of the art miniaturized electronic devices. As a part of this team, you will have responsibilities spanning all phases of the engineering life cycle including design, process development, qualification, and factory support. The successful applicant should be knowledgeable in microelectronics packaging concepts and technologies.Primary Responsibilities:
Required Education, Experience, & Skills
Preferred Education, Experience, & Skills
Pay InformationFull-Time Salary Range: $86460 - $146982Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience. Employee Benefits: At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being. Regular employees scheduled to work 20+ hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance. Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave. Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards. Other incentives may be available based on position level and/or job specifics.
D.O.M. magazine is the premier magazine for aviation maintenance management professionals. Its management-focused editorial provides information maintenance managers need and want including business best practices, professional development, regulatory, quality management, legal issues and more. The digital version of D.O.M. magazine is available for free on all devices (iOS, Android, and Amazon Kindle).
#J-18808-Ljbffr