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Microelectronics Packaging Materials Engineer Jobs

3M HEALTHCARE

R&D Product Development Engineer

Atlanta, GA · On-site

$55K - $110K/yr

... design-review materials. * Draft and execute test protocols, verification plans, engineering ... Advanced degree in engineering, MEMS, microelectronics, packaging, mechanical systems, or a related ...

Protingent

Materials Engineer

Bellevue, WA · On-site

$36 - $65/hr

Materials Engineer Position Description: Protingent Staffing has an exciting contract Materials ... Citizen, U.S. Legal Permanent Resident, or of a protected person status Benefits Package:

Mercury Systems

Principal Electrical Engineer

Phoenix, AZ

$130K - $159K/yr

Manage the design of microelectronic digital and RF packaged circuits that meet system and customer ... Bachelor's or higher-level degree in Electrical Engineering, Computer Engineering, or equivalent

Intel

Silicon Packaging Design Engineer

Phoenix, AZ · On-site

$105K - $149K/yr

... Engineering, or Material Sciences disciplines. * 6+ months of experience with the following ... Experience and/or familiarity with microelectronic package or PCB physical layout design and ...

Booz Allen Hamilton

Materials Engineer

Warren, MI · On-site

$69K - $158K/yr

Materials Engineer The Opportunity: Research, develop, characterize, and certify materials ... package for employees. This posting will close within 90 days from the Posting Date. Identity ...

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Microelectronics Packaging Materials Engineer information

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How much do microelectronics packaging materials engineer jobs pay per hour?

As of Sep 11, 2026, the average hourly pay for microelectronics packaging materials engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What are popular job titles related to Microelectronics Packaging Materials Engineer jobs?

For Microelectronics Packaging Materials Engineer jobs, the most frequently searched job titles are:

Infographic showing various Microelectronics Packaging Materials Engineer job openings in the United States as of June 2026, with employment types broken down into 98% Full Time, and 2% Temporary. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.

Sr. Materials Engineer, AI Satellites (Starmind)

Bastrop, TX • On-site

SpaceX
Aerospace Product and Parts Manufacturing • 1 - 5K employees
Learn more about SpaceXexternal

$103K - $142K/yr

Other

Re-posted 20 days ago

SpaceX rating

8.7

Company rating: 8.7 out of 10

Based on 152 frontline employees who took The Breakroom Quiz

Job description

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.
SR. MATERIALS ENGINEER, AI SATELLITES (STARMIND)
SpaceX is leveraging its experience deploying and operating the world's largest satellite constellation to develop Starmind, a new constellation of satellites capturing solar energy in space to power low-cost, high-performance AI compute for Earth. Realizing this vision demands highly reliable, high performance electrical compute hardware, solar power systems, thermal radiators, and more. These systems must operate in the extreme environment of space while delivering the connectivity, control, power distribution, and processing needed for orbital AI inference.
The Starmind team designs, builds, and operates the orbital compute fabric of the future. We develop nearly every key piece of technology in house - from the satellites' flight computers and power systems to the fully custom compute electronics, memory, and networking that form the brain of our on-orbit data centers. As a Materials Engineer on the Starmind team, you'll have ownership over the entire life-cycle of the hardware that enables advanced on-orbit AI processing and data center workloads. Your work sits at the intersection of process, packaging, mechanical, and thermal engineering. The Payload team is responsible for the design of industry-leading compute electronics, memory, and networking in order to achieve required domain sizes and processing workloads.
RESPONSIBILITIES:
  • Rapidly develop high-reliability microelectronics packages, cooling systems, and radiator hardware for satellites.
  • Own the full lifecycle of materials specification, validation, and process development- including device modeling, characterization of performance metrics, and materials failure analysis.
  • Drive system trades, requirements capture, materials selection, prototyping, manufacturing, failure analysis.
  • Build supply chains for build-up layers, plating chemicals, coatings, thermal interface materials, and other materials for compute and satellite manufacturing. Define incoming acceptance criteria for materials.
  • Address materials and process challenges in advanced packaging while spearheading the development of next-generation TIM materials to improve packaging performance.
  • Specify and implement in-process metrology tools for quality control. Design thermal test vehicles and test setups to evaluate material/electronic properties. Integrate simulation tools with experimental data to guide and drive targeted improvements via material or process changes.
  • Work closely with engineers from adjacent disciplines (mechanical, thermal, electrical, software, test engineering, supply chain, silicon design, etc.) to deliver tightly integrated, high-performance hardware
  • Challenge assumptions, question requirements, learn from your mistakes, and approach problems with an open mind
  • Manage compliance risks related to materials and processes, ensuring safety and environmental compliance with industry standards.
  • Collaborate closely with leadership and stakeholders across all departments-including design, reliability, production, and supply chain-to integrate materials innovations into product roadmaps and ensure accountability for operations and reliability.

BASIC QUALIFICATIONS
  • Bachelor's degree in materials science, mechanical engineering, or other engineering discipline
  • 5+ years of experience in microelectronics device research or manufacturing

PREFERRED SKILLS AND EXPERIENCE:
  • Advanced degree in materials science or similar field
  • Experience in hardware, robotics, automation, or manufacturing environments
  • Experience designing tooling, fixtures, or jigs for assembly or test applications
  • Exposure to scripting or data analysis tools (e.g., Python, MATLAB, or equivalent) for process data analysis or automation
  • Experience working with precision assemblies, robotic systems, or automated pick-and-place equipment
  • Familiarity with manufacturing process development methodologies (e.g., PFMEA, process capability studies, SPC)
  • Experience with or interest in production data systems, MES, or manufacturing traceability infrastructure
  • Familiarity with cleanroom or controlled-environment manufacturing practices

ADDITIONAL REQUIREMENTS:
  • Ability to work extended hours or weekends as needed for mission critical deadlines
  • Some travel may occasionally be required

ITAR REQUIREMENTS:
    Learn more about the ITAR here.

SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX's Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to

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About SpaceX

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Industry

Aerospace product and parts manufacturing, data services, guided missile and space vehicle manufacturing and satellite telecommunications

Company size

1,001 - 5,000 Employees

Headquarters location

Hawthorne, CA, US

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