$86K - $146K/yr
Our team needs engineers interested in designing and developing the Microelectronics packages needed for supporting the next generation of Global Positioning (GPS) products and other platforms that ...
$86K - $146K/yr
Our team needs engineers interested in designing and developing the Microelectronics packages needed for supporting the next generation of Global Positioning (GPS) products and other platforms that ...
$86K - $146K/yr
Our team needs engineers interested in designing and developing the Microelectronics packages needed for supporting the next generation of Global Positioning (GPS) products and other platforms that ...
We're looking for a Principal Microelectronic Packaging Engineer to lead the development of next-generation packaging technologies that make our microelectronic assemblies smaller, faster to ...
New
We're looking for a Principal Microelectronic Packaging Engineer to lead the development of next-generation packaging technologies that make our microelectronic assemblies smaller, faster to ...
New
Boulder, CO · On-site
... microelectronics, photonics and precision engineering into scalable technology solutions. Its ... Mission The Head of Packaging Engineering will provide technical leadership for the architecture ...
Boulder, CO · On-site
... microelectronics, photonics and precision engineering into scalable technology solutions. Its ... Mission The Head of Packaging Engineering will provide technical leadership for the architecture ...
Bozeman, MT · On-site
As a Photonic Packaging Engineer at PHIX, you will be developing and refining innovative PIC ... Hold an MSc. degree in photonics/optical science, physics, electrical engineering, microelectronics ...
Bozeman, MT · On-site
As a Photonic Packaging Engineer at PHIX, you will be developing and refining innovative PIC ... Hold an MSc. degree in photonics/optical science, physics, electrical engineering, microelectronics ...
Bozeman, MT · On-site
As a Photonic Packaging Engineer at PHIX, you will be developing and refining innovative PIC ... Hold an MSc. degree in photonics/optical science, physics, electrical engineering, microelectronics ...
Bozeman, MT · On-site
As a Photonic Packaging Engineer at PHIX, you will be developing and refining innovative PIC ... Hold an MSc. degree in photonics/optical science, physics, electrical engineering, microelectronics ...
San Diego, CA · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
San Diego, CA · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
Colorado Springs, CO · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
Colorado Springs, CO · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
Santa Clara, CA · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
Santa Clara, CA · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
Colorado Springs, CO · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
Colorado Springs, CO · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
Santa Clara, CA · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
Santa Clara, CA · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
Quick apply
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
Quick apply
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
San Diego, CA · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
San Diego, CA · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
San Diego, CA · On-site
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
Quick apply
San Diego, CA · On-site
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
San Diego, CA · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
San Diego, CA · On-site
$220K - $250K/yr
Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...
The individual is fully conversant with microelectronics packaging technologies and has in-depth ... This individual facilitates the interests of packaging on cross functional engineering teams. This ...
The individual is fully conversant with microelectronics packaging technologies and has in-depth ... This individual facilitates the interests of packaging on cross functional engineering teams. This ...
San Diego, CA · On-site
$110K - $146K/yr
Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: This ... D degree in Mechanical engineering, Material science, Electrical/Microelectronics, or related ...
San Diego, CA · On-site
$110K - $146K/yr
Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: This ... D degree in Mechanical engineering, Material science, Electrical/Microelectronics, or related ...
San Diego, CA · On-site
$154K - $231K/yr
D degree in Mechanical engineering, Material science, Electrical/Microelectronics, or related ... Experience with the fundamentals of IC electronic packaging structures, assembly processes ...
San Diego, CA · On-site
$154K - $231K/yr
D degree in Mechanical engineering, Material science, Electrical/Microelectronics, or related ... Experience with the fundamentals of IC electronic packaging structures, assembly processes ...
Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: This ... D degree in Mechanical engineering, Material science, Electrical/Microelectronics, or related ...
Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: This ... D degree in Mechanical engineering, Material science, Electrical/Microelectronics, or related ...
San Diego, CA · On-site
$110K - $146K/yr
Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: This ... D degree in Mechanical engineering, Material science, Electrical/Microelectronics, or related ...
San Diego, CA · On-site
$110K - $146K/yr
Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: This ... D degree in Mechanical engineering, Material science, Electrical/Microelectronics, or related ...
$19.71 - $24.02
2% of jobs
$24.02 - $28.32
6% of jobs
$32.42 is the 25th percentile. Wages below this are outliers.
$28.32 - $32.63
17% of jobs
$32.63 - $36.93
16% of jobs
The median wage is $39.08 / hr.
$36.93 - $41.24
16% of jobs
$41.24 - $45.54
12% of jobs
$47.59 is the 75th percentile. Wages above this are outliers.
$45.54 - $49.85
11% of jobs
$49.85 - $54.15
6% of jobs
$54.15 - $58.46
5% of jobs
$58.46 - $62.76
4% of jobs
$62.76 - $67.07
3% of jobs
$19
$42
$67
| Aspect | Microelectronics Packaging Engineer | Semiconductor Process Engineer |
|---|---|---|
| Credentials | Bachelor's or Master's in Electrical, Materials, or Mechanical Engineering | Bachelor's or Master's in Electrical, Materials, or Chemical Engineering |
| Work Environment | Designing and testing packaging solutions in labs or manufacturing | Developing and optimizing semiconductor fabrication processes in cleanrooms |
| Industry Usage | Electronics manufacturing, focusing on device protection and integration | Semiconductor fabrication plants, focusing on chip production processes |
While both roles require engineering backgrounds and are vital in electronics manufacturing, Microelectronics Packaging Engineers focus on designing and testing packaging solutions to protect and connect chips, whereas Semiconductor Process Engineers concentrate on developing fabrication processes for semiconductor wafers. Their work environments and industry applications overlap but serve different stages of the electronics production chain.
For Microelectronics Packaging Engineer jobs, the most frequently searched job titles are:

On-site
$86K - $146K/yr
Other
Medical, Dental, Vision, Life, Retirement, PTO
Posted 12 days ago
Participate in microelectronics product development activities including packaging concept, preliminary/detailed board design, and packaging road mapping efforts
Coordinate prototype package builds and evaluation efforts
Conduct failure analysis for microelectronics packages
Company:
BAE Systems
Category:
Maintenance
Job Type:
Permanent
City:
Cedar Rapids
State:
Country:
United States
Job Description Because this role involves a combination of collaborative/in-person and independent work, it will take the form of a hybrid work format, with time split between working onsite and remotely. You don’t see it, but it’s there. Our employees work on the world’s most advanced electronics – from saving emissions in the City of Lights to powering the Mars Rover to protecting the F35 fighter jet. At Electronic Systems, you’ll be among the brightest minds, working on the aerospace and defense industry’s most difficult problems. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our missions: “We Protect Those Who Protect Us®” and “We Innovate For Those Who Move The WorldTM.” Sound like a team you want to be a part of? Come build your career with BAE Systems In Navigation and Sensor Systems, we design and manufacture state-of-the-art systems and technology that enable our customers to execute their precision navigation missions. BAE Systems is looking for an experienced Mechanical Engineer with a passion for engineering and the desire to work in the world of Microelectronics Packaging Design. Our team needs engineers interested in designing and developing the Microelectronics packages needed for supporting the next generation of Global Positioning (GPS) products and other platforms that support the war fighter. The position offers abundant opportunity to design and develop state of the art miniaturized electronic devices. As a part of this team, you will have responsibilities spanning all phases of the engineering life cycle including design, process development, qualification, and factory support. The successful applicant should be knowledgeable in microelectronics packaging concepts and technologies.Primary Responsibilities:
Required Education, Experience, & Skills
Preferred Education, Experience, & Skills
Pay InformationFull-Time Salary Range: $86460 - $146982Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience. Employee Benefits: At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being. Regular employees scheduled to work 20+ hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance. Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave. Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards. Other incentives may be available based on position level and/or job specifics.
D.O.M. magazine is the premier magazine for aviation maintenance management professionals. Its management-focused editorial provides information maintenance managers need and want including business best practices, professional development, regulatory, quality management, legal issues and more. The digital version of D.O.M. magazine is available for free on all devices (iOS, Android, and Amazon Kindle).
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