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Microelectronics Packaging Engineer Jobs (NOW HIRING)

$86K - $146K/yr

Our team needs engineers interested in designing and developing the Microelectronics packages needed for supporting the next generation of Global Positioning (GPS) products and other platforms that ...

... microelectronics, photonics and precision engineering into scalable technology solutions. Its ... Mission The Head of Packaging Engineering will provide technical leadership for the architecture ...

As a Photonic Packaging Engineer at PHIX, you will be developing and refining innovative PIC ... Hold an MSc. degree in photonics/optical science, physics, electrical engineering, microelectronics ...

As a Photonic Packaging Engineer at PHIX, you will be developing and refining innovative PIC ... Hold an MSc. degree in photonics/optical science, physics, electrical engineering, microelectronics ...

Advanced Packaging Engineer

San Diego, CA · On-site

$220K - $250K/yr

Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...

Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...

Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...

Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...

Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...

Advanced Packaging Engineer

San Diego, CA · On-site

$220K - $250K/yr

Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...

Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...

Advanced Packaging Engineer

San Diego, CA · On-site

$220K - $250K/yr

Position Summary The Advanced Packaging Engineer is a senior individual contributor responsible for ... The third location is the Samtec Microelectronics facility in Colorado Springs, CO , with a salary ...

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Microelectronics Packaging Engineer information

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How much do microelectronics packaging engineer jobs pay per hour?

As of Sep 11, 2026, the average hourly pay for microelectronics packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What is a microelectronics packaging engineer?

A Microelectronics Packaging Engineer is a professional who designs, develops, and evaluates the packaging of microelectronic devices such as integrated circuits and semiconductor chips. Their work involves creating solutions that protect delicate electronics, manage heat, and ensure reliable electrical connections within compact spaces. They collaborate with design, manufacturing, and quality teams to optimize packaging for performance, cost, and manufacturability. This role is crucial in industries like consumer electronics, automotive, aerospace, and telecommunications.

What are the key skills and qualifications needed to thrive as a microelectronics packaging engineer?

To thrive as a Microelectronics Packaging Engineer, you typically need a background in electrical or materials engineering, strong knowledge of semiconductor processes, and experience with microelectronic packaging design. Familiarity with CAD software, simulation tools like ANSYS or COMSOL, and industry standards such as IPC or JEDEC is often required. Strong problem-solving skills, attention to detail, and effective cross-functional communication help engineers address complex design and manufacturing challenges. These competencies are crucial for ensuring reliable, high-performance electronic products and successful collaboration in a fast-evolving technological field.

What are some common challenges faced by microelectronics packaging engineers in managing thermal and mechanical stresses during the design process?

Microelectronics Packaging Engineers often encounter challenges in balancing thermal management and mechanical reliability when designing packages for high-performance devices. These challenges include mitigating heat dissipation to prevent overheating, managing thermal expansion mismatches between different materials, and ensuring the integrity of connections under repeated temperature cycling. Collaboration with materials scientists and simulation specialists is common to identify optimal materials and design structures that address these stresses. Staying current with evolving materials and simulation tools is essential for success in this dynamic field.

What is the difference between Microelectronics Packaging Engineer vs Semiconductor Process Engineer?

AspectMicroelectronics Packaging EngineerSemiconductor Process Engineer
CredentialsBachelor's or Master's in Electrical, Materials, or Mechanical EngineeringBachelor's or Master's in Electrical, Materials, or Chemical Engineering
Work EnvironmentDesigning and testing packaging solutions in labs or manufacturingDeveloping and optimizing semiconductor fabrication processes in cleanrooms
Industry UsageElectronics manufacturing, focusing on device protection and integrationSemiconductor fabrication plants, focusing on chip production processes

While both roles require engineering backgrounds and are vital in electronics manufacturing, Microelectronics Packaging Engineers focus on designing and testing packaging solutions to protect and connect chips, whereas Semiconductor Process Engineers concentrate on developing fabrication processes for semiconductor wafers. Their work environments and industry applications overlap but serve different stages of the electronics production chain.

What are popular job titles related to Microelectronics Packaging Engineer jobs?

For Microelectronics Packaging Engineer jobs, the most frequently searched job titles are:

Infographic showing various Microelectronics Packaging Engineer job openings in the United States as of August 2026, with employment types broken down into 94% Full Time, 2% Part Time, and 4% Contract. Highlights an 85% Physical, 5% Hybrid, and 10% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.

Senior Mechanical Engineer - Microelectronics Packaging (Hybrid)

On-site

$86K - $146K/yr

Other

Medical, Dental, Vision, Life, Retirement, PTO

Posted 12 days ago


Key responsibilities

  • Participate in microelectronics product development activities including packaging concept, preliminary/detailed board design, and packaging road mapping efforts

  • Coordinate prototype package builds and evaluation efforts

  • Conduct failure analysis for microelectronics packages


Job description

Company:

BAE Systems

Category:

Maintenance

Job Type:

Permanent

City:

Cedar Rapids

State:

Country:

United States

Job Description Because this role involves a combination of collaborative/in-person and independent work, it will take the form of a hybrid work format, with time split between working onsite and remotely. You don’t see it, but it’s there. Our employees work on the world’s most advanced electronics – from saving emissions in the City of Lights to powering the Mars Rover to protecting the F35 fighter jet. At Electronic Systems, you’ll be among the brightest minds, working on the aerospace and defense industry’s most difficult problems. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our missions: “We Protect Those Who Protect Us®” and “We Innovate For Those Who Move The WorldTM.” Sound like a team you want to be a part of? Come build your career with BAE Systems In Navigation and Sensor Systems, we design and manufacture state-of-the-art systems and technology that enable our customers to execute their precision navigation missions. BAE Systems is looking for an experienced Mechanical Engineer with a passion for engineering and the desire to work in the world of Microelectronics Packaging Design. Our team needs engineers interested in designing and developing the Microelectronics packages needed for supporting the next generation of Global Positioning (GPS) products and other platforms that support the war fighter. The position offers abundant opportunity to design and develop state of the art miniaturized electronic devices. As a part of this team, you will have responsibilities spanning all phases of the engineering life cycle including design, process development, qualification, and factory support. The successful applicant should be knowledgeable in microelectronics packaging concepts and technologies.Primary Responsibilities:

  • Contribute to program pursuits and bid estimates
  • Participate in Microelectronics product development activities including packaging concept, preliminary/detailed board design and packaging road mapping efforts
  • Develop technologies required for next generation packages
  • Coordinate prototype package builds and evaluation efforts
  • Conduct failure analysis for microelectronics packages
  • Support factory transition of products
  • Provide manufacturing support for Microelectronics assemblies currently in production
Requirements:

Required Education, Experience, & Skills

  • All applicants must be able to obtain a DoD Security Clearance at time of application (REQUIRED)
  • Bachelor's degree in Engineering with focus on Mechanical, Aerospace or Material Engineering and 4+ years of direct microelectronics packaging related experience or equivalent

Preferred Education, Experience, & Skills

  • Microelectronics design and manufacturing assembly
  • Microelectronics packaging materials and materials properties
  • Electronic component reliability testing
  • Post wafer fabrication processes
  • Additive manufacturing
  • Wafer fabrication processes
  • Advanced thermal packaging design

Pay InformationFull-Time Salary Range: $86460 - $146982Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience. Employee Benefits: At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being. Regular employees scheduled to work 20+ hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance. Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave. Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards. Other incentives may be available based on position level and/or job specifics.

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