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Ltd Module Development Engineer Jobs (NOW HIRING)

INTEL

Module Development Engineer

Portland, OR · On-site

$94K - $133K/yr

Microelectronic Packaging Collateral Engineers provide project management, equipment collateral design/development, and sustaining support for integrated circuit or semiconductor assemblies, various ...

Intel

WATD Module Development Engineer

Hillsboro, OR · On-site

Join the Wafer Assembly Technology Development Group (WATD) As a Module Development Engineer, you will play a key role in driving innovation and excellence within Intel's advanced semiconductor ...

INTEL

Packaging Module Development Engineer

Vernonia, OR · On-site

... Engineering, or a related discipline. * 4+ years of hands-on experience in packaging module development, process characterization, or equipment optimization. Preferred Qualifications: * Experience in ...

INTEL

Packaging Module Development Engineer

Portland, OR · On-site

... Engineering, or a related discipline. * 4+ years of hands-on experience in packaging module development, process characterization, or equipment optimization. Preferred Qualifications: * Experience in ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$94K - $133K/yr

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

$115K - $219K/yr

The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ

$127K - $179K/yr

As a Packaging Module Development Engineer, you will take the lead in designing and optimizing advanced packaging processes and equipment that enable Intel's cutting-edge semiconductor technologies.

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

$133K - $188K/yr

As a Packaging Module Development Engineer, you will take the lead in designing and optimizing advanced packaging processes and equipment that enable Intel's cutting-edge semiconductor technologies.

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How much do ltd module development engineer jobs pay per year?

As of Aug 19, 2026, the average yearly pay for ltd module development engineer in the United States is $96,155.00, according to ZipRecruiter salary data. Most workers in this role earn between $79,500.00 and $106,500.00 per year, depending on experience, location, and employer.

What is an Ltd Module Development Engineer?

An Ltd Module Development Engineer is a professional who specializes in the design, development, and optimization of specific modules or components within a larger technical system, often in industries like semiconductors or electronics manufacturing. Their role typically involves collaborating with cross-functional teams to develop process modules, ensuring they meet performance, reliability, and quality standards. They may also troubleshoot issues, implement improvements, and support the integration of new technologies or processes into production environments. This position requires strong technical skills, problem-solving abilities, and knowledge of industry standards.

What are the key skills and qualifications needed to thrive as a Ltd Module Development Engineer?

To thrive as a Ltd Module Development Engineer, you need a strong background in engineering principles, semiconductor process knowledge, and typically a degree in materials science, chemical engineering, or a related field. Familiarity with semiconductor fabrication tools, statistical process control (SPC) software, and industry-specific certifications such as Six Sigma can be highly beneficial. Strong problem-solving skills, teamwork, and effective communication are crucial soft skills for success in collaborative and fast-evolving technical environments. These skills and qualifications are important for ensuring robust process development, rapid problem resolution, and innovation in semiconductor manufacturing.

What are some typical challenges faced by an Ltd Module Development Engineer when integrating new technologies into existing manufacturing processes?

Ltd Module Development Engineers often encounter challenges when introducing new technologies, such as aligning new module designs with legacy systems and ensuring seamless compatibility. They must address issues related to process optimization, troubleshooting unanticipated technical problems, and collaborating closely with cross-functional teams like process engineers, quality assurance, and production staff. Effective communication and adaptability are key, as balancing innovation with manufacturing constraints is a regular part of the role. Overcoming these challenges provides valuable experience and can open doors to senior engineering or technical leadership positions.

What cities are hiring for Ltd Module Development Engineer jobs?

Cities with the most Ltd Module Development Engineer job openings:

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Ltd Module Development Engineer jobs near you

Module Development Engineer

INTEL

Portland, OR • On-site

$94K - $133K/yr

Full-time

Medical, Retirement, PTO

Re-posted 12 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers

Job description

Job Description

Microelectronic Packaging Collateral Engineers provide project management, equipment collateral design/development, and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components, and/or completed units.

Responsibilities include but are not limited to the following:

  • Responsible for the thermal/mechanical/electrical design, analysis, and development of collaterals.
  • Defines overall package performance and specification and realizes technology certification through qualification plans and data collection.
  • Conducts tests and research on basic materials and properties.
  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.
  • Provides consultation concerning packaging problems and improvements in the packaging process.
  • Responds to customer/client requests or events as they occur.
  • Develops solutions to problems utilizing formal education and engineering judgment.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:


Candidate must possess a bachelor's degree in mechanical engineering or related STEM field and 6+ months of experience.

Experience listed above should be a combination of the following:


Mechanical Design, CAD/SolidWorks/Drive works/RSS analysis/Geometric Dimensioning/Finite Eliminate Analysis experience.


Preferred Qualifications:


3+ years of experience with one or more of the following:


Material handling systems including high speed/accuracy pick-n-place, motion control and vision systems.
Fundamental science and engineering concepts in development to create a novel design solutions for high volume manufacturing process.
Stakeholder management (ex.supplier/ project management/internal partner management)
Semiconductor devices and packaging processes and technology.
Technical and analytical skills, with the knowledge of statistical design of experiments and problem-solving techniques.


Inside this Business Group
Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $94,300.00-$133,200.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

What Intel employees say

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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