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Internship Packaging Engineer Jobs in Arizona (NOW HIRING)

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

$133K - $188K/yr

Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ... packaging, materials engineering, or related advanced technology environments. Preferred ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

As a Packaging Module Development Engineer, you will: Contribute to the advancement of technology ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

$85K - $162K/yr

Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

Intel

Packaging Module Development Engineer

Phoenix, AZ · On-site

... packaging technology development and partner engineering groups on process/technology maturity for ... and or internship experiences. Minimum Qualifications: * Bachelor's degree with 4+ years of ...

Stryker

$35/hr

What You Get Out of the Internship At Stryker, we believe that developing the next generation of ... Opportunities Available As a Mechanical Engineering intern at Stryker, you will be placed in one of ...

Stryker

Packaging Engineering Intern

Tempe, AZ · On-site

$35/hr

Onsite What You Get Out of the Internship At Stryker, we believe that developing the next ... Opportunities Available As a Mechanical Engineering intern at Stryker, you will be placed in one of ...

Stryker

Packaging Engineering Intern

Tempe, AZ

$35/hr

What You Get Out of the Internship At Stryker, we believe that developing the next generation of ... Opportunities Available As a Mechanical Engineering intern at Stryker, you will be placed in one of ...

Stryker

Packaging Engineering Intern

Tempe, AZ · On-site

$35/hr

What You Get Out of the Internship At Stryker, we believe that developing the next generation of ... Opportunities Available As a Mechanical Engineering intern at Stryker, you will be placed in one of ...

Stryker

Packaging Engineering Intern

Tempe, AZ · On-site

$35/hr

Onsite What You Get Out of the Internship At Stryker, we believe that developing the next ... Product Engineering R&D interns in Product Engineering work with cross-functional teams ...

Intel

Silicon Packaging Design Engineer

Phoenix, AZ · On-site

$105K - $149K/yr

As a Silicon Packaging Design Engineer, you will play a pivotal role in driving the development of ... internship experiences. Minimum Qualifications * Bachelors with 1+ years of experience or master ...

Intel

$16.75 - $21.50/hr

Silicon & Packaging Engineer * Emerging Technologies & Research roles Build technical expertise ... Hands-on coursework, research, projects, or internship experience related to the role family.

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Internship Packaging Engineer information

What is the difference between Internship Packaging Engineer vs Packaging Engineer?

AspectInternship Packaging EngineerPackaging Engineer
QualificationsEnrolled in or recent graduate of relevant engineering or packaging programBachelor's or higher in packaging, mechanical, or industrial engineering
Work EnvironmentInternship setting, often in manufacturing or R&D departmentsFull-time professional role in manufacturing, design, or supply chain
ResponsibilitiesAssisting with packaging design, testing, and process improvementsDesigning, testing, and implementing packaging solutions independently
Experience LevelEntry-level, learning-focusedMid-level professional with some experience

The main difference between an Internship Packaging Engineer and a Packaging Engineer is experience and responsibility. Internships are designed for students or recent graduates gaining initial industry exposure, while Packaging Engineers are full-time professionals responsible for designing and optimizing packaging solutions.

What are the most commonly searched types of Packaging Engineer jobs in Arizona?

The most popular types of Packaging Engineer jobs in Arizona are:

What cities in Arizona are hiring for Internship Packaging Engineer jobs?

Cities in Arizona with the most Internship Packaging Engineer job openings:

Internship Packaging Engineer jobs near you

Packaging Module Development Engineer

Phoenix, AZ • On-site

Intel
Manufacturing • 10K+ employees
Learn more about Intelexternal

$133K - $188K/yr

Full-time

Medical, Retirement, PTO

Re-posted 11 days ago

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

Job description

Job Details:Job Description: 

The Packaging Module Development Engineer develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces. Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows. Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods. Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability. Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms. Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods. Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur. Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

Qualifications:

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 1+ years of experience.
  • 1+ years of experience applying statistical analysis techniques including Design of Experiments (DOE), Statistical Process Control (SPC), and data-driven problem solving, for technical root cause analysis.
  • 1+ years of experience with process development, characterization, optimization, or qualification in semiconductor manufacturing, packaging, materials engineering, or related advanced technology environments.

Preferred Qualifications:

  • Experience using data analysis tools such as Python, MATLAB, JMP, Minitab, or equivalent software.
  • Knowledge of reliability engineering principles, failure mechanisms, and accelerated stress testing methods.
  • Minimum cumulative GPA of 3.5
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

What Intel employees say

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Benefits

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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