Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
As a Packaging Module Development Engineer, you will: Contribute to the advancement of technology ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
As a Packaging Module Development Engineer, you will: Contribute to the advancement of technology ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$115K - $219K/yr
Job Details: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is ... and/or internship experiences. Minimum Qualifications * PhD degree in Mechanical Engineering ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$115K - $219K/yr
Job Details: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is ... and/or internship experiences. Minimum Qualifications * PhD degree in Mechanical Engineering ...
As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
As a Packaging Module Development Engineer, you will. • Contribute to the advancement of ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
As a Packaging Module Development Engineer, you will. • Contribute to the advancement of ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$115K - $219K/yr
Job Details: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is ... and/or internship experiences. Minimum Qualifications * PhD degree in Mechanical Engineering ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$115K - $219K/yr
Job Details: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is ... and/or internship experiences. Minimum Qualifications * PhD degree in Mechanical Engineering ...
... a Signal and Power Integrity Engineer in the Advanced Packaging design team, you will be ... every stage - from internship to retirement and through life's most important moments. Our ...
... a Signal and Power Integrity Engineer in the Advanced Packaging design team, you will be ... every stage - from internship to retirement and through life's most important moments. Our ...
... a Signal and Power Integrity Engineer in the Advanced Packaging design team, you will be ... every stage - from internship to retirement and through life's most important moments. Our ...
... a Signal and Power Integrity Engineer in the Advanced Packaging design team, you will be ... every stage - from internship to retirement and through life's most important moments. Our ...
What You Can Expect As an Advanced Packaging Design engineer, responsibilities include ... every stage - from internship to retirement and through life's most important moments. Our ...
What You Can Expect As an Advanced Packaging Design engineer, responsibilities include ... every stage - from internship to retirement and through life's most important moments. Our ...
Advanced Packaging Design
Chandler, AZ · On-site
$133K/yr
What You Can Expect As an Advanced Packaging Design engineer, responsibilities include ... every stage - from internship to retirement and through life's most important moments. Our ...
Advanced Packaging Design
Chandler, AZ · On-site
$133K/yr
What You Can Expect As an Advanced Packaging Design engineer, responsibilities include ... every stage - from internship to retirement and through life's most important moments. Our ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
As a Packaging Module Development Engineer, you will.Contribute to the advancement of technology ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
As a Packaging Module Development Engineer, you will.Contribute to the advancement of technology ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
Senior Technical Solutions Engineer - Advanced Packaging
Phoenix, AZ · On-site
$54.75 - $70.75/hr
... Engineer - Advanced Packaging and become the cornerstone of customer success for our key Packaging ... experience, internship experience and / or schoolwork/classes/research. The preferred ...
Senior Technical Solutions Engineer - Advanced Packaging
Phoenix, AZ · On-site
$54.75 - $70.75/hr
... Engineer - Advanced Packaging and become the cornerstone of customer success for our key Packaging ... experience, internship experience and / or schoolwork/classes/research. The preferred ...
Mechanical Design Engineer - Semiconductor Packaging
$105K - $149K/yr
Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly. Develop and ... internship experiences. Minimum Skills and Qualifications: US Citizenship required. Ability to ...
Mechanical Design Engineer - Semiconductor Packaging
$105K - $149K/yr
Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly. Develop and ... internship experiences. Minimum Skills and Qualifications: US Citizenship required. Ability to ...
Internship Packaging Engineer information
What is the difference between Internship Packaging Engineer vs Packaging Engineer?
| Aspect | Internship Packaging Engineer | Packaging Engineer |
|---|---|---|
| Qualifications | Enrolled in or recent graduate of relevant engineering or packaging program | Bachelor's or higher in packaging, mechanical, or industrial engineering |
| Work Environment | Internship setting, often in manufacturing or R&D departments | Full-time professional role in manufacturing, design, or supply chain |
| Responsibilities | Assisting with packaging design, testing, and process improvements | Designing, testing, and implementing packaging solutions independently |
| Experience Level | Entry-level, learning-focused | Mid-level professional with some experience |
The main difference between an Internship Packaging Engineer and a Packaging Engineer is experience and responsibility. Internships are designed for students or recent graduates gaining initial industry exposure, while Packaging Engineers are full-time professionals responsible for designing and optimizing packaging solutions.
What are the most commonly searched types of Packaging Engineer jobs in Arizona? The most popular types of Packaging Engineer jobs in Arizona are:
What cities in Arizona are hiring for Internship Packaging Engineer jobs? Cities in Arizona with the most Internship Packaging Engineer job openings:
Full-time
Medical, Retirement, PTO
Posted 6 days ago
Intel rating
8.8
Based on 143 frontline employees who took The Breakroom Quiz
8th of 139 rated electronics manufacturers
Job description
Job Details:
Job Description:
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape. You will directly contribute to the development, optimization, and integration of processes and equipment that shape the future of product performance, quality, and reliability. By leveraging your technical expertise, you will help ensure that Intel delivers exceptional results to meet the demands of a rapidly evolving industry.
Key Responsibilities:
Qualifications:
You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
Preferred Qualifications
We invite you to apply and bring your expertise, creativity, and passion for innovation to Intel. Be a part of our mission to create world-class packaging solutions and help shape the future of technology.
Job Type:
College Grad
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
Job Description:
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape. You will directly contribute to the development, optimization, and integration of processes and equipment that shape the future of product performance, quality, and reliability. By leveraging your technical expertise, you will help ensure that Intel delivers exceptional results to meet the demands of a rapidly evolving industry.
Key Responsibilities:
- Design and develop assembly processes and equipment to enable future packaging technologies.
- Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
- Create and maintain specifications for processes and equipment using Design of Experiments (DOE) and data analysis principles.
- Conduct tests under simulated field conditions, including heat, humidity, temperature cycling, and dynamic forces, to evaluate silicon and packaging technologies.
- Oversee the manufacturability of package designs and manage their manufacturing cycles.
- Establish material specifications and collaborate with supplier quality and procurement teams to ensure compliance with performance requirements.
- Develop innovative techniques, tools, and quality screens to assess packaging quality and reliability.
- Set reliability standards based on a strong understanding of failure mechanisms and influence design, material selection, and process development accordingly.
- Provide consultation and technical support for packaging process improvements and respond to customer and client needs.
- Drive standardization in product qualification and manufacturing quality systems while collaborating with engineering teams to meet key product milestones.
Qualifications:
You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field with 1+ years of relevant experience or Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field.
- Experience listed above should be a combination of the following:
- Familiarity with equipment adjustment, process characterization, and manufacturability or electronics assembly.
Preferred Qualifications
- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- Hands-on experience in a technology manufacturing environment or semiconductor packaging processes.
- Demonstrated ability to collaborate with cross-functional teams and contribute to time-sensitive projects.
We invite you to apply and bring your expertise, creativity, and passion for innovation to Intel. Be a part of our mission to create world-class packaging solutions and help shape the future of technology.
Job Type:
College Grad
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
About Intel
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Industry
Manufacturing
Company size
10,000+ Employees
Headquarters location
Santa Clara, CA, US
Year founded
1968