Packaging Engineer
$127K - $179K/yr
As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
New
Packaging Engineer
$127K - $179K/yr
As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
New
... internship experiences. Minimum Qualifications * Master's degree in Electrical Engineering ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
New
... internship experiences. Minimum Qualifications * Master's degree in Electrical Engineering ... Benefits We offer a total compensation package that ranks among the best in the industry. It ...
New
... internship experiences and or schoolwork/classes/research. Minimum Qualifications: * Bachelor ... PhD degree in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related ...
New
... internship experiences and or schoolwork/classes/research. Minimum Qualifications: * Bachelor ... PhD degree in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related ...
New
As a Packaging Module Development Engineer, you will: Contribute to the advancement of technology ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
As a Packaging Module Development Engineer, you will: Contribute to the advancement of technology ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$127K - $179K/yr
The Packaging Module Development Engineer will contribute to advancing technology and foundry ... internship experiences. Minimum Qualifications: • Master's degree in Materials Science ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$127K - $179K/yr
The Packaging Module Development Engineer will contribute to advancing technology and foundry ... internship experiences. Minimum Qualifications: • Master's degree in Materials Science ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$133K - $219K/yr
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$133K - $219K/yr
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical ... experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications:
We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical ... experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications:
Packaging Module Development Engineer
Phoenix, AZ · On-site
$133K - $219K/yr
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$133K - $219K/yr
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical ... experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications:
We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical ... experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications:
Packaging Module Development Engineer
Phoenix, AZ · On-site
$99K - $188K/yr
The Packaging Module Development Engineer will contribute to advancing technology and foundry ... internship experiences. Minimum Qualifications: • Master's degree in Materials Science ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$99K - $188K/yr
The Packaging Module Development Engineer will contribute to advancing technology and foundry ... internship experiences. Minimum Qualifications: • Master's degree in Materials Science ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$133K - $219K/yr
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$133K - $219K/yr
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical ... experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications:
We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical ... experience, internship experiences and or schoolwork/classes/research. Minimum Qualifications:
Packaging Module Development Engineer
Phoenix, AZ · On-site
$133K - $219K/yr
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$133K - $219K/yr
... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...
Packaging Module Equipment Development Engineer
$133K - $188K/yr
Job Details: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is ... internship experiences. Minimum Qualifications PhD in Materials Science, Mechanical Engineering ...
Packaging Module Equipment Development Engineer
$133K - $188K/yr
Job Details: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is ... internship experiences. Minimum Qualifications PhD in Materials Science, Mechanical Engineering ...
Packaging Module Equipment Development Engineer
Phoenix, AZ · On-site
$133K - $188K/yr
The Packaging Module Development Engineer will contribute to advancing technology and foundry ... or internship experiences. Minimum Qualifications • PhD in Materials Science, Mechanical ...
Packaging Module Equipment Development Engineer
Phoenix, AZ · On-site
$133K - $188K/yr
The Packaging Module Development Engineer will contribute to advancing technology and foundry ... or internship experiences. Minimum Qualifications • PhD in Materials Science, Mechanical ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$99K - $188K/yr
The Packaging Module Development Engineer will contribute to advancing technology and foundry ... and/or internship experiences. Minimum Qualifications: Master's degree in Materials Science ...
Packaging Module Development Engineer
Phoenix, AZ · On-site
$99K - $188K/yr
The Packaging Module Development Engineer will contribute to advancing technology and foundry ... and/or internship experiences. Minimum Qualifications: Master's degree in Materials Science ...
... a Signal and Power Integrity Engineer in the Advanced Packaging design team, you will be ... every stage - from internship to retirement and through life's most important moments. Our ...
... a Signal and Power Integrity Engineer in the Advanced Packaging design team, you will be ... every stage - from internship to retirement and through life's most important moments. Our ...
... a Signal and Power Integrity Engineer in the Advanced Packaging design team, you will be ... every stage - from internship to retirement and through life's most important moments. Our ...
... a Signal and Power Integrity Engineer in the Advanced Packaging design team, you will be ... every stage - from internship to retirement and through life's most important moments. Our ...
... a Signal and Power Integrity Engineer in the Advanced Packaging design team, you will be ... every stage - from internship to retirement and through life's most important moments. Our ...
... a Signal and Power Integrity Engineer in the Advanced Packaging design team, you will be ... every stage - from internship to retirement and through life's most important moments. Our ...
Internship Packaging Engineer information
What is the difference between Internship Packaging Engineer vs Packaging Engineer?
| Aspect | Internship Packaging Engineer | Packaging Engineer |
|---|---|---|
| Qualifications | Enrolled in or recent graduate of relevant engineering or packaging program | Bachelor's or higher in packaging, mechanical, or industrial engineering |
| Work Environment | Internship setting, often in manufacturing or R&D departments | Full-time professional role in manufacturing, design, or supply chain |
| Responsibilities | Assisting with packaging design, testing, and process improvements | Designing, testing, and implementing packaging solutions independently |
| Experience Level | Entry-level, learning-focused | Mid-level professional with some experience |
The main difference between an Internship Packaging Engineer and a Packaging Engineer is experience and responsibility. Internships are designed for students or recent graduates gaining initial industry exposure, while Packaging Engineers are full-time professionals responsible for designing and optimizing packaging solutions.
What are the most commonly searched types of Packaging Engineer jobs in Arizona? The most popular types of Packaging Engineer jobs in Arizona are:
What cities in Arizona are hiring for Internship Packaging Engineer jobs? Cities in Arizona with the most Internship Packaging Engineer job openings:
$127K - $179K/yr
Full-time
Medical, Retirement, PTO
Posted 2 days ago
Intel rating
8.7
Based on 147 frontline employees who took The Breakroom Quiz
19th of 155 rated electronics manufacturers
Job description
Job Description
Qualifications
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
As a Packaging Module Development Engineer, you will:
• Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
• Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
• Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.
• Manage projects to ensure alignment with product development schedules and execution milestones.
• Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
• Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments
• Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events
The ideal candidate should demonstrate:
• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.
Qualifications
You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
• Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.
• Experience listed above should be a combination of the following:
Programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts.
Preferred Qualifications:
One or more years of experience in one or more of the following areas:
• Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
• Delivery of results for complex, time-critical technical projects.
• Semiconductor fabrication processes and technologies.
• Prior related work experience within a semiconductor foundry.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
About Intel
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Industry
Manufacturing
Company size
10,000+ Employees
Headquarters location
Santa Clara, CA, US
Year founded
1968