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Internship High Performance Computing Engineer Jobs in Riverside, CA

Advantech

RMA System Technician

Tustin, CA · On-site

$24 - $29/hr

Working closely with Engineering, Quality, and Customer Service teams, the RMA Systems Technician ... high-performance computing platforms. We cooperate closely with our partners to help provide ...

Advantech USA

RMA System Technician

Tustin, CA · On-site

$24 - $28/hr

Working closely with Engineering, Quality, and Customer Service teams, the RMA Systems Technician ... high-performance computing platforms. We cooperate closely with our partners to help provide ...

Kaizen Stackup

Thermal/Mechanical Engineer

Santa Ana, CA · On-site

$150K - $170K/yr

... AI, cloud computing, and enterprise infrastructure. Position Summary The Thermal/Mechanical Engineer will design, model, and validate advanced thermal solutions for high-performance memory and ...

Kaizen Stackup

Thermal/Mechanical Engineer

Irvine, CA

$150K - $170K/yr

... AI, cloud computing, and enterprise infrastructure. Position Summary The Thermal/Mechanical Engineer will design, model, and validate advanced thermal solutions for high-performance memory and ...

Kaizen Stackup

Thermal/Mechanical Engineer

Irvine, CA

$150K - $170K/yr

... AI, cloud computing, and enterprise infrastructure. Position Summary The Thermal/Mechanical Engineer will design, model, and validate advanced thermal solutions for high-performance memory and ...

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All JobsHigh Performance Computing Engineer JobsInternship High Performance Computing Engineer JobsInternship High Performance Computing Engineer Jobs in Riverside, CA

Internship High Performance Computing Engineer information

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How much do internship high performance computing engineer jobs pay per hour?

As of Aug 22, 2026, the average hourly pay for internship high performance computing engineer in Riverside, CA is $62.71, according to ZipRecruiter salary data. Most workers in this role earn between $51.39 and $70.96 per hour, depending on experience, location, and employer.

What is an internship high performance computing engineer?

An Internship High Performance Computing (HPC) Engineer is a student or early-career professional who works with advanced computing systems designed for processing large data sets and complex calculations at high speeds. During the internship, they assist in developing, optimizing, and maintaining HPC infrastructure, software, or applications used in scientific research, engineering, or data analysis. The role often involves learning about parallel computing, cluster management, and performance tuning, while gaining hands-on experience with cutting-edge technologies. Interns work under the supervision of experienced HPC engineers, contributing to projects that advance computational capabilities in various fields.

What types of projects can I expect to work on as an internship high performance computing engineer?

As an Internship High Performance Computing (HPC) Engineer, you will typically contribute to projects involving optimization of scientific applications, performance analysis, and cluster management. Interns often assist with benchmarking software, troubleshooting issues in parallel computing environments, and supporting researchers with technical solutions. You'll likely collaborate closely with senior HPC engineers, system administrators, and academic researchers to ensure efficient use of computing resources. This hands-on experience provides valuable insight into real-world challenges faced in HPC environments and helps build a strong foundation for future roles in the field.

What are the key skills and qualifications needed to thrive as an internship high performance computing engineer?

To thrive as an Internship High Performance Computing Engineer, you need a solid background in computer science fundamentals, programming (especially in C/C++ or Python), and a familiarity with parallel computing concepts, often supported by coursework or relevant project experience. Experience with Linux environments, HPC clusters, and distributed computing frameworks, as well as tools like MPI, OpenMP, or Slurm, is commonly required. Strong problem-solving skills, attention to detail, and the ability to collaborate effectively within technical teams help interns stand out. These skills ensure you can efficiently support computational research, resolve technical challenges, and contribute meaningfully to HPC projects.

What is the difference between Internship High Performance Computing Engineer vs Internship Data Scientist?

AspectInternship High Performance Computing EngineerInternship Data Scientist
Required SkillsProgramming (C++, Python), parallel computing, HPC systemsStatistics, machine learning, data analysis, Python/R
Work EnvironmentResearch labs, tech companies, academia with focus on HPC systemsTech firms, finance, healthcare, research institutions
Industry UsageHigh-performance computing projects, scientific simulationsData analysis, predictive modeling, business insights

Internship High Performance Computing Engineers focus on developing and optimizing computational systems for large-scale scientific and engineering problems, requiring skills in parallel programming and HPC environments. In contrast, Internship Data Scientists analyze data to extract insights, using statistical and machine learning techniques. Both roles are valuable in tech and research sectors but differ in technical focus and daily tasks.

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The top searched job categories for Internship High Performance Computing Engineer jobs in Riverside, CA are:

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Cities near Riverside, CA with the most Internship High Performance Computing Engineer job openings:

Internship High Performance Computing Engineer jobs near you

IC Package Thermal Mechanical Engineer

Broadcom

Irvine, CA • On-site

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 16 days ago

Broadcom rating

8.7

Company rating: 8.7 out of 10

Based on 23 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers

Job description

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Job Description:
IC Package Thermal Mechanical Engineer

About the Role

This role focuses on the mechanical design and thermo-mechanical simulation of complex, advanced semiconductor packages used in high-performance computing (HPC), AI, and networking products. As an IC Package Engineer, you will leverage advanced multiphysics simulations to optimize reliability, ensure high product yield, and resolve manufacturing challenges from early product definition through New Product Introduction (NPI).

This position offers a dynamic balance: 70% advanced simulation and modeling work, and 30% hands-on lab experiments in reliability testing (e.g., Electromigration, Temperature Cycling [TCT], and drop tests).

Key Responsibilities

  • Advanced Simulation & Modeling (70%): Develop, perform, and validate advanced numerical Finite Element Analysis (FEA) and multiphysics models to evaluate package stress, strain, deformation, warpage, thermal cycling, and delamination.

  • Physics-Driven Design: Apply an in-depth understanding of structural mechanics, fluids, and heat transfer to solve complex chip-package and package-board interaction challenges.

  • Workflow Automation: Streamline simulation workflows by developing reusable model-generation, post-processing, design-of-experiments (DOE), and reliability-data-analysis tools (Ansys APDL, Python, or MATLAB). Leverage Machine Learning, Generative AI, and numerical tools to build automated user interfaces.

  • Empirical Reliability Lab Work (30%): Conduct and oversee hands-on reliability lab testing to investigate package failure mechanisms and utilize experimental data to define and predict overall product reliability.

Minimum Qualifications

  • Education & Experience: Bachelor's degree with 8+ years of relevant industry experience; OR a Master's degree with 6+ years; OR a PhD with 3+ years of experience in Mechanical Engineering, Material Sciences, or a related field with an emphasis on solid mechanics.

  • Core Engineering Knowledge: Deep understanding of electronic packaging structures and advanced materials. Ability to evaluate complex numerical simulations against first principles (e.g., strength of materials solutions). Working knowledge of electromigration and general silicon/IC packaging reliability.

  • FEA Proficiency: Hands-on expertise with major Finite Element Method (FEM) tools, specifically ANSYS (Classic/Mechanical).

  • Programming & Scripting: Strong capability in Ansys APDL, MATLAB, and Python.

Preferred Qualifications

  • Electromigration Reliability Experience: Experience supporting electromigration assessments by developing accelerated testing for package-level interconnects (including BGA balls, C4 bumps, Cu pillars, microbumps, and metallization structures), and partnering with failure-analysis teams to identify root causes of degradation.

  • Material Characterization: Hands-on experience performing mechanical testing and utilizing experimental material characterization metrologies (e.g., DMA/TMA, nano-indentation).

  • Thermal Analysis: Previous thermal engineering background utilizing tools such as Icepak and Flotherm.

  • Advanced Tech: Experience integrating Machine Learning and Gen-AI applications into engineering workflows is highly desired.


Compensation and Benefits


The annual base salary range for this position is USD 109,700.00 To USD 175,500.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.


Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.


Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.


If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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