We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description • Work with cross-functional teams and lead package integration and architecture efforts ...
We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description • Work with cross-functional teams and lead package integration and architecture efforts ...
IC Packaging Design & Layout Engineer
Cambridge, MA · On-site
$82K - $220K/yr
The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced integrated circuit (IC) packaging solutions that meet performance, power, size, and reliability ...
IC Packaging Design & Layout Engineer
Cambridge, MA · On-site
$82K - $220K/yr
The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced integrated circuit (IC) packaging solutions that meet performance, power, size, and reliability ...
IC Packaging Design & Layout Engineer
$82K - $220K/yr
The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced integrated circuit (IC) packaging solutions that meet performance, power, size, and reliability ...
IC Packaging Design & Layout Engineer
$82K - $220K/yr
The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced integrated circuit (IC) packaging solutions that meet performance, power, size, and reliability ...
This position is part of Qualcomm's Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomm's current/future chipsets using FEA expertise ...
This position is part of Qualcomm's Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomm's current/future chipsets using FEA expertise ...
Sr. IC Packaging Engineer - Mechanical Simulation
San Diego, CA · On-site
$110K - $146K/yr
This position is part of Qualcomm's Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomm's current/future chipsets using FEA expertise ...
Sr. IC Packaging Engineer - Mechanical Simulation
San Diego, CA · On-site
$110K - $146K/yr
This position is part of Qualcomm's Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomm's current/future chipsets using FEA expertise ...
Photonic Packaging Engineer
Bozeman, MT · On-site
... integrated circuits? Do you thrive on solving complex challenges in electronic and photonic IC ... As a Photonic Packaging Engineer at PHIX, you will be developing and refining innovative PIC ...
Photonic Packaging Engineer
Bozeman, MT · On-site
... integrated circuits? Do you thrive on solving complex challenges in electronic and photonic IC ... As a Photonic Packaging Engineer at PHIX, you will be developing and refining innovative PIC ...
General Summary This position is part of Qualcomm's Integrated Circuits (IC) Packaging organization ... The Director will lead a team of engineers responsible for delivering FEA-based mechanical ...
General Summary This position is part of Qualcomm's Integrated Circuits (IC) Packaging organization ... The Director will lead a team of engineers responsible for delivering FEA-based mechanical ...
Engineering Group, Engineering Group > Packaging Engineering General Summary ... This position is part of Qualcomm's Integrated Circuits (IC) Packaging organization and represents ...
Engineering Group, Engineering Group > Packaging Engineering General Summary ... This position is part of Qualcomm's Integrated Circuits (IC) Packaging organization and represents ...
Package Integration Engineer
San Francisco, CA · On-site
$122K - $164K/yr
Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.
Package Integration Engineer
San Francisco, CA · On-site
$122K - $164K/yr
Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.
$85K - $146K/yr
## Packaging Integration Engineer (2026 New College Graduate)Applylocations: Essex Junctiontime type: Full timeposted on: Posted Todayjob requisition id: JR-2603869**About GlobalFoundries*
$85K - $146K/yr
## Packaging Integration Engineer (2026 New College Graduate)Applylocations: Essex Junctiontime type: Full timeposted on: Posted Todayjob requisition id: JR-2603869**About GlobalFoundries*
Packaging Integration Engineer (2026 New College Graduate)
Essex, MD · On-site
$85K - $146K/yr
## Packaging Integration Engineer (2026 New College Graduate)Applylocations: Essex Junctiontime type: Full timeposted on: Posted Todayjob requisition id: JR-2603869**About GlobalFoundries*
Packaging Integration Engineer (2026 New College Graduate)
Essex, MD · On-site
$85K - $146K/yr
## Packaging Integration Engineer (2026 New College Graduate)Applylocations: Essex Junctiontime type: Full timeposted on: Posted Todayjob requisition id: JR-2603869**About GlobalFoundries*
Packaging Assembly Engineer
Austin, TX · On-site
$184K - $324K/yr
We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In ... Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ...
Packaging Assembly Engineer
Austin, TX · On-site
$184K - $324K/yr
We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In ... Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ...
Senior IC Package Design Engineer Location: Santa Clara, CA (Onsite) Duration: 6 Months (Ongoing ... Familiarity with IC packaging technologies, materials, substrate design rules and assembly rules
Quick apply
Senior IC Package Design Engineer Location: Santa Clara, CA (Onsite) Duration: 6 Months (Ongoing ... Familiarity with IC packaging technologies, materials, substrate design rules and assembly rules
Packaging Assembly Engineer
Austin, TX · On-site
$184K - $324K/yr
We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In ... Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ...
Packaging Assembly Engineer
Austin, TX · On-site
$184K - $324K/yr
We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In ... Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ...
IC Packaging Design & Layout Engineer
Cambridge, MA · On-site
$82K - $220K/yr
Summary The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced integrated circuit (IC) packaging solutions that meet performance, power, size, and ...
IC Packaging Design & Layout Engineer
Cambridge, MA · On-site
$82K - $220K/yr
Summary The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced integrated circuit (IC) packaging solutions that meet performance, power, size, and ...
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description • In this role, you will be working on stress and deformation simulation of IC ...
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description • In this role, you will be working on stress and deformation simulation of IC ...
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description In this role, you will be working on stress and deformation simulation of IC packages ...
We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM ... Description In this role, you will be working on stress and deformation simulation of IC packages ...
... Advanced IC Packaging , with particular focus on 2.5D and 3DIC design flows . This role requires ... Practical scripting experience using Tcl and Python to automate or integrate workflows across ...
... Advanced IC Packaging , with particular focus on 2.5D and 3DIC design flows . This role requires ... Practical scripting experience using Tcl and Python to automate or integrate workflows across ...
Packaging Engineer
San Francisco, CA · On-site
Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.
Packaging Engineer
San Francisco, CA · On-site
Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.
Integration Engineer (Senior) 112-151
Saint Louis, MO · On-site
$101K - $136K/yr
The N2W Senior Integration Engineer will serve as a member of the N2W Active IT and project team ... Active TS/SCI and the willingness to sit for a polygraph, if needed IC-CAP provides equal ...
Integration Engineer (Senior) 112-151
Saint Louis, MO · On-site
$101K - $136K/yr
The N2W Senior Integration Engineer will serve as a member of the N2W Active IT and project team ... Active TS/SCI and the willingness to sit for a polygraph, if needed IC-CAP provides equal ...
Ic Packaging Integration Engineer information
See salary details
$44.5K - $56.2K
0% of jobs
$56.2K - $68K
2% of jobs
$68K - $79.7K
3% of jobs
$79.7K - $91.4K
7% of jobs
$91.4K - $103.1K
10% of jobs
$104.7K is the 25th percentile. Wages below this are outliers.
$103.1K - $114.9K
16% of jobs
The median wage is $121.3K / yr.
$114.9K - $126.6K
21% of jobs
$136.9K is the 75th percentile. Wages above this are outliers.
$126.6K - $138.3K
18% of jobs
$138.3K - $150K
10% of jobs
$150K - $161.8K
7% of jobs
$161.8K - $173.5K
5% of jobs
$44.5K
$124.3K
$173.5K
How much do ic packaging integration engineer jobs pay per year?
As of Sep 13, 2026, the average yearly pay for ic packaging integration engineer in the United States is $124,275.00, according to ZipRecruiter salary data. Most workers in this role earn between $104,000.00 and $140,000.00 per year, depending on experience, location, and employer.
What are popular job titles related to Ic Packaging Integration Engineer jobs?
For Ic Packaging Integration Engineer jobs, the most frequently searched job titles are:
IC Package Integration Lead
San Francisco, CA • On-site
Apple
• Computer and Electronic Product Manufacturing • 10K+ employees10,000+ employees
Full-time
Re-posted 12 hours ago
Apple rating
8.1
Based on 684 frontline employees who took The Breakroom Quiz
Job description
Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team.
Description
• Work with cross-functional teams and lead package integration and architecture efforts.
• Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs.
• Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.
• People managerial skills highly desirable.
• Travel - 5-10%
Minimum Qualifications
BS and 10+ years of relevant industry experience.
Preferred Qualifications
We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development, Managerial skills highly desired.
Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA.
Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.
Background and Knowledge of Cellular/Connectivity/PMU packaging highly desirable.
Excellent problem solving with strong physics and fundamentals.
Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.
Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost.
Ability to work independently and take on projects with minimum supervision.
Ability to lead and manage teams.
Description
• Work with cross-functional teams and lead package integration and architecture efforts.
• Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs.
• Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.
• People managerial skills highly desirable.
• Travel - 5-10%
Minimum Qualifications
BS and 10+ years of relevant industry experience.
Preferred Qualifications
We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development, Managerial skills highly desired.
Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA.
Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.
Background and Knowledge of Cellular/Connectivity/PMU packaging highly desirable.
Excellent problem solving with strong physics and fundamentals.
Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.
Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost.
Ability to work independently and take on projects with minimum supervision.
Ability to lead and manage teams.
About Apple
Sourced by ZipRecruiter
Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.
Industry
Computer and electronic product manufacturing
Company size
10,000+ Employees
Headquarters location
Cupertino, CA, US
Year founded
1976