... IC Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture ...
... IC Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture ...
... IC Packaging Engineer to join our team! Description * You will be responsible for IC packaging development * Work with cross‑functional teams and lead SoC Package integration and architecture ...
... IC Packaging Engineer to join our team! Description * You will be responsible for IC packaging development * Work with cross‑functional teams and lead SoC Package integration and architecture ...
IC Packaging Integration Engineer
$184K - $324K/yr
... IC Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture ...
IC Packaging Integration Engineer
$184K - $324K/yr
... IC Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture ...
IC Packaging Integration Engineer
Austin, TX · On-site
$184K - $324K/yr
... IC Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture ...
IC Packaging Integration Engineer
Austin, TX · On-site
$184K - $324K/yr
... IC Packaging Engineer to join our team! Description • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture ...
We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description - Work with cross-functional teams and lead package integration and architecture efforts ...
We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description - Work with cross-functional teams and lead package integration and architecture efforts ...
IC Packaging Integration Engineer
Bodega Bay, CA · On-site
$184K - $324K/yr
We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description - Work with cross-functional teams and lead package integration and architecture efforts ...
IC Packaging Integration Engineer
Bodega Bay, CA · On-site
$184K - $324K/yr
We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description - Work with cross-functional teams and lead package integration and architecture efforts ...
IC Packaging Integration Engineer
San Francisco, CA · On-site
$184K - $324K/yr
We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description * Work with cross-functional teams and lead package integration and architecture efforts.
IC Packaging Integration Engineer
San Francisco, CA · On-site
$184K - $324K/yr
We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. Description * Work with cross-functional teams and lead package integration and architecture efforts.
IC Packaging Engineer - WLP
California, MO · On-site
$100 - $125/hr
Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical ... integration across SoC and advanced packaging projects. Join our WLP team and help develop next ...
IC Packaging Engineer - WLP
California, MO · On-site
$100 - $125/hr
Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical ... integration across SoC and advanced packaging projects. Join our WLP team and help develop next ...
Packaging Integration Engineer
Essex Junction, VT · On-site
$143K - $247K/yr
Summary of Role As a Packaging Engineer within GF's Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh ...
Packaging Integration Engineer
Essex Junction, VT · On-site
$143K - $247K/yr
Summary of Role As a Packaging Engineer within GF's Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh ...
$143K - $247K/yr
As a Packaging Engineer within GF's Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged ...
$143K - $247K/yr
As a Packaging Engineer within GF's Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged ...
Packaging Integration Engineer
Essex, MD · On-site
$143K - $247K/yr
As a Packaging Engineer within GF's Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged ...
Packaging Integration Engineer
Essex, MD · On-site
$143K - $247K/yr
As a Packaging Engineer within GF's Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged ...
Packaging Integration Engineer
Essex Junction, VT · Hybrid
$143K - $247K/yr
Summary of Role As a Packaging Engineer within GF's Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh ...
Packaging Integration Engineer
Essex Junction, VT · Hybrid
$143K - $247K/yr
Summary of Role As a Packaging Engineer within GF's Integrated Optics organization, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh ...
IC Packaging Design Engineer
Hillsboro, OR · On-site
$148K/yr
Role : IC Packaging Design Engineer LOC: Chandler, AZ or Hillsboro, OR (ONSITE) Experience : !0+ years Skills Required : - Bachelor s or Master s degree in Electrical /Electronics Engineering ...
IC Packaging Design Engineer
Hillsboro, OR · On-site
$148K/yr
Role : IC Packaging Design Engineer LOC: Chandler, AZ or Hillsboro, OR (ONSITE) Experience : !0+ years Skills Required : - Bachelor s or Master s degree in Electrical /Electronics Engineering ...
IC Packaging Design Engineer
Chandler, AZ · On-site
$138K/yr
We are seeking experienced IC Packaging Design Engineers to support advanced semiconductor packaging programs. The ideal candidates will possess strong expertise in package and substrate design, with ...
IC Packaging Design Engineer
Chandler, AZ · On-site
$138K/yr
We are seeking experienced IC Packaging Design Engineers to support advanced semiconductor packaging programs. The ideal candidates will possess strong expertise in package and substrate design, with ...
Packaging Assembly Engineer
Austin, TX · On-site
We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In ... Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ...
Packaging Assembly Engineer
Austin, TX · On-site
We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In ... Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ...
Senior IC Packaging Designer
Atlanta, GA · On-site
$98K - $104K/yr
... engineers, testing teams, and manufacturing partners to ensure successful integration of silicon ... IC packaging. * Must be willing to work full-time, onsite, in Atlanta, GA. Preferred Skills:
Senior IC Packaging Designer
Atlanta, GA · On-site
$98K - $104K/yr
... engineers, testing teams, and manufacturing partners to ensure successful integration of silicon ... IC packaging. * Must be willing to work full-time, onsite, in Atlanta, GA. Preferred Skills:
We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This ...
We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This ...
We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This ...
We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This ...
Advanced Packaging Integration Engineer
Santa Clara, CA · On-site
$161K - $221K/yr
As an Advanced Packaging Integration Engineer , you will lead process integration for high-performance interconnects and micro-LED panels. You will architect robust, scalable integration flows that ...
Advanced Packaging Integration Engineer
Santa Clara, CA · On-site
$161K - $221K/yr
As an Advanced Packaging Integration Engineer , you will lead process integration for high-performance interconnects and micro-LED panels. You will architect robust, scalable integration flows that ...
Advanced Packaging Integration Engineer
Santa Clara, CA · Hybrid
$161K - $221K/yr
As an Advanced Packaging Integration Engineer , you will lead process integration for highperformance interconnects and micro-LED panels. You will architect robust, scalable integration flows that ...
Advanced Packaging Integration Engineer
Santa Clara, CA · Hybrid
$161K - $221K/yr
As an Advanced Packaging Integration Engineer , you will lead process integration for highperformance interconnects and micro-LED panels. You will architect robust, scalable integration flows that ...
Ic Packaging Integration Engineer information
See salary details
$44.5K - $56.2K
0% of jobs
$56.2K - $68K
2% of jobs
$68K - $79.7K
3% of jobs
$79.7K - $91.4K
7% of jobs
$91.4K - $103.1K
10% of jobs
$104.7K is the 25th percentile. Wages below this are outliers.
$103.1K - $114.9K
16% of jobs
The median wage is $121.3K / yr.
$114.9K - $126.6K
21% of jobs
$136.9K is the 75th percentile. Wages above this are outliers.
$126.6K - $138.3K
18% of jobs
$138.3K - $150K
10% of jobs
$150K - $161.8K
7% of jobs
$161.8K - $173.5K
5% of jobs
$44.5K
$124.3K
$173.5K
How much do ic packaging integration engineer jobs pay per year?
As of Sep 9, 2026, the average yearly pay for ic packaging integration engineer in the United States is $124,275.00, according to ZipRecruiter salary data. Most workers in this role earn between $104,000.00 and $140,000.00 per year, depending on experience, location, and employer.
What are popular job titles related to Ic Packaging Integration Engineer jobs?
For Ic Packaging Integration Engineer jobs, the most frequently searched job titles are:
IC Packaging Integration Engineer
Austin, TX • On-site
Apple •
Computer and Electronic Product Manufacturing • 10K+ employees10,000+ employees
Full-time
Re-posted 24 days ago
Apple rating
8.1
Based on 684 frontline employees who took The Breakroom Quiz
6th of 30 rated technology retailers
Job description
Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for versatile and passionate IC Packaging Engineer to join our team!
Description
• You will be responsible for IC packaging development
• Work with cross-functional teams and lead SoC Package integration and architecture efforts
• Drive the industry with advanced package solutions, new material developments, and specs
Minimum Qualifications
BS and 10+ years of experience in relevant industry experience
Preferred Qualifications
MS/PhD and 6+ years of experience in relevant industry.
We are looking for someone experienced in the semiconductor packaging and/or system integration.
Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration.
Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.
Excellent problem solving with strong physics and fundamentals.
Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.
Basic knowledge of signal integrity/power integrity.
Ability to review schematics, package/PCB layout and designs in Allegro.
Description
• You will be responsible for IC packaging development
• Work with cross-functional teams and lead SoC Package integration and architecture efforts
• Drive the industry with advanced package solutions, new material developments, and specs
Minimum Qualifications
BS and 10+ years of experience in relevant industry experience
Preferred Qualifications
MS/PhD and 6+ years of experience in relevant industry.
We are looking for someone experienced in the semiconductor packaging and/or system integration.
Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration.
Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.
Excellent problem solving with strong physics and fundamentals.
Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.
Basic knowledge of signal integrity/power integrity.
Ability to review schematics, package/PCB layout and designs in Allegro.
About Apple
Sourced by ZipRecruiter
Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.
Industry
Computer and electronic product manufacturing
Company size
10,000+ Employees
Headquarters location
Cupertino, CA, US
Year founded
1976