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Ic Chip Packaging Process Engineer Jobs (NOW HIRING)

Stabilus

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Packaging Process Engineer

Gastonia, NC · On-site

$75K - $94K/yr

Packaging Process Engineer | Stabilus USA | Gastonia, NC | 13 August 2026 Job Summary The Packaging Process Engineer position is based at our U.S. Corporate Headquarters in Gastonia, NC. Under the ...

Stabilus

Packaging Process Engineer

Gastonia, NC · On-site

$75K - $95K/yr

Packaging Process Engineer | Stabilus USA | Gastonia, NC | 13 August 2026 Job Summary The Packaging Process Engineer position is based at our U.S. Corporate Headquarters in Gastonia, NC. Under the ...

Actalent

Senior Process Engineer

Carlsbad, CA

$106K - $138K/yr

Job Title: Senior Process Engineer This Senior Process Engineer role focuses on developing ... Design and implement advanced packaging processes, with a primary focus on flip chip assembly and ...

Conductor

Packaging Engineer- Flip Chip

Austin, TX · On-site

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This spans bump ...

Conductor

Packaging Engineer- Flip Chip

Boston, MA · On-site

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This spans bump ...

Arthrex

Sr. Packaging Process Engineer

Fort Myers, FL · On-site

Requisition ID: 66057 Title: Sr. Packaging Process Engineer Arthrex, Inc. is a global medical device company and a leader in new product development and medical education in orthopedics. Arthrex is ...

ARTHREX

Sr. Packaging Process Engineer

Fort Myers, FL · On-site

Requisition ID: 66057 Title: Sr. Packaging Process Engineer Arthrex, Inc. is a global medical device company and a leader in new product development and medical education in orthopedics. Arthrex is ...

Heico

Process Engineer

Blacksburg, VA · On-site

$65K - $125K/yr

Reporting to the Process Engineering Manager, the Process Engineer will be a key member within our ... Strong materials science and failure analysis (FA) knowledge related to assembly chip-packaging ...

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Ic Chip Packaging Process Engineer information

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$49.5K

$92K

$142.5K

How much do ic chip packaging process engineer jobs pay per year?

As of Sep 10, 2026, the average yearly pay for ic chip packaging process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What are popular job titles related to Ic Chip Packaging Process Engineer jobs?

For Ic Chip Packaging Process Engineer jobs, the most frequently searched job titles are:

Infographic showing various Ic Chip Packaging Process Engineer job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 79% Full Time, 16% Part Time, 3% Contract, and 1% Nights. Highlights an 90% Physical, 2% Hybrid, and 8% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.

Sr. Silicon Packaging Process Engineer, Silicon Technology (Starlink)

Bastrop, TX

SpaceX
Aerospace Product and Parts Manufacturing • 1 - 5K employees
Learn more about SpaceXexternal

Full-time

Re-posted 21 days ago

SpaceX rating

8.7

Company rating: 8.7 out of 10

Based on 152 frontline employees who took The Breakroom Quiz

Job description

SR. SILICON PACKAGING PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK)

SpaceX is leveraging its experience in building rockets and spacecraft to deploy Starlink, the world's most advanced broadband internet system. Starlink is the world's largest satellite constellation and is providing fast, reliable internet to 4M+ users worldwide. We design, build, test, and operate all parts of the system - thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We've only begun to scratch the surface of Starlink's potential global impact. As we continue to upgrade and expand the constellation, we're looking for best-in-class engineers to join the team.

In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. We are looking for hands-on and dynamic engineers with expertise in semiconductor packaging design, process development, equipment, and test. You will assume full ownership of packaging products and process modules and take them from concept to mass production as we strive to make Starlink more affordable to those who need it most.

RESPONSIBILITIES:  

  • Own packaging assembly processes from concept to mass production including equipment and material selection for wafer-level and chip-level systems
  • Develop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach
  • Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
  • Own packaging prototypes, product development and release to production
  • Select equipment and material to meet quality, reliability, cost, yield, and production targets
  • Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements
  • Cross-functional interface with IC design, materials, thermal, systems, and production teams
  • Implement advanced packaging solutions into SpaceX next generation products

BASIC QUALIFICATIONS: 

  • Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other applied engineering discipline  
  • 5+ years of professional experience in semiconductor assembly and packaging

PREFERRED SKILLS AND EXPERIENCE: 

  • Advanced technical degree
  • 7+ years industry experience with microelectronics packaging development
  • Packaging familiarity with flip-chip, BGA, fcCSP, WLCSP, fan out FO processes, system-in-package SiP, multi-chip modules MCM, panel level packaging, heterogenous and chiplet integration
  • Hands-on packaging, PCB, PCBA, or SMT assembly experience
  • OSAT (outsource semiconductor assembly and test) experience a plus

What SpaceX employees say

Pay

Benefits

Hours and flexibility

Workplace

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About SpaceX

Sourced by ZipRecruiter

Industry

Aerospace product and parts manufacturing, data services, guided missile and space vehicle manufacturing and satellite telecommunications

Company size

1,001 - 5,000 Employees

Headquarters location

Hawthorne, CA, US

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