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Ic Chip Packaging Process Engineer Jobs (NOW HIRING)

Process Engineer

Blacksburg, VA ยท On-site

$65K - $125K/yr

Reporting to the Process Engineering Manager, the Process Engineer will be a key member within our ... Strong materials science and failure analysis (FA) knowledge related to assembly chip-packaging ...

Process Engineer

Blacksburg, VA ยท On-site

$65K - $125K/yr

Reporting to the Process Engineering Manager, the Process Engineer will be a key member within our ... Strong materials science and failure analysis (FA) knowledge related to assembly chip-packaging ...

Principal Chip Lead

Milpitas, CA ยท Hybrid

$180K - $261K/yr

... processes and break free from repetitive designs and older processes limitations. Empower ... MS or PhD in Electrical Engineering with 12+ years' experience in Power IC design * Experience in ...

In this role, you will own the process development of New Product Introduction, architecting new ... Strong materials science and failure analysis (FA) knowledge related to assembly chip-packaging ...

Principal Chip Lead

Milpitas, CA ยท On-site

$180K - $261K/yr

... processes and break free from repetitive designs and older processes limitations. Empower ... MS or PhD in Electrical Engineering with 12+ years' experience in Power IC design * Experience in ...

This position requires someone familiar with development process of simulation and characterization ... of chip-package interaction and package-board interaction to ensure good device yield and ...

In this role, you will own the process development of New Product Introduction, architecting new ... Strong materials science and failure analysis (FA) knowledge related to assembly chip-packaging ...

In this role, you will own the process development of New Product Introduction, architecting new ... Strong materials science and failure analysis (FA) knowledge related to assembly chip-packaging ...

Be Seen First

Follow technical stage gate process, create package development plan & timeline and manage project budget * Must demonstrate an ability to thrive in a fast-paced and consumer driven environment. * 15 ...

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Ic Chip Packaging Process Engineer information

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$49.5K

$92K

$142.5K

How much do ic chip packaging process engineer jobs pay per year?

As of Sep 10, 2026, the average yearly pay for ic chip packaging process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What are popular job titles related to Ic Chip Packaging Process Engineer jobs?

For Ic Chip Packaging Process Engineer jobs, the most frequently searched job titles are:

Infographic showing various Ic Chip Packaging Process Engineer job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 79% Full Time, 16% Part Time, 3% Contract, and 1% Nights. Highlights an 90% Physical, 2% Hybrid, and 8% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.

Process Engineer

Blacksburg, VA โ€ข On-site

$65K - $125K/yr

Full-time

Medical, Dental, Life, Retirement, PTO

Re-posted yesterday


Job description

VPT, Inc., a global leader in providing power conversion solutions for use in avionics, military, space and industrial applications, has an immediate opening for a Process Engineer. This is a full-time position located in our Blacksburg, VA headquarters. Reporting to the Process Engineering Manager, the Process Engineer will be a key member within our Quality Department.
Responsibilities will include:
  • Support our overseas manufacturing site by addressing production, quality and material supply challenges while driving process improvement to increase yield and throughput.
  • Perform root cause and corrective action (RCCA) investigation via DOEs on product failures.
  • Manage small to medium scale capital projects such as equipment selection and implementation.
  • Create, edit, and review production documentation.
  • Perform new material evaluation and run qualifications.
  • Establish relationships with suppliers to ensure quality and timely deliveries.
  • Support new product development and scale-up from prototype to full production.
  • Travel (international and domestic) to production facilities.

Because of the nature of the position, a US Person is required.
The anticipated starting salary range for this position is $65,000 - $125,000 annually
Salary Range Disclaimer: The base salary range represents the low and high end of the VPT, Inc., starting salary range for this position. Actual starting salary will vary depending on location, education and experience. The range listed is just one factor of the VPT, Inc., total compensation package. Other factors include paid holidays, paid time off, health and dental insurance, 401(k) with match, disability insurance, life insurance and flexible spending accounts.
VPT, Inc., is an Equal Opportunity/VET/Disability Employer
Qualifications:
Required:
Bachelor's degree in either of the following:
  • Materials Science and Engineering
  • Mechanical Engineering
  • Industrial Engineering

Preferred:
  • Background in electronic assembly process.
  • Background in MIL-STD, J-STD or IPC Standards.
  • Ability to work in cross-functional teams.
  • Strong materials science and failure analysis (FA) knowledge related to assembly chip-packaging, materials and reliability failures.
  • Proficient in applying DOE vs. Hypothesis tool for root cause analysis.
  • Strong knowledge of process optimization techniques and Lean Six Sigma methodologies.
  • Proficiency in Microsoft Office Suite and excellent written and verbal communication skills.
  • Environmental testing experience (thermal, shock, vibration, etc.)
  • 3D modeling and drafting (SolidWorks preferred)