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Full Time Principal Packaging Engineer Jobs (NOW HIRING)

Skyworks

Principal Packaging Engineer

Irvine, CA · On-site

$129K - $247K/yr

Principal Packaging Engineer Posting Start Date: 3/23/26 Job Location(s): San Jose If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks ...

PDI

Principal Packaging Engineer

Woodcliff Lake, NJ · On-site

POSITION PURPOSE As the Principal Packaging Engineer, you will serve as the enterprise-wide technical expert and strategic lead in FDA regulated packaging. The position leverage deep knowledge in ...

Skyworks

Principal Packaging Engineer

Irvine, CA · On-site

$129K - $247K/yr

We are seeking a Principal Packaging Engineer with expertice in advanced laminate packaging technologies to support new product development (NPI) of RF System in Package (SiP) modules. Candidate will ...

Conagra Brands

Principal Packaging Engineer

Chicago, IL · Hybrid

$109K - $159K/yr

You will also act as a technical mentor and key resource for packaging engineering platforms. A Taste of Your Responsibilities * Champion ideas for technology improvements, compliance requirements ...

CONAGRA

Principal Packaging Engineer

Chicago, IL · On-site

$109K - $159K/yr

You will also act as a technical mentor and key resource for packaging engineering platforms. A Taste of Your Responsibilities * Champion ideas for technology improvements, compliance requirements ...

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Full Time Principal Packaging Engineer information

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$74K

$147.2K

$212.5K

How much do full time principal packaging engineer jobs pay per year?

As of Aug 26, 2026, the average yearly pay for full time principal packaging engineer in the United States is $147,220.00, according to ZipRecruiter salary data. Most workers in this role earn between $118,500.00 and $173,000.00 per year, depending on experience, location, and employer.

What is the difference between Full Time Principal Packaging Engineer vs Packaging Engineer?

AspectFull Time Principal Packaging EngineerPackaging Engineer
Required CredentialsBachelor's or Master's in Packaging, Engineering, or related field; extensive experienceBachelor's degree in Packaging, Engineering, or related field; entry to mid-level experience
Work EnvironmentDesign labs, manufacturing facilities, cross-functional teamsManufacturing plants, R&D labs, production lines
Employer & Industry UsageConsumer goods, pharmaceuticals, electronics companiesPackaging suppliers, manufacturing firms, FMCG companies

The Full Time Principal Packaging Engineer typically holds more advanced credentials and has a strategic, leadership-oriented role in designing and overseeing packaging solutions. Packaging Engineers focus on developing and testing packaging designs, often at an operational level. The principal role involves higher responsibility, project management, and cross-department collaboration, whereas Packaging Engineers are more involved in execution and technical development.

Are full time principal packaging engineers in demand?

Full time principal packaging engineers are in demand due to the ongoing need for innovative packaging solutions across industries such as consumer goods, pharmaceuticals, and electronics. They typically require strong technical skills, experience with packaging design and materials, and knowledge of industry standards, making experienced professionals valuable in the job market.
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Full Time Principal Packaging Engineer jobs near you
Infographic showing various Full Time Principal Packaging Engineer job openings in the United States as of August 2026, with employment types broken down into 94% Full Time, 2% Part Time, and 4% Contract. Highlights an 85% Physical, 5% Hybrid, and 10% Remote job distribution, with an average salary of $147,220 per year, or $70.8 per hour.

Principal Packaging Engineer

Irvine, CA • On-site

Skyworks
Construction • 201 - 500 employees
Learn more about Skyworksexternal

$129K - $247K/yr

Full-time

Medical, Retirement, PTO

Re-posted 19 days ago

Job description

Principal Packaging Engineer
Posting Start Date: 3/23/26
Job Location(s): San Jose
If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.
At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.
Requisition ID: 77070
Job Description:
Description
  • We are seeking a Principal Packaging Engineer with expertice in advanced laminate packaging technologies to support new product development (NPI) of RF System in Package (SiP) modules. Candidate will be the RF packaging interface between multi-functional groups within Skyworks and internal/external manufacturing.
  • This position offers significant opportunities for growth, including leading strategic packaging initiatives and influencing Skyworks packaging technology roadmap. Leadership experience, either as a program manager, people manager, or technical lead is a strong plus.
  • On-site location is flexiable. Desired location in San Jose CA or Irvine CA.

Responsibilities
  • Working with IC design teams to define and implement the package requirements.
  • Ownership of specific product from feasibility stage to high volume production.
  • Ensuring that DFM/BKM is implemented for assembly yield, cost, and reliability.
  • Developing new assembly technologies, running process DOE's, identifying new materials and equipment, reliability testing, and qualification of new assembly process.

Required Experience and Skills
  • BS Degree in either Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science.
  • Minimum 12 years experience (or MS and 8 years) in semiconductor packaging technology
  • Strong project management and communication skills (verbal, written, and presentation).
  • Expertise with overmolded laminate module packaging processes: SMT, Wirebonding, Die Attach, and Molding.
  • Knowledge of various assembly processes: Flip Chip Bumping, Fan Out, WLCSP, BGA, Module Level Shielding, and IPDs.
  • Experience in Advanced RF SiP Moldules: Dual Side BGA, Dual Side Mold Grid Array, EMI Shielding,
  • Experience working with OSAT Assembly Factories in Asia.

Desired Experience and Skills
  • Solid understanding of Design Rules Check and Design for Manufacturing
  • Hands on experience with assembly process/equipment.
  • Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
  • Understanding of RF products and concepts is highly desired.
  • Experience with Failure Analysis.
  • Understanding of Module and Board Level Reliability requirements.
  • Understanding of manufacturing of organic laminate technologies.
  • Experience with Lead-Frame Packaging.
  • Prior R&D experience of advanced packaging concepts.

#LI-JR1
The typical base pay range for this role across the U.S. is currently USD $129,400 - $247,800 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.
Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.
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About Skyworks

Sourced by ZipRecruiter

We are empowering the wireless networking revolution, connecting people, places and things around the world. As the demand for ubiquitous, “always-on” connectivity increasingly expands, our innovative, high performance analog semiconductors are enabling breakthrough communication platforms from global industry leaders – changing the way we live, work, play and learn. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

Industry

Construction

Company size

201 - 500 Employees

Headquarters location

Buffalo, NY, US

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