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Full Time Lithography Engineer Jobs (NOW HIRING)

Micron

Semiconductor Process Engineer - Photo

New York, NY · On-site

$107K - $182K/yr

... lithography processes that directly shape future memory technologies. You will work hands-on with ... This role is full time at the NYCreates site in Albany, New York. You will collaborate with our ...

Amat

Lithography Process Engineer IV

Santa Clara, CA

$147K - $202K/yr

Who We Are Applied Materials is a global leader in materials engineering solutions used to produce ... Full time Employee Type: Assignee / Regular Travel: Not Specified Relocation Eligible: No The ...

Micron

Dry Etch Process Develop Engineer

New York, NY

$107K - $182K/yr

... full time at the NYC site in Albany, New York. You will collaborate with our EUV Photo Lithography ... D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering ...

Micron

Dry Etch Process Develop Engineer

New York, NY

$107K - $182K/yr

... full time at theNYC site in Albany, New York. You will collaborate with our EUV Photo Lithography ... D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering ...

QCi

Process Engineer - H1

Arizona, LA · On-site

... lithography (photolithography, electron beam lithography) and metrology (SEM, AFM, TEM, stylus ... Employment Type: FULL_TIME

Photonic

Nanofabrication Technician

Los Angeles, CA · On-site

$86K - $119K/yr

The base annual salary range for this full-time role is $86,600 to $119,000 USD. This range ... Collaborate with researchers and engineers to develop and optimize new processes. * Maintain ...

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All JobsLithography Engineer JobsFull Time Lithography Engineer Jobs

Full Time Lithography Engineer information

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$38K

$115.9K

$191.5K

How much do full time lithography engineer jobs pay per year?

As of Jul 8, 2026, the average yearly pay for full time lithography engineer in the United States is $115,864.00, according to ZipRecruiter salary data. Most workers in this role earn between $83,000.00 and $151,500.00 per year, depending on experience, location, and employer.

What is the difference between Full Time Lithography Engineer vs Part Time Lithography Technician?

AspectFull Time Lithography EngineerPart Time Lithography Technician
CredentialsBachelor's in Engineering or related field, certifications in lithography processesRelevant technical certifications, experience preferred
Work EnvironmentFull-time in cleanroom or semiconductor fabPart-time shifts, often in similar environments
Industry UsageCommon in semiconductor manufacturing companiesUsed in research labs or smaller facilities

The main difference between a Full Time Lithography Engineer and a Part Time Lithography Technician lies in their work hours, responsibilities, and level of expertise. Full Time Lithography Engineers typically hold more advanced credentials, work full-time in manufacturing environments, and oversee complex lithography processes. Part Time Lithography Technicians usually have relevant certifications, work fewer hours, and support lithography tasks. Both roles are essential in semiconductor production, but the engineer role involves greater responsibility and technical oversight.

What are some common challenges faced by Full Time Lithography Engineers, and how can they be addressed?

Full Time Lithography Engineers often encounter challenges such as maintaining precise alignment and pattern fidelity as semiconductor device geometries shrink. Keeping up with the rapid pace of technology advancements and troubleshooting process variations are also common. Successful engineers stay proactive by collaborating closely with process integration and equipment teams, regularly analyzing data, and participating in continuous training. Adaptability and strong problem-solving skills are key to overcoming these hurdles and ensuring consistent manufacturing quality.

What are the key skills and qualifications needed to thrive as a Full Time Lithography Engineer, and why are they important?

A Full Time Lithography Engineer typically needs a degree in electrical engineering, physics, materials science, or a related field, along with a deep understanding of semiconductor fabrication processes. Proficiency with lithography tools (such as stepper/scanner systems), cleanroom protocols, and relevant software (like CAD and process control systems) is crucial. Strong analytical thinking, problem-solving, and teamwork skills help engineers excel in troubleshooting and optimizing complex processes. These skills ensure high yield, process efficiency, and technological advancement in semiconductor manufacturing.

What is a Full Time Lithography Engineer?

A Full Time Lithography Engineer is a professional who specializes in the process of printing patterns onto semiconductor wafers, a crucial step in manufacturing microchips and electronic devices. They work with advanced equipment and techniques to ensure precise pattern transfer, troubleshoot process issues, and optimize production yields. Lithography Engineers play a key role in the semiconductor industry, collaborating with other engineers to develop and improve fabrication processes. Their work helps enable the production of faster, smaller, and more efficient electronic components.
More about Full Time Lithography Engineer jobs
What cities are hiring for Full Time Lithography Engineer jobs? Cities with the most Full Time Lithography Engineer job openings:
What are the most commonly searched types of Lithography Engineer jobs? The most popular types of Lithography Engineer jobs are:
What job categories do people searching Full Time Lithography Engineer jobs look for? The top searched job categories for Full Time Lithography Engineer jobs are:
Full Time Lithography Engineer jobs near you
Infographic showing various Full Time Lithography Engineer job openings in the United States as of July 2026, with employment types broken down into 95% Full Time, 2% Part Time, and 3% Contract. Highlights an 87% Physical, 4% Hybrid, and 9% Remote job distribution, with an average salary of $115,864 per year, or $55.7 per hour.

Process Integration Engineer

Absolics Inc

Covington, GA • On-site

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Posted 7 days ago

Job description

Job Title: R&D Engineer - Process Integration
Location: Covington, GA
Job Type: Full-Time
About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.
Job Description:
We are seeking a highly skilled and experienced Process Integration Engineer to join our team. The successful candidate will be responsible for orchestrating and integrating critical process steps, such as:
  • dielectric materials selection and application
  • lithography
  • wet + dry clean/etch/develop processes
  • PVD and electroplating

into a coherent, manufacturable process flow for fine-pitch, next-generation packaging architectures. You will support finalizing various Process Integration Plans, defining design rules, managing process window tradeoffs across module boundaries, and be the primary technical decision-maker to help navigate constraints in the full process flow. You will work daily with the lithography, wet/dry process, dielectric, and plating engineers, translating their individual process capabilities into a working end-to-end flow, while also engaging with device/package design teams on architectures feasibility. In an early-stage environment, this role carries enormous influence on the finalized architecture and build-up decisions.
Key Responsibilities:
  • Oversee process integration, manage scheduling, and provide comprehensive progress reports to upper management.
  • Develop and implement process integration strategies to optimize production yield and efficiency.
  • Coordinate with cross-functional teams to ensure seamless integration of processes.
  • Monitor and analyze process performance, identifying areas for improvement.
  • Ensure compliance with industry standards and safety regulations.
  • Troubleshoot and resolve process-related issues in a timely manner.
  • Maintain detailed documentation of processes and procedures.
  • Generate innovative ideas for patent filings.

Required Skills:
  • Demonstrated experience integrating multi-step package build up process flows (SAP and/or damascene), from lithography through metallization and dielectric build-up
  • Strong working knowledge across the full unit-process stack: photolithography, wet/dry etch, PVD seed deposition, dielectric film processing, and electroplating, sufficient to identify cross-process interactions and failure handoffs
  • Experience authoring or owning Process Integration Plans, design rules (line/space, via CD, registration/overlay budgets, taper angle specs), and process flow documentation
  • Track record of root-causing yield or reliability excursions that span multiple process modules (e.g., seed undercut driving downstream plating defects, via CD variation driving lithography-etch mismatch)
  • Statistical process control and DOE methodology for multi-variable, multi-step process optimization
  • Strong cross-functional collaboration skills; ability to translate unit-process engineer findings into integration-level decisions and vice versa
  • Familiarity with metrology and failure analysis techniques across the flow (SEM, FIB cross-section, CD-SEM, overlay metrology, electrical test)
  • Understanding of registration, overlay, and CD budget allocation across sequential build-up layers
  • Fluent in English; proficiency in Korean is a plus.

Preferred Skills
  • Experience with glass core substrates
  • Direct experience scaling fine line/space RDL, including via CD control and multi-layer registration challenges
  • Experience with any next-gen architecture enablement: glass core/glass interposer integration, panel-level processing, co-packaged optics, hybrid bonding, or fan-out heterogeneous integration
  • Familiarity with bifurcated roadmap considerations (high-performance AI/HPC vs. cost-optimized mainstream paths) and how that shapes architecture and material tradeoffs
  • Experience building DFM (design-for-manufacturing) guidelines in collaboration with package design teams
  • Knowledge of reliability qualification frameworks (JEDEC, IPC) as they constrain integration choices
  • Familiarity with new equipment or process technology evaluation and incorporation into an existing flow (e.g., panel-level CMP, advanced laser/plasma drill, novel dielectric chemistries)
  • Experience presenting integration roadmaps or technical reviews to leadership or cross-functional stakeholders
  • Publication, patent, or conference presentation record (e.g., ECTC) in RDL/interconnect integration

Education
  • Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, or related field preferred
  • M.S. with 5+ years of relevant process integration or process engineering experience considered (integration roles typically warrant a higher experience bar than single-unit-process roles)

Benefits:
  • 401K 6% matching (NO vesting period)
  • Healthcare 100% support (Health, Dental, Vision)
  • Life, STD, LTD 100 % support
  • Cell phone allowance
  • PTO and self-development

SALARY:
  • $100,000 - $150,000

Apply