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Flip Chip Jobs (NOW HIRING)

mercury

2nd Shift Die/Wire Bonder

Phoenix, AZ

$17.25 - $22.25/hr

Perform Die Attach, Wire bond, Epoxy Dispense, Flip chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive ...

Mercury Systems

2nd Shift Die/Wire Bonder

Phoenix, AZ · On-site

$17.25 - $22.25/hr

Perform Die Attach, Wire bond, Epoxy Dispense, Flip chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive ...

Nokia

Senior Packaging Development Engineer

Sunnyvale, CA · On-site

$159K - $296K/yr

If you're eager to own the design and development of flip chip, fan out, semiconductor dicing, and reflow processes, while staying abreast of cutting-edge technologies, we encourage you to apply!

Nokia

Principal Process Engineer

Allentown, PA

He or she should be adept in automated equipment, such as but not limited to, optical device alignment, pick and place, fiber attach, flip chip assembly, thermocompression bonding, flex circuit ...

New

Nokia

Principal Process Engineer

Allentown, PA · On-site

$125K - $232K/yr

He or she should be adept in automated equipment, such as but not limited to, optical device alignment, pick and place, fiber attach, flip chip assembly, thermocompression bonding, flex circuit ...

Mesh Optical Technologies

Process Engineer

Gardena, CA · On-site

$90K - $140K/yr

Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders * Design production processes ...

Nokia

Process Development Engineer

Allentown, PA · On-site

$88K - $163K/yr

He or she should be adept in automated equipment, such as but not limited to, optical device alignment, pick and place, fiber attach, flip chip assembly, thermocompression bonding, flex circuit ...

Mesh Optical Technologies

Process Engineer

Gardena, CA

$90K - $140K/yr

Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders * Design production processes ...

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All JobsFlip Chip Jobs

Flip Chip information

What are common challenges faced in a flip chip engineering role?

One of the main challenges in a Flip Chip process engineering position is maintaining high yields and reliability while working with ever-decreasing component sizes and complex assembly processes. Engineers must troubleshoot defects, optimize process parameters, and stay updated with evolving industry technologies. The role often involves cross-functional collaboration with design, quality, and production teams to ensure product integrity. Overcoming these challenges helps build expertise in advanced microelectronic packaging and can position you for advancement within the semiconductor manufacturing industry.

What is a flip chip?

A Flip Chip job typically involves working with advanced semiconductor packaging technology, where components are flipped and directly bonded to a substrate or circuit board. Responsibilities may include operating equipment, inspecting wafer bonding, troubleshooting defects, and ensuring quality control. Workers in this role are often found in semiconductor manufacturing and may need experience with cleanroom environments, precision tools, and microscopy techniques.

What are the key skills and qualifications needed to thrive in the flip chip position?

To thrive in a Flip Chip process engineering role, you need a strong understanding of semiconductor packaging, microelectronics assembly, and materials science, often supported by a degree in electrical engineering, materials science, or a related field. Experience with tools such as wire bonders, die attachers, flip chip bonders, and knowledge of cleanroom protocols and industry standards like IPC is highly valuable. Attention to detail, problem-solving ability, and excellent teamwork are crucial soft skills for this position. These competencies ensure successful assembly, reliability, and performance of advanced semiconductor devices in a fast-paced and precise manufacturing environment.

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Flip Chip jobs near you
Infographic showing various Flip Chip job openings in the United States as of August 2026, with employment types broken down into 89% Full Time, 9% Part Time, 1% Contract, and 1% Nights. Highlights an 93% Physical, 3% Hybrid, and 4% Remote job distribution.

Packaging Process Development Engineer

Amphenol

Fremont, CA • On-site

$94K - $130K/yr

Full-time

Medical, Life, Retirement, PTO

Re-posted 6 days ago

Job description

WHO WE ARE
At NovaSensor, an Amphenol company, we are pioneers in high accuracy sensing solutions. As a global leader in MEMS (Microelectromechanical Systems) technology, we design and manufacture advanced pressure sensors that power critical applications across the medical, industrial, and transportation markets-whether it is enabling life-saving medical devices, enhancing vehicle safety and efficiency, or ensuring reliability in industrial systems.
We are part of Amphenol, a global leader in advanced interconnect systems, serving diverse markets including automotive, aerospace, industrial, and mobile devices. Amphenol Corporation, a member of the Fortune 500 (NYSE: APH), was established in 1932 and has pioneered innovation in electronics for nearly a century across virtually every end market.
Position summary
  • The Packaging Development Engineer will design, develop, qualify, and optimize packaging and assembly processes for semiconductor devices and sensors (including MEMS, ICs, ASICs, discrete sensors). This role leads prototype-to-production process development, reliability qualification, supplier development, and implementation into manufacturing. The engineer will balance electrical/mechanical/thermal performance, cost, manufacturability, and reliability to support Amphenol's product roadmaps.

Key responsibilities
  • Develop and qualify new package types and assembly processes and flows including die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation
  • Define manufacturing process flows, tooling, materials specifications, and control plans for prototypes and high-volume production.
  • Lead Design for Reliability/Manufacturing (DfX/DfM) reviews with product design, test, and manufacturing teams.
  • Create and execute DOE (design of experiments) to optimize process windows and yield; analyze results using statistical tools (e.g., Minitab/JMP).
  • Author and maintain process documentation: process sheets, work instructions, SPC/CPK reports, FMEA, PPAP/APQP packages (for automotive customers).
  • Partner with suppliers and contract manufacturers to qualify equipment, processes, materials (epoxies, solders, plating chemistries), and subcontractor processes; perform supplier audits as needed.
  • Plan and oversee reliability and environmental qualification testing (thermal cycling, HAST, temperature humidity bias, mechanical shock, vibration, solderability, thermal shock); interpret results and drive corrective actions.
  • Perform and coordinate failure analysis (SEM, X-ray/CT, C-SAM, cross-sectioning) and root-cause investigations.
  • Transfer processes to internal and external manufacturing sites where needed; support production ramps and troubleshoot yield/quality issues at manufacturing locations.
  • Ensure compliance with industry standards and customer requirements (JEDEC, IPC, ISO 9001/AS9100/IATF 16949 as applicable), plus RoHS/REACH and other regulatory needs.
  • Mentor junior engineers and technicians; present technical status to stakeholders and customers.

Required qualifications
  • BS in Materials/ Electrical/Mechanical Engineering (MS preferred), 3+ years in semiconductor or sensor packaging/process development
  • 2+ years of hands-on experience in semiconductor or sensor packaging, assembly process development, or failure analysis.
  • Demonstrated experience with die attach, wire bonding, flip-chip, molding/encapsulation, soldering , singulation and metallization/plating processes.
  • Practical knowledge of reliability test protocols and failure-analysis techniques.
  • Strong statistical analysis skills and experience with DOE; comfortable using Minitab or JMP.
  • Experience preparing process documentation, FMEA, control plans, and PPAP/APQP packages (especially for automotive/aerospace customers).
  • Excellent written and verbal communication skills; strong cross-functional collaboration.

Preferred experience and skills
  • Familiarity with SEM, X-ray/CT, C-SAM, microsectioning, and metallographic microscopy.
  • Knowledge of ESD/cleanroom practices and contamination control.
  • Project management experience; PMP or Six Sigma certification a plus.
  • Prior experience working with suppliers across APAC/EMEA and supporting process transfer globally.

Technical tools & equipment (examples)
  • Software: Minitab/JMP, Excel, Word, Powerpoint
  • Lab/process tools: wire bonders, flip-chip bonders, die bonders, reflow ovens, mold presses, plasma cleaning tools, , pick-and-place, X-ray/CT, SEM, C-SAM, environmental chambers for thermal/humidity testing.

Success metrics (KPIs)
  • Time-to-qualify new package/processes (target per product/project).
  • First-pass yield and overall manufacturing yield improvements.
  • Reliability pass rates vs. customer requirements.
  • Number and criticality of customer field failures attributable to packaging/process development .
  • Successful transfers to internal/external production sites within schedule and budget.
  • Cost-per-unit improvements from design/process optimization.

Working conditions & travel
  • Typical R&D/lab environment with occasional exposure to cleanroom and manufacturing floor.
  • Global travel to supplier sites, contract manufacturers, and customer locations as needed - typically up to 10-25%

Diversity, safety & compliance
  • Follow Amphenol's EHS and quality policies; contribute to a culture of safety and continuous improvement.
  • Support company diversity and inclusion initiatives.

WHERE YOU WILL WORK
On-site in Fremont, CA
WHY YOU SHOULD JOIN OUR TEAM
  • Competitive salary
  • 401(k)
  • Health insurance and wellness programs
  • 401(k) with company match
  • Professional onboarding and training opportunities
  • Paid time off
  • Health savings account
  • Flexible spending account
  • Life insurance
  • Inclusive and collaborative work environment

Apply