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Flip Chip Jobs (NOW HIRING)

Nokia

Senior Packaging Development Engineer

Sunnyvale, CA · On-site

$159K - $296K/yr

If you're eager to own the design and development of flip chip, fan out, semiconductor dicing, and reflow processes, while staying abreast of cutting-edge technologies, we encourage you to apply!

Mesh Optical Technologies

Process Engineer

Gardena, CA · On-site

$90K - $140K/yr

Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders * Design production processes ...

Neuralink

Manufacturing Technician

Austin, TX

$25 - $31/hr

You will be engaged with many day-to-day responsibilities, including flip-chip bonding, part cleaning and preparation, electronics potting, mounting implants to the surgical mechanisms, as well as ...

Mesh Optical Technologies

Process Engineer

Gardena, CA · On-site

$90K - $140K/yr

Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders * Design production processes ...

Nokia

Process Development Engineer

Allentown, PA · On-site

$150K - $200K/yr

He or she should be adept in automated equipment, such as but not limited to, optical device alignment, pick and place, fiber attach, flip chip assembly, thermocompression bonding, flex circuit ...

Nokia

Process Development Engineer

Allentown, PA · On-site

He or she should be adept in automated equipment, such as but not limited to, optical device alignment, pick and place, fiber attach, flip chip assembly, thermocompression bonding, flex circuit ...

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Flip Chip information

See salary details

$20K

$135.7K

$218K

How much do flip chip jobs pay per year?

As of Jun 20, 2026, the average yearly pay for flip chip in the United States is $135,650.00, according to ZipRecruiter salary data. Most workers in this role earn between $108,500.00 and $184,000.00 per year, depending on experience, location, and employer.

What are common challenges faced in a Flip Chip engineering role?

One of the main challenges in a Flip Chip process engineering position is maintaining high yields and reliability while working with ever-decreasing component sizes and complex assembly processes. Engineers must troubleshoot defects, optimize process parameters, and stay updated with evolving industry technologies. The role often involves cross-functional collaboration with design, quality, and production teams to ensure product integrity. Overcoming these challenges helps build expertise in advanced microelectronic packaging and can position you for advancement within the semiconductor manufacturing industry.

What is a Flip Chip job?

A Flip Chip job typically involves working with advanced semiconductor packaging technology, where components are flipped and directly bonded to a substrate or circuit board. Responsibilities may include operating equipment, inspecting wafer bonding, troubleshooting defects, and ensuring quality control. Workers in this role are often found in semiconductor manufacturing and may need experience with cleanroom environments, precision tools, and microscopy techniques.

What are the key skills and qualifications needed to thrive in the Flip Chip position, and why are they important?

To thrive in a Flip Chip process engineering role, you need a strong understanding of semiconductor packaging, microelectronics assembly, and materials science, often supported by a degree in electrical engineering, materials science, or a related field. Experience with tools such as wire bonders, die attachers, flip chip bonders, and knowledge of cleanroom protocols and industry standards like IPC is highly valuable. Attention to detail, problem-solving ability, and excellent teamwork are crucial soft skills for this position. These competencies ensure successful assembly, reliability, and performance of advanced semiconductor devices in a fast-paced and precise manufacturing environment.

More about Flip Chip jobs
What cities are hiring for Flip Chip jobs? Cities with the most Flip Chip job openings:
What states have the most Flip Chip jobs? States with the most job openings for Flip Chip jobs include:
What job categories do people searching Flip Chip jobs look for? The top searched job categories for Flip Chip jobs are:
Flip Chip jobs near you
Infographic showing various Flip Chip job openings in the United States as of June 2026, with employment types broken down into 95% Full Time, 4% Part Time, and 1% Contract. Highlights an 93% Physical, 1% Hybrid, and 6% Remote job distribution, with an average salary of $135,650 per year, or $65.2 per hour.

NIST PREP Postdoc Associate in Metrology of Materials, Surfaces, and Processes for Semiconductor ...

Southeastern Universities Research Association

Gaithersburg, MD • On-site

$70K - $90K/yr

Full-time

Posted 19 days ago

Job description

This position is part of the National Institute of Standards (NIST) Professional Research Experience (PREP) program. NIST recognizes that its research staff may wish to collaborate with researchers at academic institutions on specific projects of mutual interest and thus requires that such institutions be the recipients of a PREP award. The PREP program requires staff from a wide range of backgrounds to work on scientific research in many areas. Employees in this position will perform technical work that underpins the scientific research of the collaboration.
Research Title: Metrology of Materials, Surfaces, and Processes for Semiconductor Advanced Packaging
The work will entail: We are seeking a highly motivated researcher to advance measurement science for next-generation hybrid advanced packaging. This role will contribute to the development of novel surface and materials metrology methods that enable predictive control of bonding processes and heterogeneous integration. The successful candidate will work within the Nanophotonics project to help establish the quantitative foundations needed for reliable, high-density microelectronic assembly, supporting national efforts to strengthen U.S. leadership in semiconductor manufacturing and advanced packaging technologies.
The main responsibilities are:
  • Fabricate Si, SiO2, SiN chips for flip-chip fusion and hybrid bonding experiments.
  • Optimize and maintain fabrication processes, including chip handling and cleaning protocols.
  • Perform surface and thin film characterization of chips used for flip-chip bonding experiments. Characterization techniques include AFM, optical inspection, IR transmission microscopy, spectroscopic ellipsometry, SEM and others.
  • Closely coordinate with teams performing materials characterization, bond strength testing and modeling.

Qualifications
Necessary Qualifications:
  • PhD in physics, electrical engineering, materials science, or a related field.
  • Significant experience, including process development, in semiconductor device fabrication, including wafer cleaning and handling, lithography mask layout, optical or electron beam lithography, RIE, ICP RIE, PVD, CVD, ALD, wet etching, as well as characterization techniques such as ellipsometry, profilometry, optical microscopy, SEM and AFM.
  • Proficiency in programming languages, such as Python, Java or Matlab.
  • Excellent communication skills and ability to work effectively in a team.

Desirable Qualifications:
  • Experience with flip-chip fusion and/or hybrid bonding processes
  • Experience with XPS, UPS, FTIR, Raman, photoluminescence, other relevant modalities of spectroscopy
  • Familiarity with silicon electronic, photonic or optoelectronic device processing
  • Experience with custom infrared microscopy and optical measurement setups.
  • Experience with III-V compound semiconductor process development and device fabrication.
  • Experience with optoelectronic (e.g. semiconductor lasers, detectors, multi-functional photonic integrated circuits, etc) device characterization.
  • Experience with photonic and optoelectronic device simulation software, such as Lumerical, Tidy3d, or COMSOL.
  • US citizenship strongly preferred

The successful candidate will work in a highly collaborative research environment and have access to state-of-the-art facilities for device fabrication and characterization. The position is available immediately, and the initial appointment is for two years, with the possibility of extension based on performance and availability of funding.
Privacy Act StatementAuthority: 15 U.S.C. § 278g-1(e)(1) and (e)(3) and 15 U.S.C. § 272(b) and (c)
Purpose: The National Institute for Standards and Technology (NIST) hosts the Professional Research Experience Program (PREP) which is designed to provide valuable laboratory experience and financial assistance to undergraduates, post-bachelor's degree holders, graduate students, master's degree holders, postdocs, and faculty.
PREP is a 5-year cooperative agreement between NIST laboratories and participating PREP Universities to establish a collaborative research relationship between NIST and U.S. institutions of higher education in the following disciplines including (but may not be limited to) biochemistry, biological sciences, chemistry, computer science, engineering, electronics, materials science, mathematics, nanoscale science, neutron science, physical science, physics, and statistics. This collection of information is needed to facilitate the administrative functions of the PREP Program.
Routine Uses: NIST will use the information collected to perform the requisite reviews of the applications to determine eligibility, and to meet programmatic requirements. Disclosure of this information is also subject to all the published routine uses as identified in the Privacy Act System of Records Notices: NIST-1: NIST Associates.
Disclosure: Furnishing this information is voluntary. When you submit the form, you are indicating your voluntary consent for NIST to use of the information you submit for the purpose stated. By applying to a CHIPS-funded PREP opportunity, you also acknowledge that participation in the project requires signing a Non-Disclosure Agreement (NDA) prior to beginning any work.
SURA is an Equal Opportunity Employer. We believe that no one should be discriminated against because of their differences, such as age, disability, ethnicity, gender, gender identity and expression, religion, or sexual orientation. All employment decisions shall be made without regard to age, race, creed, color, religion, sex, national origin, ancestry, disability status, veteran status, sexual orientation, gender identity or expression, genetic information, marital status, citizenship status, or any other basis as protected by federal, state, or local law.
PREP0004276

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