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Flip Chip Jobs (NOW HIRING)

Mercury Systems

2nd Shift Die/Wire Bonder

Phoenix, AZ · On-site

$17.25 - $22.25/hr

Perform Die Attach, Wire bond, Epoxy Dispense, Flip chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive ...

AvicenaTech

Senior IC Packaging Engineer

Sunnyvale, CA · On-site

Lead the architecture, design, and development of advanced semiconductor packaging solutions, including 2.5D/3D IC, System-in-Package (SiP), Flip Chip, and Wafer-Level Packaging * Lead development ...

Nokia

Senior Packaging Development Engineer

Sunnyvale, CA · On-site

$159K - $296K/yr

If you're eager to own the design and development of flip chip, fan out, semiconductor dicing, and reflow processes, while staying abreast of cutting-edge technologies, we encourage you to apply!

Mesh Optical Technologies

Process Engineer

Gardena, CA

$90K - $140K/yr

Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders * Design production processes ...

SpaceX

Sr. Process Engineer (Starlink)

Bastrop, TX · On-site

$103K - $133K/yr

Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders * Design production processes ...

Mesh Optical Technologies

Process Engineer

Gardena, CA · On-site

$90K - $140K/yr

Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders * Design production processes ...

Neuralink

Manufacturing Technician

Austin, TX

$27/hr

You will be engaged with many day-to-day responsibilities, including flip-chip bonding, part cleaning and preparation, electronics potting, mounting implants to the surgical mechanisms, as well as ...

Nokia

Process Development Engineer

Allentown, PA

He or she should be adept in automated equipment, such as but not limited to, optical device alignment, pick and place, fiber attach, flip chip assembly, thermocompression bonding, flex circuit ...

Nokia

Process Development Engineer

Allentown, PA · On-site

$150K - $200K/yr

He or she should be adept in automated equipment, such as but not limited to, optical device alignment, pick and place, fiber attach, flip chip assembly, thermocompression bonding, flex circuit ...

Micron

Senior Package Design Engineer

Boise, ID

Define and optimize package architectures for DRAM products, including substrate stack-up, die padlog optimization, wire bond and flip chip interconnect schemes, and BEOL/RDL flows for advanced ...

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All JobsFlip Chip Jobs

Flip Chip information

What are common challenges faced in a Flip Chip engineering role?

One of the main challenges in a Flip Chip process engineering position is maintaining high yields and reliability while working with ever-decreasing component sizes and complex assembly processes. Engineers must troubleshoot defects, optimize process parameters, and stay updated with evolving industry technologies. The role often involves cross-functional collaboration with design, quality, and production teams to ensure product integrity. Overcoming these challenges helps build expertise in advanced microelectronic packaging and can position you for advancement within the semiconductor manufacturing industry.

What is a Flip Chip job?

A Flip Chip job typically involves working with advanced semiconductor packaging technology, where components are flipped and directly bonded to a substrate or circuit board. Responsibilities may include operating equipment, inspecting wafer bonding, troubleshooting defects, and ensuring quality control. Workers in this role are often found in semiconductor manufacturing and may need experience with cleanroom environments, precision tools, and microscopy techniques.

What are the key skills and qualifications needed to thrive in the Flip Chip position, and why are they important?

To thrive in a Flip Chip process engineering role, you need a strong understanding of semiconductor packaging, microelectronics assembly, and materials science, often supported by a degree in electrical engineering, materials science, or a related field. Experience with tools such as wire bonders, die attachers, flip chip bonders, and knowledge of cleanroom protocols and industry standards like IPC is highly valuable. Attention to detail, problem-solving ability, and excellent teamwork are crucial soft skills for this position. These competencies ensure successful assembly, reliability, and performance of advanced semiconductor devices in a fast-paced and precise manufacturing environment.

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Flip Chip jobs near you
Infographic showing various Flip Chip job openings in the United States as of July 2026, with employment types broken down into 84% Full Time, 8% Part Time, and 8% Contract. Highlights an 100% In-person job distribution.
2nd Shift Die/Wire Bonder

2nd Shift Die/Wire Bonder

Mercury Systems

Phoenix, AZ • On-site

$17.25 - $22.25/hr

Full-time

Posted 23 days ago

Mercury Systems rating

8.2

Company rating: 8.2 out of 10

Based on 7 frontline employees who took The Breakroom Quiz

38th of 143 rated electronics manufacturers

Job description

Job Summary:
Performs basic and routine electronic assembly operations on components or subassemblies. Perform Die Attach, Wire bond, Epoxy Dispense, Flip chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach.
Job Responsibilities:
  • Technical Knowledge of Die Attach, Wire bond, Epoxy Dispense, flip Chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach
  • This position will be required to set up and run K&S ICONN Wire bonders, XYZ-Tec, and West Bond wire pull equipment. In addition, you will set up and run Besi Datacon 2200, Yamaha Chip Shooter, and EKRA printers.
  • Clean PCBs and assemblies throughout the process and after completion. Maintain logs, paperwork, and forms accurately consistent with company policy and practices.
  • Must continuously meet/exceed production schedules and deadlines according to quality standards
  • Other duties as assigned
  • Performs a wide variety of electrical/mechanical product assembly operations on assemblies.
  • Prepares assembly work to be accomplished by studying assembly instructions and following blueprint specifications.
  • Using assembly drawings and related paperwork (Router, Pick List, bill of materials) to accompany parts through production flow
  • Using written instructions to assemble, modify, rework, or reassemble units
  • Performs basic and routine electronic assembly operations on components or subassemblies
  • Maintains daily records and periodically summarizes activities
  • Interface with Engineers and Program Managers
  • Process transactions on the Oracle (ERP) system

Required Qualifications:
  • Typically requires one year of experience or less
  • Ability to work under a microscope for long periods of time
  • Strong hand-eye coordination
  • Knowledge/ability to read written instructions (assemble, modify, rework, or reassemble units)
  • Must continuously meet/exceed production schedules and deadlines according to quality standards
  • Ability and willingness to operate and multi-task between 2 to 3 machines
  • Must be able to train on third shift (9pm - 6:30am)
  • May occasionally be required to work overtime

Preferred Qualifications:
  • Technical Knowledge of Die Attach, Wire bond, Epoxy Dispense, flip Chip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach, etc.

"This position requires you to access information that is subject to U.S. export regulations. You may only access such information if you are a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. government."
Why should you join Mercury Systems?
Mercury Systems is a technology company that makes the world a safer, more secure place. We push processing power to the tactical edge, making the latest commercial technologies profoundly more accessible for today's most challenging aerospace and defense missions. From silicon to system scale, Mercury enables customers to accelerate innovation and turn data into decision superiority. Headquartered in Andover, Massachusetts, Mercury employs more than 2,300 people in 24 locations worldwide. To learn more, visit mrcy.com
Our Culture
We are committed to making Mercury a great place to work, no matter where our employees are located. We offer a casual and enjoyable atmosphere that allows employees to learn and grow. We help and care for one another and work as one to achieve results for us and for our customers. We value communication and transparency, and strive to foster two-way dialogue at all levels of the organization. We are committed to lifelong learning, offering comprehensive skills training and tuition reimbursement. Whether you're just starting out on your career journey or you are an experienced professional, it's important to us that you feel recognized and rewarded for your contributions.
To find out more about Why Mercury?, or visit the Mercury Community or find answers to general questions at Mercury FAQs
Mercury Systems is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex (including pregnancy), sexual orientation, gender identity, national origin, genetic information, creed, citizenship, disability, protected veteran or marital status.
As an equal opportunity employer, Mercury Systems is committed to a diverse workforce. In order to ensure reasonable accommodation for individuals protected by Section 503 of the Rehabilitation Act of 1973, the Vietnam Veterans' Readjustment Act of 1974, and Title I of the Americans with Disabilities Act of 1990, applicants that require accommodation in the job application process may contact the number below for assistance.
(978) 256-1300
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