Package Design Engineer
$159.40K/yr
Our client is seeking an experienced Package Design Engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D D/A converters ...
Package Design Engineer
$159.40K/yr
Our client is seeking an experienced Package Design Engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D D/A converters ...
Lead packaging development for single-chip (flip-chip) and multi-component module assemblies * Drive system integration for full module builds (wafer + cold plate + multi-chip packages) * Collaborate ...
Lead packaging development for single-chip (flip-chip) and multi-component module assemblies * Drive system integration for full module builds (wafer + cold plate + multi-chip packages) * Collaborate ...
... Flip Chip, FO-WLP, and interposers Utilize modeling and simulation (thermal, mechanical, electrical) to ensure early-stage design success Provide technical oversight to external vendors and ...
... Flip Chip, FO-WLP, and interposers Utilize modeling and simulation (thermal, mechanical, electrical) to ensure early-stage design success Provide technical oversight to external vendors and ...
You will apply your CSP technical expertise to lead root cause investigations on flip chip, die attach, molding, and plating processes, partnering closely with process engineering, operations ...
You will apply your CSP technical expertise to lead root cause investigations on flip chip, die attach, molding, and plating processes, partnering closely with process engineering, operations ...
You will apply your CSP technical expertise to lead root cause investigations on flip chip, die attach, molding, and plating processes, partnering closely with process engineering, operations ...
You will apply your CSP technical expertise to lead root cause investigations on flip chip, die attach, molding, and plating processes, partnering closely with process engineering, operations ...
* Assists under guidance in the fabrication of CCD and CMOS sensors utilizing flip-chip bonders, dispensing equipment, dicing saw, wire bonders, or stud bumping machines. * Receives direction and ...
* Assists under guidance in the fabrication of CCD and CMOS sensors utilizing flip-chip bonders, dispensing equipment, dicing saw, wire bonders, or stud bumping machines. * Receives direction and ...
Package Design Engineer
$141.30K - $226K/yr
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...
Package Design Engineer
$141.30K - $226K/yr
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...
Flip-chip package design concepts. * Tasks: * Perform point-to-point connections . * Run DRC (Design Rule Checks) , identify root causes, and fix issues. * Execute design based on provided schematics ...
Quick apply
Flip-chip package design concepts. * Tasks: * Perform point-to-point connections . * Run DRC (Design Rule Checks) , identify root causes, and fix issues. * Execute design based on provided schematics ...
Develop and qualify new package types and assembly processes and flows including die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation * Define manufacturing process flows ...
Develop and qualify new package types and assembly processes and flows including die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation * Define manufacturing process flows ...
Develop and qualify new package types and assembly processes and flows including die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation * Define manufacturing process flows ...
Develop and qualify new package types and assembly processes and flows including die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation * Define manufacturing process flows ...
Advanced Packaging Engineer
Saratoga, CA · On-site
$230K - $275K/yr
This role also owns leading flip-chip single-die Flip Chip packages and advanced 2.5D integration. You will operate as the technical owner of system module packaging, working hands-on with contract ...
Advanced Packaging Engineer
Saratoga, CA · On-site
$230K - $275K/yr
This role also owns leading flip-chip single-die Flip Chip packages and advanced 2.5D integration. You will operate as the technical owner of system module packaging, working hands-on with contract ...
Package Design Engineer
$141.30K - $226K/yr
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...
Package Design Engineer
$141.30K - $226K/yr
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...
Package Design Engineer
San Jose, CA · On-site
$141.30K - $226K/yr
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...
Package Design Engineer
San Jose, CA · On-site
$141.30K - $226K/yr
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...
Develop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding ...
Develop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding ...
Define and execute the global packaging roadmap, focusing on Power SiP/Modules , Wafer Level Packaging , and Flip-Chip technologies. * Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices ...
Define and execute the global packaging roadmap, focusing on Power SiP/Modules , Wafer Level Packaging , and Flip-Chip technologies. * Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices ...
Define and execute the global packaging roadmap, focusing on Power SiP/Modules , Wafer Level Packaging , and Flip-Chip technologies. * Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices ...
Define and execute the global packaging roadmap, focusing on Power SiP/Modules , Wafer Level Packaging , and Flip-Chip technologies. * Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices ...
Packaging Process Development Engineer
Fremont, CA · On-site
$94K - $130K/yr
Develop and qualify new package types and assembly processes and flows including die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation * Define manufacturing process flows ...
Packaging Process Development Engineer
Fremont, CA · On-site
$94K - $130K/yr
Develop and qualify new package types and assembly processes and flows including die attach, wire bond, flip-chip, molding, plating, soldering and encapsulation * Define manufacturing process flows ...
The role requires expertise in the assembly processes required for fully packaged, single die flip chip LGA, multi-chip modules (MCM) and System-in-Package devices. Assembly processing includes paste ...
The role requires expertise in the assembly processes required for fully packaged, single die flip chip LGA, multi-chip modules (MCM) and System-in-Package devices. Assembly processing includes paste ...
Postdoctoral Fellow (PREP0004276)
Gaithersburg, MD · On-site
$53.40K - $72.50K/yr
The main responsibilities are: • Fabricate Si, SiO2, SiN chips for flip-chip fusion and hybrid bonding experiments. • Optimize and maintain fabrication processes, including chip handling and ...
Postdoctoral Fellow (PREP0004276)
Gaithersburg, MD · On-site
$53.40K - $72.50K/yr
The main responsibilities are: • Fabricate Si, SiO2, SiN chips for flip-chip fusion and hybrid bonding experiments. • Optimize and maintain fabrication processes, including chip handling and ...
The role requires expertise in the assembly processes required for fully packaged, single die flip chip LGA, multi-chip modules (MCM) and System-in-Package devices. Assembly processing includes paste ...
The role requires expertise in the assembly processes required for fully packaged, single die flip chip LGA, multi-chip modules (MCM) and System-in-Package devices. Assembly processing includes paste ...
Flip Chip information
See salary details
$20K - $38K
15% of jobs
$38K - $56K
5% of jobs
$56K - $74K
2% of jobs
$74K - $92K
1% of jobs
$92K - $110K
1% of jobs
$111.5K is the 25th percentile. Wages below this are outliers.
$110K - $128K
9% of jobs
$128K - $146K
14% of jobs
The median wage is $148.3K / yr.
$146K - $164K
21% of jobs
$178.1K is the 75th percentile. Wages above this are outliers.
$164K - $182K
8% of jobs
$182K - $200K
12% of jobs
$200K - $218K
12% of jobs
$20K
$135.7K
$218K
How much do flip chip jobs pay per year?
As of May 29, 2026, the average yearly pay for flip chip in the United States is $135,650.00, according to ZipRecruiter salary data. Most workers in this role earn between $108,500.00 and $184,000.00 per year, depending on experience, location, and employer.
What is a Flip Chip job?
A Flip Chip job typically involves working with advanced semiconductor packaging technology, where components are flipped and directly bonded to a substrate or circuit board. Responsibilities may include operating equipment, inspecting wafer bonding, troubleshooting defects, and ensuring quality control. Workers in this role are often found in semiconductor manufacturing and may need experience with cleanroom environments, precision tools, and microscopy techniques.
What are the key skills and qualifications needed to thrive in the Flip Chip position, and why are they important?
To thrive in a Flip Chip process engineering role, you need a strong understanding of semiconductor packaging, microelectronics assembly, and materials science, often supported by a degree in electrical engineering, materials science, or a related field. Experience with tools such as wire bonders, die attachers, flip chip bonders, and knowledge of cleanroom protocols and industry standards like IPC is highly valuable. Attention to detail, problem-solving ability, and excellent teamwork are crucial soft skills for this position. These competencies ensure successful assembly, reliability, and performance of advanced semiconductor devices in a fast-paced and precise manufacturing environment.
What are common challenges faced in a Flip Chip engineering role?
One of the main challenges in a Flip Chip process engineering position is maintaining high yields and reliability while working with ever-decreasing component sizes and complex assembly processes. Engineers must troubleshoot defects, optimize process parameters, and stay updated with evolving industry technologies. The role often involves cross-functional collaboration with design, quality, and production teams to ensure product integrity. Overcoming these challenges helps build expertise in advanced microelectronic packaging and can position you for advancement within the semiconductor manufacturing industry.
More about Flip Chip jobs
What cities are hiring for Flip Chip jobs? Cities with the most Flip Chip job openings:
What states have the most Flip Chip jobs? States with the most job openings for Flip Chip jobs include:
What job categories do people searching Flip Chip jobs look for? The top searched job categories for Flip Chip jobs are:
Job description
Our client is seeking an experienced Package Design Engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D D/A converters (ADC & DAC).
You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 112G and higher, RF/Microwave ADC/DAC, DDR and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and also automate design tasks using Cadence SKILL.
RESPONSIBILITIES:
- Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
- 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest
- Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
- Schedule, prioritize, & track your work across 2+ projects simultaneously
- General flip-chip BGA package design & engineering
EDUCATION/EXPERIENCE & REQUIREMENTS:
- BSEE or similar field and 12+ years’ experience in flip-chip-BGA package design, including high-speed SerDes
- MSEE or similar field and 10+ years’ experience in flip-chip-BGA package design, including high-speed SerDes
- Knowledge of package-level signal integrity and power integrity, to apply to package designs
- Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.
- Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
- Self-management and organization skills
About Advanced Technology Search
Sourced by ZipRecruiter
Industry
Recruiting and staffing services
Company size
11 - 50 Employees
Headquarters location
West Orange, NJ, US
Year founded
1987