Entry Level Field Service Engineer Jobs in Oregon

Position Type: Full-Time / Contract
Location: Hillsboro, Oregon
Work Environment: Semiconductor Fabrication Facility / Cleanroom
Schedule: 4x10, Monday–Friday Day Shift
Positions Available: 2
Initial Contract: Through December 2026
Extension: Possible extension into 2027 based on customer requirements and tool schedule

Genesis Tech Engineers Inc. is seeking two experienced Field Service Engineers to support semiconductor equipment decontamination, decommissioning, and deinstallation activities at a leading semiconductor manufacturing facility in Hillsboro, Oregon.

The ideal candidates will have hands-on experience working with 300mm semiconductor manufacturing equipment, particularly Applied Materials (AMAT) EPI and/or ASM XP4/XP8 equipment, and will be comfortable performing detailed equipment shutdown, decontamination, disassembly, and preparation for removal in a semiconductor fab environment.

This is a highly hands-on field position requiring strong knowledge of semiconductor equipment, customer safety procedures, LOTO, PPE, gas and liquid line purging, chamber cleaning, equipment disconnection, and coordination with rigging/removal teams.

• Perform complete semiconductor equipment decontamination activities in accordance with customer and equipment procedures.
• Perform chamber wet cleans and associated chamber preparation activities.
• Remove chamber kits, forelines, and other designated equipment components.
• Safely perform required purging of both gas and liquid lines.
• Perform gas-line pump purging as required.
• Flush drains and blow out residual liquids from applicable equipment systems.
• Disconnect, purge, and cap gas and liquid lines in accordance with customer procedures.
• Power down equipment and associated subsystems and verify that all applicable energy sources have been removed.
• Follow all applicable Lockout/Tagout (LOTO) procedures.
• Participate in daily pre-task planning with the customer and project team.
• Complete required decontamination checklists and documentation.
• Maintain accurate records of completed decontamination activities.
• Provide daily status updates regarding project progress, equipment condition, and outstanding activities.
• Disconnect cables, piping, tubing, and other interfaces between equipment modules.
• Disconnect applicable subfab components and associated equipment connections.
• Remove hardware securing individual equipment sections and modules.
• Verify that all facilities connection points have been properly disconnected, capped, and made safe prior to equipment removal.
• Perform proper equipment cleaning and housekeeping before removal of individual equipment sections.
• Install customer-provided brackets, casters, supports, and other equipment required for safe movement.
• Perform chamber unmounting and install required blankets or protective materials.
• Secure equipment components and robot axes appropriately before movement.
• Coordinate equipment removal activities with the designated rigging and transportation company.
• Ensure equipment sections are properly prepared for lifting, movement, and removal.
• Follow approved equipment deinstallation procedures and customer work instructions.
• Identify and report any unexpected equipment conditions that could affect safe removal.

• Strictly follow all customer safety protocols, including LOTO, PPE, cleanroom, EHS, and equipment-specific safety requirements.
• Follow all applicable semiconductor fab safety and contamination-control procedures.
• Participate in required pre-task planning and safety meetings.
• Maintain awareness of stored electrical, mechanical, pneumatic, hydraulic, vacuum, gas, and liquid energy sources.
• Verify equipment is properly isolated and safe before beginning deinstallation activities.
• Use required respiratory protection and other PPE in accordance with customer requirements.
• Maintain a clean and organized work area throughout the project.
• Immediately report unsafe conditions, incidents, near misses, equipment hazards, or procedural concerns.

• Minimum 5+ years of semiconductor equipment field service, decontamination, deinstallation, demo, or equivalent OEM experience.
• Hands-on experience with 300mm semiconductor manufacturing equipment.
• Demonstrated experience with AMAT EPI and/or ASM XP4/XP8 equipment.
• Hands-on semiconductor equipment decontamination and deinstallation experience.
• Experience performing gas and liquid line purging.
• Experience with chamber cleaning and chamber component removal.
• Experience disconnecting equipment utilities, piping, cables, and subfab connections.
• Experience with equipment module disassembly and preparation for removal.
• Strong understanding and practical experience with LOTO procedures.
• Experience working inside semiconductor fabrication facilities.
• Ability to follow detailed customer procedures, checklists, and work instructions.
• Ability to accurately document work and provide project status updates.

Experience with the following is highly desirable:

• AMAT EPI
• ASM XP4 / XP8
• 300mm wafer fabrication equipment
• Equipment relocation
• Chamber wet cleans
• Gas and liquid system purging
• Equipment teardown and module disassembly
• Major semiconductor fabrication facility experience

• 4x10 Monday–Friday day-shift schedule, subject to customer/project requirements.
• Candidates must be willing to complete required standard 9-panel drug screening.
• Candidates must comply with applicable BAPA respirator requirements and customer respiratory-protection procedures.
• Candidates must be able to obtain the required customer site access badge and satisfy all applicable site-access requirements.
• Candidates must be available for an in-person interview with the project operations manager.
• Expected placement/onboarding lead time is approximately 2–4 weeks.
• Initial contract duration is through December 2026.
• Possible extension into 2027 based on customer requirements, project continuation, and tool schedule.

This is a hands-on semiconductor fab position requiring the ability to:

• Work for extended periods in a semiconductor cleanroom environment.
• Stand and walk for extended periods.
• Bend, crouch, kneel, reach, push, and pull as required.
• Work in restricted or confined areas around semiconductor equipment.
• Wear required cleanroom garments, PPE, and respiratory protection.
• Perform hands-on equipment disassembly and preparation for removal.
• Work safely around electrical, mechanical, pneumatic, vacuum, gas, liquid, and other energy sources.
• Follow strict contamination-control and customer safety requirements.

The ideal candidate is an experienced Semiconductor Field Service Engineer, Equipment Engineer, Deinstall Engineer, Demo Engineer, or OEM Field Service Engineer with substantial hands-on experience in semiconductor fabrication facilities.

The strongest candidates will have:

5+ years of semiconductor/OEM field experience + 300mm equipment experience + AMAT EPI or ASM XP4/XP8 experience + hands‑on decontamination/deinstallation experience + LOTO + cleanroom/fab experience.

This position is particularly suited for candidates who have previously performed semiconductor equipment decon, teardown, demo, deinstallation, and preparation for rigging/removal, rather than candidates with only general field-service or maintenance experience.

9498 SW Barbur Blvd., STE 207 Portland, OR 97219 USA