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Dry Etch Engineer Jobs in Arizona (NOW HIRING)

Module Engineering Managers TSMC is looking for managers in the following modules ... CMP, CVD, Diffusion, Epitaxy, Etch (Dry), Etch (Wet), Lithography, Metrology , and PVD . At TSMC ...

Module Engineer

Phoenix, AZ · On-site

$121 - $232/hr

Litho, Wet Etch, Dry Etch, Diffusion, Implant, Planar and Thin Films. Responsibilities * Define ... Engineering experience in the semiconductor industry. Experience supporting high-volume ...

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Dry Etch Engineer information

What is a dry etch engineer?

A Dry Etch Engineer is responsible for developing, optimizing, and troubleshooting dry etching processes used in semiconductor manufacturing. They work with plasma-based etching techniques to precisely remove material from wafers while ensuring high precision and yield. Their role involves process characterization, tool maintenance, and collaboration with cross-functional teams to improve production efficiency. Dry Etch Engineers also analyze data, conduct experiments, and implement process improvements to meet stringent device fabrication requirements.

What are the typical daily responsibilities of a dry etch engineer?

As a Dry Etch Engineer, your daily responsibilities often include developing and optimizing dry etching processes, monitoring equipment performance, and troubleshooting any issues that arise during production. You will work hands-on in cleanroom environments, interact closely with process technicians and other engineers, and analyze data to ensure process stability and yield improvements. Collaborating with cross-functional teams, such as integration and equipment groups, is common to address technical challenges and support the overall manufacturing goals. You may also be involved in documenting process changes, conducting experiments, and participating in regular meetings to drive process enhancement initiatives.

What are the key skills and qualifications needed to thrive in the dry etch engineer position, and why are they important?

To thrive as a Dry Etch Engineer, you need a solid background in semiconductor processing, materials science, and relevant engineering disciplines, typically demonstrated by a bachelor's or master's degree. Familiarity with plasma etch tools, process characterization techniques, and data analysis software such as JMP or MATLAB is crucial, as well as knowledge of cleanroom protocols. Strong problem-solving skills, attention to detail, and the ability to communicate effectively within cross-functional teams are highly valued. These skills ensure the development and optimization of etching processes needed for fabricating high-quality semiconductor devices in a fast-paced manufacturing environment.

What are the most commonly searched types of Dry Etch Engineer jobs in Arizona?

The most popular types of Dry Etch Engineer jobs in Arizona are:

What job categories do people searching Dry Etch Engineer jobs in Arizona look for?

The top searched job categories for Dry Etch Engineer jobs in Arizona are:

What cities in Arizona are hiring for Dry Etch Engineer jobs?

Cities in Arizona with the most Dry Etch Engineer job openings:

Infographic showing various Dry Etch Engineer job openings in Arizona as of August 2026, with employment types broken down into 92% Full Time, 4% Part Time, and 4% Contract. Highlights an 84% Physical, 6% Hybrid, and 10% Remote job distribution.

Sr. Field Service Engineer IV

Plasma-Therm LLC

Phoenix, AZ • On-site, Remote

Full-time

Re-posted 13 days ago


Job description

Job Type
Full-time
Description
Job Description: Senior Field Service Engineer IV (AZ / Dual-Platform Lead)
Location: Phoenix, AZ
Shift / Travel: Local Fab Support (Phoenix, AZ Area) with On-Call Rotation & Limited Overseas/Domestic Travel
Position Overview
The Senior Field Service Engineer IV (FSE IV) serves as a lead technical expert responsible for tool installation, startup, advanced troubleshooting, preventive maintenance, and modifications for advanced semiconductor capital equipment. In this high-visibility role supporting our Strategic OEM Partnership, the FSE IV will provide critical on-site support at a leading-edge semiconductor manufacturing facility in Arizona across both strategic partner wet processing product lines (Wet Etch / Clean platforms) and Plasma-Therm plasma processing equipment (e.g., PECVD and Dry Etch systems).
The ideal candidate brings deep technical expertise in chemical dispense delivery, wet processing mechanics, fluidics, high-purity piping, process temperature control, vacuum systems, and robotics, along with strong customer-facing leadership skills to manage complex fab escalations.
Key Responsibilities
1. Overseas OEM Training & Product Bring-Up
  • Complete intensive, hands-on factory training at the strategic partner's manufacturing facility in Taiwan on new pre-release wet processing/wet etch platforms.
  • Work directly with factory development engineers during sub-assembly, software configuration, and initial tool integration.
  • Help capture, review, and refine initial standard operating procedures (SOPs), maintenance protocols, and commissioning checklists for field deployment.

2. Tool Move-In, Installation & Commissioning
  • Lead and oversee on-site tool uncrating, rigging supervision, facility chemical/utility hookup verification, and system power-on for new tool deliveries in Phoenix.
  • Execute pre-commissioning checks, sensor calibrations, fluid delivery testing, and Site Acceptance Testing (SAT) to achieve fast time-to-first-wafer.
  • Interface directly with customer fab engineers, facility chemical engineering teams, and rigging contractors to maintain installation schedules.

3. Advanced Technical Troubleshooting & Dual-Platform Support
  • Perform routine preventive maintenance (PM) and unscheduled corrective maintenance across both wet etch systems and Plasma-Therm dry processing platforms under strict SLA guidelines (<2>
  • Lead root-cause failure analysis for complex chemical delivery, fluidic valves, heater control, robotic wafer transfer, vacuum, and electromechanical escalations.
  • Author and drive 8D Quality/Failure Reports to closure in collaboration with factory engineering teams in Taiwan and domestic headquarters.

4. Customer Account & Escalation Management
  • Serve as the primary technical point of contact during critical tool-down scenarios, conducting daily technical updates with customer fab management.
  • Ensure strict adherence to customer safety (EHS), cleanroom, chemical handling, and Lockout/Tagout (LOTO) protocols.
  • Mentor and train peer engineers, supporting the development of internal SOPs and training logs.

Requirements
Required Qualifications & Experience
  • Education: Associate's or Bachelor's degree in Electrical/Mechanical Engineering, Mechatronics, Semiconductor Technology, or equivalent military technical training/experience.
  • Experience: 8+ years of direct field service or equipment engineering experience in semiconductor capital equipment manufacturing or advanced wafer fabs.

Technical Skills:
  • Wet Processing / Wet Etch Expertise: Deep knowledge of liquid chemical delivery systems, high-purity chemical plumbing/valves (PFA/PVDF), dosing pumps, chemical inline heating/chilling, bath recirculation, flow meters, and liquid filtration.
  • Dry / Vacuum Systems: Proficiency with vacuum systems (turbomolecular & dry pumps, vacuum gauging) and electromechanical assemblies.
  • Hands-on experience reading complex electrical schematics, Piping & Instrumentation Diagrams (P&ID), fluidic schematics, and software diagnostic logs.
  • Strong working knowledge of cleanroom safety protocols, hazardous chemical handling (acids, bases, solvents), chemical spill protocols, and LOTO procedures.

Soft Skills:
  • Exceptional written and verbal communication skills for customer escalation management.
  • Strong problem-solving mindset using structured problem-solving methodologies (e.g., 8D, 5 Whys).
  • Ability to work independently in a fast-paced fab environment and handle high-pressure customer situations.

Preferred Qualifications
  • Prior experience with Plasma-Therm equipment (e.g., Kobus PECVD, plasma etch, PVD, Evaporator systems).
  • Prior experience working within high-volume 300mm wafer fabrication facilities.
  • Familiarity with enterprise tracking tools (e.g., Jira, Confluence, ERP platforms) for tracking service cases, tool serial numbers, and field actions.

Work Environment & Physical Requirements
  • Must be able to work inside a Class 10/100 semiconductor cleanroom environment requiring full bunny suit protocol.
  • Must be able to lift up to 50 lbs, bend, stoop, and stand for extended periods.
  • Flexibility to work varied shifts, including weekend coverage or emergency on-call rotations as customer demand dictates.