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Die Attach Operator Jobs (NOW HIRING)

Pacer Staffing

Bond Operator

Orangeburg, NY · On-site

$18 - $22/hr

**Job Title: Bond Operator ** **Location: Orangeburg, NY 10962Pay Rate: $18.00-$22.00 per ... Die Attach/Bonding * Equipment Troubleshooting * Mixing * CNC Machine Setup & Changeover ID:qnkTyx

MACOM Technology Solutions Holdings

$16.75 - $21/hr

Hands on experience with programming and operating die attach and wire bonding equipment. * Capable of troubleshooting equipment, performing scheduled PMs and calibrations. * Experience with assembly ...

Teledyne

Lean Manufacturing Engineer

Garland, TX · On-site

... die attach, hermetic sealing, welding, lid attach, leak testing, and assembly. * Lead and ... Analyze process and test data to define operating limits, specifications, and control parameters.

Micross Components

Process Engineer

Apopka, FL · On-site

Maintain safe work area and comply with safety procedures and equipment operating rules keeping ... Knowledge or experience with Automatic assembly equipment for Wire bond, Die attach a plus

careers@micross.com

Senior Process Engineer

San Jose, CA · On-site

$100K - $150K/yr

Maintain safe work areas, comply with safety procedures, and follow equipment operating rules ... Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace)

Micross

Senior Process Engineer

Milpitas, CA · On-site

$100K - $135K/yr

This will be achieved through process documentation, operator training, and design of experiments ... Hands-on Experience in wafer thinning, dicing, die-attach, flip chip, and wire bonding preferred ...

Micross

Senior Process Engineer

Milpitas, CA · On-site

$100K - $135K/yr

This will be achieved through process documentation, operator training, and design of experiments ... Hands-on Experience in wafer thinning, dicing, die-attach, flip chip, and wire bonding preferred ...

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Die Attach Operator information

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How much do die attach operator jobs pay per hour?

As of Jul 15, 2026, the average hourly pay for die attach operator in the United States is $20.55, according to ZipRecruiter salary data. Most workers in this role earn between $17.79 and $22.84 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Die Attach Operator, and why are they important?

To thrive as a Die Attach Operator, you need a solid understanding of semiconductor manufacturing processes, attention to detail, and a high school diploma or equivalent. Familiarity with die attach machines, microscopes, and process monitoring systems is typically required, and certifications in electronics manufacturing can be advantageous. Strong hand-eye coordination, reliability, and the ability to follow strict procedural guidelines are valuable soft skills in this role. These competencies are crucial for ensuring precision, product quality, and efficiency in the assembly of microelectronic components.

What are some typical challenges faced by Die Attach Operators, and how can they be managed on the job?

Die Attach Operators often encounter challenges such as maintaining precise alignment of tiny semiconductor dies, managing equipment calibration, and ensuring consistent quality under production deadlines. To manage these, operators must pay close attention to detail, follow strict process documentation, and communicate effectively with quality control and maintenance teams. Regular training and staying updated on equipment best practices also help reduce errors and improve efficiency in this fast-paced manufacturing environment.

What is the difference between Die Attach Operator vs Wire Bonding Technician?

AspectDie Attach OperatorWire Bonding Technician
Primary RoleAttaches semiconductor dies to substrates using adhesives or solderingCreates electrical connections by bonding wires to semiconductor devices
Required SkillsPrecision placement, soldering, handling small componentsWire bonding techniques, equipment operation, quality inspection
Work EnvironmentCleanroom manufacturing facilitiesElectronics assembly lines, cleanroom settings
CertificationsTypically none required, but some may have IPC certificationsIPC wire bonding certifications often preferred

Both roles are essential in semiconductor manufacturing, with the Die Attach Operator focusing on attaching dies and the Wire Bonding Technician on creating electrical connections. While their skills overlap in precision and cleanroom work, their specific tasks and certifications differ, making each role unique within the industry.

What are Die Attach Operators?

Die Attach Operators are skilled technicians who are responsible for attaching semiconductor die (chips) to substrates or packages during the manufacturing of electronic devices. They operate and monitor die attach machines, ensure precise placement of the die, and inspect for quality and alignment. This role is critical in semiconductor production, as accurate die attachment is essential for the performance and reliability of microelectronic components. Die Attach Operators often work in cleanroom environments and must follow strict safety and quality protocols. They may also perform basic equipment maintenance and troubleshoot minor issues during production.
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Die Attach Operator jobs near you
Infographic showing various Die Attach Operator job openings in the United States as of July 2026, with employment types broken down into 75% Full Time, 22% Part Time, 1% Temporary, and 2% Contract. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $42,750 per year, or $20.6 per hour.
Bond Operator

Bond Operator

Pacer Staffing

Orangeburg, NY • On-site

$18 - $22/hr

Contractor

This job post has expired 1 day ago. Applications are no longer accepted.

Job description

**Job Title: Bond Operator

**

**Location: Orangeburg, NY 10962Pay Rate: $18.00–$22.00 per hourDuration: 3–6 Month Contract

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**Job Summary

**

We are seeking a skilled Bond Operator to join our manufacturing team in Orangeburg, NY. In this role, you will be responsible for assembling and bonding sputter targets to backing plates used in Physical Vapor Deposition (PVD) coating processes. The ideal candidate will have strong mechanical aptitude, experience using precision measuring tools, and a commitment to producing high-quality work in a manufacturing environment.

**Key Responsibilities

**

  • Assemble and bond sputter targets to backing plates following approved processes and work instructions.

  • Perform shot blasting, grit blasting, polishing, and surface preparation to ensure proper bonding.

  • Apply and verify base layers before spray or bonding operations as required.

  • Measure bonded targets using precision instruments such as calipers, micrometers, and gauges.

  • Verify finished products meet technical drawings and quality specifications.

  • Accurately record measurements and process data in the MES system.

  • Identify and report nonconforming materials or process issues and assist with corrective actions.

  • Follow all safety, quality, and operational procedures.

  • Maintain tools, equipment, and work areas in accordance with 5S standards.

  • Support continuous improvement, productivity, and quality initiatives.

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**Required Qualifications

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  • Technical degree or vocational training in mechanics, electromechanics, manufacturing, or equivalent hands-on experience.

  • Minimum of 2 years of relevant manufacturing experience.

  • Ability to read and interpret technical drawings, work instructions, and specifications.

  • Experience using precision measuring tools, including calipers, micrometers, and gauges.

  • Strong attention to detail and commitment to quality.

  • Basic computer skills for MES documentation and data entry.

  • Ability to work in a structured manufacturing environment while following standardized procedures.

**Preferred Qualifications

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  • Experience with sputter target bonding or PVD manufacturing.

  • Experience with shot blasting, grit blasting, polishing, or thermal spray processes.

  • Knowledge of Lean Manufacturing and continuous improvement methodologies.

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**Physical Requirements

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  • Ability to stand for extended periods.

  • Ability to lift and handle materials up to 50 lbs (with or without reasonable accommodation).

  • Good manual dexterity to handle precision components and measuring instruments.

You should be proficient in:

  • Die Attach/Bonding
  • Equipment Troubleshooting
  • Mixing
  • CNC Machine Setup & Changeover
ID:qnkTyx