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Die Attach Operator Jobs in Wisconsin (NOW HIRING)

WI · On-site

$80 - $100/hr

... epoxy die attach, hermetic sealing, welding, lid attach, leak testing, and assembly.* Lead and ... Analyze process and test data to define operating limits, specifications, and control parameters.

Processing Operator

Janesville, WI · On-site

$17.50 - $22/hr

Processing operators perform different jobs depending on skill and training level.Essential ... Assemble extruder parts and attach the correct die for the order.Change dies as needed for ...

Processing Operator

Janesville, WI · On-site

$18.75 - $23.50/hr

Processing operators perform different jobs depending on skill and training level. Essential ... Assemble extruder parts and attach the correct die for the order. * Change dies as needed for ...

... Operator is expected to run effectively on multiple pieces of equipment -- flexo folder gluers, die ... Complete all required quality check forms and attach job ticket documentation before releasing ...

... Operator is expected to run effectively on multiple pieces of equipment -- flexo folder gluers, die ... Complete all required quality check forms and attach job ticket documentation before releasing ...

... Operator is expected to run effectively on multiple pieces of equipment -- flexo folder gluers, die ... Complete all required quality check forms and attach job ticket documentation before releasing ...

Die Attach Operator information

What is a die attach operator?

Die Attach Operators are skilled technicians who are responsible for attaching semiconductor die (chips) to substrates or packages during the manufacturing of electronic devices. They operate and monitor die attach machines, ensure precise placement of the die, and inspect for quality and alignment. This role is critical in semiconductor production, as accurate die attachment is essential for the performance and reliability of microelectronic components. Die Attach Operators often work in cleanroom environments and must follow strict safety and quality protocols. They may also perform basic equipment maintenance and troubleshoot minor issues during production.

What are the key skills and qualifications needed to thrive as a die attach operator, and why are they important?

To thrive as a Die Attach Operator, you need a solid understanding of semiconductor manufacturing processes, attention to detail, and a high school diploma or equivalent. Familiarity with die attach machines, microscopes, and process monitoring systems is typically required, and certifications in electronics manufacturing can be advantageous. Strong hand-eye coordination, reliability, and the ability to follow strict procedural guidelines are valuable soft skills in this role. These competencies are crucial for ensuring precision, product quality, and efficiency in the assembly of microelectronic components.

What are some typical challenges faced by die attach operators, and how can they be managed on the job?

Die Attach Operators often encounter challenges such as maintaining precise alignment of tiny semiconductor dies, managing equipment calibration, and ensuring consistent quality under production deadlines. To manage these, operators must pay close attention to detail, follow strict process documentation, and communicate effectively with quality control and maintenance teams. Regular training and staying updated on equipment best practices also help reduce errors and improve efficiency in this fast-paced manufacturing environment.

What is the difference between Die Attach Operator vs Wire Bonding Technician?

AspectDie Attach OperatorWire Bonding Technician
Primary RoleAttaches semiconductor dies to substrates using adhesives or solderingCreates electrical connections by bonding wires to semiconductor devices
Required SkillsPrecision placement, soldering, handling small componentsWire bonding techniques, equipment operation, quality inspection
Work EnvironmentCleanroom manufacturing facilitiesElectronics assembly lines, cleanroom settings
CertificationsTypically none required, but some may have IPC certificationsIPC wire bonding certifications often preferred

Both roles are essential in semiconductor manufacturing, with the Die Attach Operator focusing on attaching dies and the Wire Bonding Technician on creating electrical connections. While their skills overlap in precision and cleanroom work, their specific tasks and certifications differ, making each role unique within the industry.

What job categories do people searching Die Attach Operator jobs in Wisconsin look for?

The top searched job categories for Die Attach Operator jobs in Wisconsin are:

What cities in Wisconsin are hiring for Die Attach Operator jobs?

Cities in Wisconsin with the most Die Attach Operator job openings:

Infographic showing various Die Attach Operator job openings in Wisconsin as of August 2026, with employment types broken down into 48% Full Time, 50% Part Time, 1% Contract, and 1% Nights. Highlights an 99% Physical, and 1% Remote job distribution.

Lean Manufacturing Engineer

FLIR Systems, Inc.

WI • On-site

$80 - $100/hr

Other

Retirement, PTO

Posted 8 days ago


Job description

Lean Manufacturing Engineer page is loaded## Lean Manufacturing Engineerlocations: US - Garland, TXtime type: Full timeposted on: Posted Todayjob requisition id: REQ34014**Be visionary**Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.**Job Description**Teledyne Micropac is looking for a Lean Manufacturing Engineer who will provide hands‐on technical leadership to develop, optimize, and sustain high‐reliability microelectronics manufacturing processes from engineering handoff through full‐scale production. This role focuses on process stability, yield improvement, scrap reduction, and production readiness by applying Lean, Six Sigma, and structured problem‐solving methods. This role will partner closely with engineering, quality, and manufacturing teams to support new product introductions, process changes, and continuous improvement initiatives while ensuring shop‐floor execution aligns with documented standards and KPIs.**What you'll do**The essential functions and key responsibilities for the position include, but are not limited to:* Develop, modify, and optimize manufacturing processes from engineering handoff through full‐scale production.* Provide hands‐on technical leadership for critical microelectronics processes, including wire bond, epoxy die attach, hermetic sealing, welding, lid attach, leak testing, and assembly.* Lead and facilitate DFM reviews, ensuring early and effective collaboration between design engineering and manufacturing.* Analyze process and test data to define operating limits, specifications, and control parameters.* Plan and execute DoEs, equipment capability studies, and support the introduction of new tools, fixtures, and automation technologies.* Support reliability engineering activities including material evaluations, component assessments, failure analysis support, and reliability improvement recommendations.* Lead and support continuous improvement initiatives focused on yield, scrap reduction, throughput, cost, and process stability.* Apply Lean, Six Sigma, and structured problem‐solving methods to eliminate waste and improve execution.* Support organization KPIs to monitor yield, rework, scrap, cycle time, and production readiness.* Coordinate cross‐functional efforts for new product introductions, engineering changes, and process improvement projects.* Ensure engineering documentation accurately reflects shop‐floor execution and drives execution discipline.**What you need*** Associate’s degree in engineering (Mechanical, Electrical, Materials, Industrial, or related discipline) — **required*** 10-15 years of experience in manufacturing engineering, process development, or continuous improvement — **required*** Hands‐on experience with microelectronics or high‐reliability manufacturing processes such as wire bonding, die attach, hermetic sealing, welding, or precision assembly — **required*** Strong cross‐functional communication skills with the ability to coordinate engineering, quality, and manufacturing teams — **required*** Ability to manage multiple technical initiatives, track actions and risks, and drive timely closure — **required*** Lean Six Sigma Green Belt or similar certification — **preferred*** Working knowledge of Lean, Six Sigma, standard work, and yield improvement methodologies — **preferred*** Experience in aerospace, defense, medical, or other regulated manufacturing environments — **preferred*** Experience using ERP/MRP systems— **preferred****What we offer*** A collaborative, mission-driven work environment* Opportunities to grow within a global technology leader* Competitive compensation and benefits* Paid time off and holidays* Retirement savings plans* Tuition reimbursement and professional development support**What happens next**Apply online and our recruiting team will review your application. If your background aligns, we’ll reach out to schedule a conversation. We value transparency and will keep you informed every step of the way.Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.Teledyne is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws. #J-18808-Ljbffr