1

Die Attach Operator Jobs (NOW HIRING)

Configuring, programming, operating, qualifying, and sustaining the operation of manual and automated assembly machines (epoxy, solder, die attach, pick-n-place, wire-bonding, plasma cleaning, etc.

Configuring, programming, operating, qualifying, and sustaining the operation of manual and automated assembly machines (epoxy, solder, die attach, pick-n-place, wire-bonding, plasma cleaning, etc.

Die Cast Operator

Lewisburg, TN

$15.50 - $18.25/hr

Job Title: Die Cast Operator JOIN THE TEAM THAT'S POWERING PROGRESS Building cities. Driving ... Complete appropriate production paperwork such as: attach tickets, tags, etc. to dunnage or pallets.

... die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the ... Document processes, results, deviations from the standard operating procedures and lessons learned ...

... die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the ... Document processes, results, deviations from the standard operating procedures and lessons learned ...

... die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the ... Document processes, results, deviations from the standard operating procedures and lessons learned ...

... operating procedures and work instructions. Key Responsibilities Learn to operate a variety of semiconductor assembly equipment potentially including adhesive/underfill dispense, die attach, optical ...

Lead Optical Packaging Engineer

Salem, NH ยท On-site

$102.30K - $134.80K/yr

This full-time, exempt position will report to the COO and will be located at our Salem, NH ... die attach methods, wirebonding, flip chip die attach, seam seal, laser mark, and related ...

next page

Showing results 1-20

Die Attach Operator information

See salary details

$12

$20

$27

How much do die attach operator jobs pay per hour?

As of Jun 3, 2026, the average hourly pay for die attach operator in the United States is $20.55, according to ZipRecruiter salary data. Most workers in this role earn between $17.79 and $22.84 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Die Attach Operator, and why are they important?

To thrive as a Die Attach Operator, you need a solid understanding of semiconductor manufacturing processes, attention to detail, and a high school diploma or equivalent. Familiarity with die attach machines, microscopes, and process monitoring systems is typically required, and certifications in electronics manufacturing can be advantageous. Strong hand-eye coordination, reliability, and the ability to follow strict procedural guidelines are valuable soft skills in this role. These competencies are crucial for ensuring precision, product quality, and efficiency in the assembly of microelectronic components.

What are some typical challenges faced by Die Attach Operators, and how can they be managed on the job?

Die Attach Operators often encounter challenges such as maintaining precise alignment of tiny semiconductor dies, managing equipment calibration, and ensuring consistent quality under production deadlines. To manage these, operators must pay close attention to detail, follow strict process documentation, and communicate effectively with quality control and maintenance teams. Regular training and staying updated on equipment best practices also help reduce errors and improve efficiency in this fast-paced manufacturing environment.

What are Die Attach Operators?

Die Attach Operators are skilled technicians who are responsible for attaching semiconductor die (chips) to substrates or packages during the manufacturing of electronic devices. They operate and monitor die attach machines, ensure precise placement of the die, and inspect for quality and alignment. This role is critical in semiconductor production, as accurate die attachment is essential for the performance and reliability of microelectronic components. Die Attach Operators often work in cleanroom environments and must follow strict safety and quality protocols. They may also perform basic equipment maintenance and troubleshoot minor issues during production.

What is the difference between Die Attach Operator vs Wire Bonding Technician?

AspectDie Attach OperatorWire Bonding Technician
Primary RoleAttaches semiconductor dies to substrates using adhesives or solderingCreates electrical connections by bonding wires to semiconductor devices
Required SkillsPrecision placement, soldering, handling small componentsWire bonding techniques, equipment operation, quality inspection
Work EnvironmentCleanroom manufacturing facilitiesElectronics assembly lines, cleanroom settings
CertificationsTypically none required, but some may have IPC certificationsIPC wire bonding certifications often preferred

Both roles are essential in semiconductor manufacturing, with the Die Attach Operator focusing on attaching dies and the Wire Bonding Technician on creating electrical connections. While their skills overlap in precision and cleanroom work, their specific tasks and certifications differ, making each role unique within the industry.

More about Die Attach Operator jobs
What cities are hiring for Die Attach Operator jobs? Cities with the most Die Attach Operator job openings:
What states have the most Die Attach Operator jobs? States with the most job openings for Die Attach Operator jobs include:
Infographic showing various Die Attach Operator job openings in the United States as of May 2026, with employment types broken down into 5% Full Time, and 95% Part Time. Highlights an 94% Physical, 2% Hybrid, and 4% Remote job distribution, with an average salary of $42,750 per year, or $20.6 per hour.
Micro-Electronics Assembler 2nd Shift

Micro-Electronics Assembler 2nd Shift

Stellant Systems

Torrance, CA โ€ข On-site

$25 - $35/hr

Full-time, Other

Posted 11 days ago


Job description

Job Title: Micro-Electronics Asembler 2nd Shiftย 

Job Location: Torrance, CA

Salary: $25.00-$35.00/hr DOE

Performs standard assembly, die bonding, wire bonding, and installation steps for the components for microwave assemblies.


Typical duties and requirements are not meant to be all encompassing but a general framework of requirements/responsibilities for:

  • Perform basic mechanical assembly of channel amplifiers, linearizers, and other precision microwave parts and provide MIC assembly technical support per documented work instructions with or without assistance.
  • Mechanical assembly consisting of housing fabrication for HI-REL channel amplifiers.
  • MIC assembly consisting of brazing, die attach, wedge-wedge bonding and gap welding.
  • Responsible for effectively and efficiently setting up and operating assembly and/or equipment as required to manufacture and process through final acceptance and delivery.
  • Support test for electrical changes being performed for tuning purposes.
  • Familiar with brazing, die attach, wedge-wedge bonding and gap welding processes.
  • Ability to work under a microscope for extended periods of time
  • Interpret job routers, written instructions, wiring diagrams and schematic drawings for assembly of electronics.
  • Perform a variety of inspections to ensure assemblies meet or exceed standards
  • Disassembling, modifying, reworking, re-assembling assemblies and subassemblies according to specifications and under simulated conditions with or without supervision.
  • Must continuously meet/exceed production schedules and deadlines according to quality standards.
  • Maintainย logs,ย paperwork, and forms accurately consistent with company policy and practices.
  • Additional Duties as assigned by supervisor or manager

  • 0-5 years in a high-volume, microwave or other high technology experience.
  • At least 1 year experience with electronic and mechanical assembly, soldering, brazing, die attach, wedge-wedge bonding and gap welding.
  • IPC J-STD-001, IPC-A-610, MIL-STD-2000, NASA-STD-8739.3, or equivalent
  • Must be able to read and understand mechanical drawings and detailed work instructions
  • High School Diploma or GED Required

Certification/Licenses:

  • IPC J-STD-001, IPC-A-610, MIL-STD-2000, NASA-STD-8739.3, or equivalent

Knowledge, Skills, and Ability:

  • Ability to work under a 60x microscope for extended periods of time
  • Specific abilities for manual dexterity, coordination, and stamina
  • Strong analytical and problem-solving skills
  • Strong communication skills: interpersonal, oral, and written
  • Ability to effectively manage multiple tasks/projects
  • Ability to work on a team as well as independently

Stellant Systems is an Equal Opportunity/Affirmative Action Employer. We consider applicants without regard to race, color, religion, age, national origin, ancestry, ethnicity, gender, gender identity, gender expression, sexual orientation, marital status, veteran status, disability, genetic information, citizenship status or membership in any other group protected by federal, state or local law.

ย 

To conform to U.S. Government export regulations, the applicant must be a U.S. citizen, lawful permanent resident of the U.S. (e.g. Green Card holder), or a protected individual as defined by the International Traffic in Arm Regulations (ITAR).