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Die Attach Process Engineer Jobs (NOW HIRING)

Assembly - Die Attach

Salem, NH ยท On-site

$17.50 - $22/hr

Assembly Technician - Die Attach (Optoelectronic Manufacturing) The Assembly Technician - Die ... Partner closely with Engineering and Quality to implement process improvements and corrective ...

$17.50 - $22/hr

Assembly Technician - Die Attach (Optoelectronic Manufacturing) The Assembly Technician - Die ... Partner closely with Engineering and Quality to implement process improvements and corrective ...

Maintain process documentation, build reports, and program updates * Perform basic machine ... Support advanced tasks (lid attach programming, epoxy attach, parameter developments Qualifications

Senior Process Engineer

Milpitas, CA ยท On-site

$100K - $135K/yr

Hands-on Experience in wafer thinning, dicing, die-attach, flip chip, and wire bonding preferred Knowledge/Skills: * 10 years of Assembly Process Engineering experience, preferred Hands on in Die ...

Senior Process Engineer

San Jose, CA ยท On-site

$100K - $150K/yr

Senior Process Engineer Full Time- ISV Engineering San Jose, CA, US 30+ days ago Requisition ID ... Knowledge in test methods with related equipment is a plus (wire bond, die attach, & furnace)

Senior Process Engineer

Milpitas, CA ยท On-site

$100K - $135K/yr

Hands-on Experience in wafer thinning, dicing, die-attach, flip chip, and wire bonding preferred Knowledge/Skills: * 10 years of Assembly Process Engineering experience, preferred Hands on in Die ...

Lead or support solder attach process development, including die attach, component attach, and ... Mechanical Engineering** or related field * 3-8+ years of relevant industry experience * Strong ...

New

By working with process engineers; fabricate and assemble electro-optical devices, including die attach, wire-bonding and inspection, with a focus on precision and quality. * Under the guidance of ...

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Die Attach Process Engineer information

See salary details

$49.5K

$92K

$142.5K

How much do die attach process engineer jobs pay per year?

As of Sep 15, 2026, the average yearly pay for die attach process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What does a die attach process engineer do?

A Die Attach Process Engineer is responsible for developing, optimizing, and overseeing the process of attaching semiconductor dies to substrates or packages during the manufacturing of electronic components. This involves selecting appropriate materials, establishing process parameters, troubleshooting issues, and ensuring high yields and quality. They work closely with design, quality, and production teams to implement efficient and reliable die attach processes, often using techniques like epoxy, eutectic, or solder bonding. Their expertise helps ensure the performance and reliability of semiconductor devices.

What are the key skills and qualifications needed to thrive as a die attach process engineer, and why are they important?

To thrive as a Die Attach Process Engineer, you need a solid background in materials science, semiconductor manufacturing, and process engineering, often supported by a relevant engineering degree. Familiarity with die attach equipment, process control systems, and analytical tools like SEM or X-ray inspection is commonly required, along with knowledge of industry standards. Strong problem-solving abilities, attention to detail, and effective communication skills help drive process improvements and cross-functional collaboration. These competencies are essential to ensure high yield, product reliability, and efficient production in semiconductor assembly.

What are some common challenges faced by die attach process engineers, and how can they be addressed?

Die Attach Process Engineers often encounter challenges such as maintaining process consistency, managing material compatibility, and minimizing defects like voids or misalignment. Addressing these issues typically involves close monitoring of equipment calibration, frequent process audits, and collaboration with quality assurance teams. Staying updated on the latest material science developments and engaging in cross-functional problem-solving with R&D and production teams also help in optimizing the die attach process and improving yield.

What is the difference between Die Attach Process Engineer vs Die Attach Technician?

AspectDie Attach Process EngineerDie Attach Technician
CredentialsBachelor's degree in Engineering or related field, certifications in process engineeringTechnical diploma or associate degree, on-the-job training
Work EnvironmentDesigning, optimizing, and overseeing die attach processes in manufacturingExecuting daily die attach tasks on production lines
ResponsibilitiesProcess development, troubleshooting, process improvementPerforming die attach operations, quality checks

The Die Attach Process Engineer focuses on developing and improving die attach processes, ensuring efficiency and quality, while the Die Attach Technician handles the hands-on execution of die attach tasks on the production floor. Both roles require technical knowledge, but the engineer's role is more analytical and process-oriented, whereas the technician's role is more operational and task-specific.

What are popular job titles related to Die Attach Process Engineer jobs?

For Die Attach Process Engineer jobs, the most frequently searched job titles are:

Assembly - Die Attach

Salem, NH โ€ข On-site

GPD Optoelectronics
Manufacturingย โ€ขย 11 - 50 employees

$17.50 - $22/hr

Full-time

This job post hasย expired 1 day ago.ย Applications are no longer accepted.


Job description

Due to EXTENSIVE growth, we are currently looking for folks that share our passion to reveal the invisible!

Assembly Technician – Die Attach (Optoelectronic Manufacturing)

The Assembly Technician – Die Attach is responsible for precision attachment of chips / die used in optoelectronic products within our cleanroom manufacturing environment. This role supports production operations by performing manual and automated die attach processes using epoxy and/or eutectic bonding methods, in accordance with applicable MILSTD883 workmanship and process requirements. The Assembly Technician works within a production team reporting to Operations, while collaborating closely with Engineering and Quality to ensure robust, repeatable processes and highreliability assemblies.

This full-time, non-exempt role will report to the Director of Operations and is located at our Salem, NH Facility.

Key Responsibilities:

Die Attach & Assembly

  • Perform die attach of chips to TOcan headers and / or ceramic substrates using manual and automated epoxy dispense systems and/or eutectic bonding processes
  • Prep materials, load, set up, and operate die attach equipment per approved work instructions, travelers, and process specifications
  • Accurately align die within specified positional and rotational tolerances to ensure proper device performance using both manual and automated pick-and-place (Air-Vac, vac- pen, etc.) methods
  • Adjust process parameters and techniques, within documented guidelines, to achieve intended bonding results

Inspection, Quality & Process Control

  • Conduct detailed visual inspection of die attach operations under microscope to MILSTD883 criteria
  • Verify bond coverage, placement accuracy, cleanliness, and overall workmanship
  • Identify, document, and escalate nonconformances or process deviations
  • Support engineering builds, qualification activities, and rootcause investigations as required

Material Handling & Packaging

  • Handle sensitive optoelectronic components using proper ESD, cleanliness, and contamination (FOD) control practices
  • Maintain material traceability and part identification throughout the manufacturing process
  • Package assemblies per work instructions and cleanliness standards

Collaboration & Production Support

  • Work effectively in a teambased production environment to meet schedule, yield, and quality objectives
  • Partner closely with Engineering and Quality to implement process improvements and corrective actions
  • Maintain accurate documentation, travelers, and production records using our ERP system and shop floor interface

Qualifications & Skills

  • High School / GED or Technical trade school
  • 2-3 years’ experience in a manufacturing or technical environment.
  • Previous experience in microelectronics or optoelectronic assembly preferred (die attach experience highly desired)
  • Familiarity with epoxy dispense systems, eutectic bonding, and regulated manufacturing environments
  • Strong attention to detail, steady manual dexterity, and ability to work under a microscope
  • Demonstrated ability to follow detailed instructions while exercising sound judgment in process execution

Misc.

  • This position may require sitting for long periods at a microscope, bending, reaching, visual acuity for inspection, and lifting up to 30 lbs.
    • These activities are performed in a clean room environment which is temperature and humidity controlled. 
    • This position requires you to wear complete fab attire for an entire shift and meet all safety and cleanroom requirements which can include:

                              Hand Hygiene, Personal Item Removal, Gowning Area Preparation,

                              Order of Gowning, Shoe Covers, Hair Covers, Face Masks, Coveralls/Gowns,

                              Gloves, Additional Garments, Final Inspection and maintaining proper protocols.

GPD provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws.  This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, transfer, leaves of absence, compensation and training.

About GPD

At GPD Optoelectronics, we believe that by operating with integrity and trust we drive constant organizational improvement, which strengthens our relationships with our employees and customers. Customer success remains our highest priority, so we strive to deliver high-quality products on time, and provide unparalleled service, responsiveness, and collaboration.  

Founded in 1973 as Germanium Power Devices Corp, we began by making high-quality germanium transistors.  Since the early 1980’s we have earned our place as a trusted manufacturer of both germanium and indium gallium arsenide photodiodes.     We are located in Salem, NH.


Employment Type: Full Time
Years Experience: 1 - 3 years
Salary: $00 Hourly
Bonus/Commission: No