... Next-Gen AI SOC chip. If hired, you will be responsible for delivering TFM (tool, flow and ... and resolve design issues, and provide guidance to engineers. Qualifications Required ...
... Next-Gen AI SOC chip. If hired, you will be responsible for delivering TFM (tool, flow and ... and resolve design issues, and provide guidance to engineers. Qualifications Required ...
mmWave IC Design Engineer - TeraWave
$230K - $322K/yr
Design and simulate on-chip electromagnetic (EM) structures and collaborate with the package ... Bachelor's degree in Electrical Engineering, or related technical discipline * 7+ years of ...
mmWave IC Design Engineer - TeraWave
$230K - $322K/yr
Design and simulate on-chip electromagnetic (EM) structures and collaborate with the package ... Bachelor's degree in Electrical Engineering, or related technical discipline * 7+ years of ...
mmWave IC Design Engineer - TeraWave
Seattle, WA · On-site
$230K - $322K/yr
Design and simulate on-chip electromagnetic (EM) structures and collaborate with the package ... Bachelor's degree in Electrical Engineering, or related technical discipline * 7+ years of ...
mmWave IC Design Engineer - TeraWave
Seattle, WA · On-site
$230K - $322K/yr
Design and simulate on-chip electromagnetic (EM) structures and collaborate with the package ... Bachelor's degree in Electrical Engineering, or related technical discipline * 7+ years of ...
Principal ASIC Physical Design Engineer
Seattle, WA · On-site
$190K - $280K/yr
Support chip bring-up and debug through close collaboration with post-silicon and test teams ... Engineering, or related field. * 10+ years of experience in ASIC physical design for high ...
Principal ASIC Physical Design Engineer
Seattle, WA · On-site
$190K - $280K/yr
Support chip bring-up and debug through close collaboration with post-silicon and test teams ... Engineering, or related field. * 10+ years of experience in ASIC physical design for high ...
Collaborate with chip architects, verification engineers, formal verification engineers, and SoC ... Deep understanding of ASIC design flows and methodology * Strong analytical and interpersonal ...
Collaborate with chip architects, verification engineers, formal verification engineers, and SoC ... Deep understanding of ASIC design flows and methodology * Strong analytical and interpersonal ...
Sr. RF Front-End Module Design Engineer (RFIC Engineering)
Redmond, WA · On-site
$160K - $225K/yr
Experience in designing multi-chip RF modules for cellular or Wi-Fi applications * Familiar with ... RFIC Design Engineer/Senior: $160,000.00 - $225,000/per year Your actual level and base salary will ...
Sr. RF Front-End Module Design Engineer (RFIC Engineering)
Redmond, WA · On-site
$160K - $225K/yr
Experience in designing multi-chip RF modules for cellular or Wi-Fi applications * Familiar with ... RFIC Design Engineer/Senior: $160,000.00 - $225,000/per year Your actual level and base salary will ...
Sr. RF Front-End Module Design Engineer (RFIC Engineering)
Redmond, WA · On-site
$160K - $225K/yr
Experience in designing multi-chip RF modules for cellular or Wi-Fi applications * Familiar with ... RFIC Design Engineer/Senior: $160,000.00 - $225,000/per year Your actual level and base salary will ...
Sr. RF Front-End Module Design Engineer (RFIC Engineering)
Redmond, WA · On-site
$160K - $225K/yr
Experience in designing multi-chip RF modules for cellular or Wi-Fi applications * Familiar with ... RFIC Design Engineer/Senior: $160,000.00 - $225,000/per year Your actual level and base salary will ...
Sr. RF Front-End Module Design Engineer (RFIC Engineering)
Redmond, WA · On-site
$160K - $225K/yr
Experience in designing multi-chip RF modules for cellular or Wi-Fi applications * Familiar with ... RFIC Design Engineer/Senior: $160,000.00 - $225,000/per year Your actual level and base salary will ...
Sr. RF Front-End Module Design Engineer (RFIC Engineering)
Redmond, WA · On-site
$160K - $225K/yr
Experience in designing multi-chip RF modules for cellular or Wi-Fi applications * Familiar with ... RFIC Design Engineer/Senior: $160,000.00 - $225,000/per year Your actual level and base salary will ...
Senior ASIC Package Design Engineer
Seattle, WA · On-site
$180K - $260K/yr
The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.
Senior ASIC Package Design Engineer
Seattle, WA · On-site
$180K - $260K/yr
The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.
Principal ASIC Physical Design Engineer
Seattle, WA · On-site
$190K - $280K/yr
Support chip bring-up and debug through close collaboration with post-silicon and test teams ... Engineering, or related field. * 10+ years of experience in ASIC physical design for high ...
Principal ASIC Physical Design Engineer
Seattle, WA · On-site
$190K - $280K/yr
Support chip bring-up and debug through close collaboration with post-silicon and test teams ... Engineering, or related field. * 10+ years of experience in ASIC physical design for high ...
Principal ASIC Package Design Engineer
Seattle, WA · On-site
$200K - $280K/yr
The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...
Principal ASIC Package Design Engineer
Seattle, WA · On-site
$200K - $280K/yr
The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...
Principal ASIC Physical Design Engineer
$190K - $280K/yr
Support chip bring-up and debug through close collaboration with post-silicon and test teams ... Engineering, or related field. * 10+ years of experience in ASIC physical design for high ...
Quick apply
Principal ASIC Physical Design Engineer
$190K - $280K/yr
Support chip bring-up and debug through close collaboration with post-silicon and test teams ... Engineering, or related field. * 10+ years of experience in ASIC physical design for high ...
Senior ASIC Physical Design Engineer
Seattle, WA · On-site
$170K - $250K/yr
The Role We are seeking a Senior ASIC Physical Design Engineer to help implement advanced SoCs that ... Experience with chip-package co-design or advanced packaging (2.5D/3D). * Familiarity with physical ...
Senior ASIC Physical Design Engineer
Seattle, WA · On-site
$170K - $250K/yr
The Role We are seeking a Senior ASIC Physical Design Engineer to help implement advanced SoCs that ... Experience with chip-package co-design or advanced packaging (2.5D/3D). * Familiarity with physical ...
The Layout Design Engineering group is an integral part of the Silicon Engineering department ... Expert in full-chip/SOC-level floorplanning and integration -- physical implementation of cells and ...
New
Quick apply
The Layout Design Engineering group is an integral part of the Silicon Engineering department ... Expert in full-chip/SOC-level floorplanning and integration -- physical implementation of cells and ...
New
Design Verification Engineer
$122K - $184K/yr
Design Verification Engineers at Apple are responsible for verifying the functionality and ... Description As part of a very dedicated team you will be at the heart of the chip design effort ...
Design Verification Engineer
$122K - $184K/yr
Design Verification Engineers at Apple are responsible for verifying the functionality and ... Description As part of a very dedicated team you will be at the heart of the chip design effort ...
Principal ASIC Package Design Engineer
Seattle, WA · On-site
$200K - $280K/yr
The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...
Quick apply
Principal ASIC Package Design Engineer
Seattle, WA · On-site
$200K - $280K/yr
The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...
Principal ASIC Package Design Engineer
Seattle, WA · On-site
$200K - $280K/yr
The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...
Principal ASIC Package Design Engineer
Seattle, WA · On-site
$200K - $280K/yr
The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...
As Senior RFIC Design Engineer, you will engage with an experienced cross-disciplinary staff to ... Key job responsibilities Collaborate with communications systems, digital design, and chip ...
As Senior RFIC Design Engineer, you will engage with an experienced cross-disciplinary staff to ... Key job responsibilities Collaborate with communications systems, digital design, and chip ...
As Senior RFIC Design Engineer, you will engage with an experienced cross-disciplinary staff to ... Key job responsibilities Collaborate with communications systems, digital design, and chip ...
As Senior RFIC Design Engineer, you will engage with an experienced cross-disciplinary staff to ... Key job responsibilities Collaborate with communications systems, digital design, and chip ...
As Senior RFIC Design Engineer, you will engage with an experienced cross-disciplinary staff to ... Key job responsibilities Collaborate with communications systems, digital design, and chip ...
As Senior RFIC Design Engineer, you will engage with an experienced cross-disciplinary staff to ... Key job responsibilities Collaborate with communications systems, digital design, and chip ...
Chip Design Engineer information
See Seattle, WA salary details
$46.1K - $58.3K
2% of jobs
$58.3K - $70.5K
11% of jobs
$77K is the 25th percentile. Wages below this are outliers.
$70.5K - $82.7K
23% of jobs
The median wage is $90.6K / yr.
$82.7K - $94.9K
22% of jobs
$94.9K - $107.1K
17% of jobs
$107.5K is the 75th percentile. Wages above this are outliers.
$107.1K - $119.3K
9% of jobs
$119.3K - $131.5K
6% of jobs
$131.5K - $143.8K
3% of jobs
$143.8K - $156K
3% of jobs
$156K - $168.2K
2% of jobs
$168.2K - $180.4K
1% of jobs
$46.1K
$100.3K
$180.4K
How much do chip design engineer jobs pay per year?
Are chip designers in demand?
What is the salary of microchip design engineer?
What engineer makes $500,000 a year?
What are some typical projects or daily tasks for a Chip Design Engineer?
As a Chip Design Engineer, your daily tasks often include designing and simulating integrated circuits, reviewing schematics, writing and verifying code in hardware description languages, and collaborating closely with layout engineers and verification teams. You may also participate in design reviews, troubleshoot potential issues, and optimize chip performance to meet specific requirements. Working with cross-functional teams, including software engineers and product managers, is common to ensure the chip integrates seamlessly with end products. This role provides opportunities to see your designs progress from concept to final manufacturing, offering valuable hands-on experience at each stage of development.
What are the key skills and qualifications needed to thrive in the Chip Design Engineer position, and why are they important?
To thrive as a Chip Design Engineer, you need a solid background in electrical engineering, digital and analog circuit design, and experience with VLSI principles, usually backed by a relevant degree. Proficiency with industry-standard tools like Cadence, Synopsys, and experience in HDL languages (such as Verilog or VHDL) is highly valued, as are certifications like Certified IC Designer. Strong problem-solving abilities, attention to detail, and effective teamwork and communication skills help set you apart. These competencies are critical for developing reliable, high-performance chips in a collaborative and deadline-driven environment.
What is a Chip Design Engineer job?
A Chip Design Engineer is responsible for designing and developing integrated circuits (ICs) used in electronic devices. They work with hardware description languages (HDLs) like Verilog or VHDL to create digital or analog circuit designs. Their role includes logic design, verification, simulation, and testing to ensure performance and power efficiency. They collaborate with teams across hardware, software, and manufacturing to bring chips from concept to production. Chip Design Engineers are essential in industries like consumer electronics, automotive, and telecommunications.
How much do chip design engineers make?
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Microsoft rating
8.5
Based on 131 frontline employees who took The Breakroom Quiz
78th of 245 rated software companies
Job description
Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft's expanding Cloud Infrastructure and responsible for powering Microsoft's "Intelligent Cloud" mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission.
As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the AISiE team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.
We are looking for a Principal Physical Design Engineer to join the team.
#SCHIE
Responsibilities
We are looking to expand our Physical Design Engineer team in US with immediate hiring of a few senior and principal level Physical Design engineers to work on Microsoft Next-Gen AI SOC chip. If hired, you will be responsible for delivering TFM (tool, flow and methodology) of Physical Design tasks at block, sub-chip, and/or full-chip level. The roles include one or more of the following tasks - Place and Route (PnR), Static Timing Analysis (STA) and timing ECOs, Physical Verification (PV), Formal Equivalency Verification (FEV), Functional ECO, Global Clocking Construction, IR-Drop/EM (EMIR) and PD Infrastructure and IPs collaterals handling with details below:
• Lead the PnR convergence recipe development for designs at blocks/subsystem and subchip level
• Develop and implement methodologies and strategies to improve physical design efficiency and performance
• Develop and implement methodologies and strategies to sign off blocks, subsystem/Subchip in the areas of static timing analysis, physical verification, functional logics equivalence, low power verification and electromigration and IR drop
• Implementation of functional and timing ECO with least physical design impact
• Design and implement the global clocking scheme at SOC and sub chip levels
• Stay current with industry trends and emerging technologies to continuously improve physical design processes and methodologies
• Installation and quality check of internal and external IP collaterals for use by Physical Design execution team
• Conduct physical design reviews, identify and resolve design issues, and provide guidance to engineers.
Qualifications
Required Qualifications:
Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.
Other:
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.
Preferred Qualifications:
- Bachelor's or Master's in Electrical or Computer Engineering or related field with 10+ years of experience
- Experience in tapeouts of complex ASICs in leading edge technology
- 10+ years of experience in blocks level place and route
- Expertise in one or more of physical design EDA tools such as Synopsys Fusion Compiler, PrimeClosure, Primetime, Formality, VCLP, Star-RC, Redhawk SC, and Cadence Innovus; Siemens Calibre.
- Understanding of semiconductor design principles, methodologies, and tools.
- Proven track record of successfully leading physical design projects and delivering high-quality semiconductor products
- Adequate scripting skillsets in TCL and Python
- Good understanding of foundry tech files and rule decks
Silicon Engineering IC5 - The typical base pay range for this role across the U.S. is USD $142,800 - $274,800 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.
What Microsoft employees say
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About Microsoft
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Our infrastructure is comprised of a large global portfolio of more than 100 datacenters and 1 million servers. Our foundation is built upon and managed by a team of subject matter experts working to support services for more than 1 billion customers and 20 million businesses in over 90 countries worldwide. With environmental sustainability and optimization at the forefront of our datacenter design and operations, we continue to grow and evolve as we meet the ever-changing business demands that hold Microsoft as a world-class cloud provider.
Industry
Computer and computer peripheral equipment and software wholesalers
Company size
10,000+ Employees
Headquarters location
Redmond, WA, US
Year founded
1975