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Job Title: Senior Associate, Semiconductor Development Engineer

Job Code: 40984

Job Location: Mason, Ohio

Job Schedule: 9/80 - Employees work 9 out of every 14 days - totaling 80 hours worked - and have every other Friday off

Job Description:

L3Harris is dedicated to recruiting and developing high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers' mission and quest for professional growth. L3Harris provides an inclusive, engaging environment designed to empower employees and promote work-life success. Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do.
L3Harris is the Trusted Disruptor in defense tech. With customers' mission-critical needs always in mind, our employees deliver end-to-end technology solutions connecting the space, air, land, sea and cyber domains in the interest of national security. Visit L3Harris.com for more information.

L3Harris Technologies is seeking a Senior Associate, Semiconductor Development Engineer to join our Focal Plane Array team in Mason, Ohio. In this role, you will help advance the development of next-generation infrared focal plane array (FPA) technologies in a collaborative, fast-paced engineering environment.

As a Semiconductor Development Engineer, you will contribute to a range of technology development and maturation efforts that support innovative infrared sensing solutions. You will begin by supporting active FPA development programs alongside experienced engineers and will have the opportunity to grow into a more independent and leading role as you build technical depth and program knowledge.

In this position, you will work with both internal and external wafer and FPA fabrication tools and processes to support development objectives. You will create and refine specialized procedures, oversee process execution, collect and analyze test data, identify process challenges and improvement opportunities, and help drive iterative development toward program goals. Your work will play a direct role in improving process performance, solving complex technical issues, and advancing critical technology capabilities.

You will collaborate regularly with a cross-functional team that includes equipment engineers, operations leaders, process technicians, and fellow development engineers. This role also offers opportunities to engage with customers and external partners, and to present your technical work in a variety of internal and external settings.

This is an exciting opportunity for an engineer who is energized by hands-on development work, technical problem-solving, and the chance to contribute to advanced semiconductor and infrared sensor technologies.

Essential Functions:

• Contribute to the development of advanced infrared focal plane array (FPA) technologies as part of a collaborative engineering team.
• Decompose end-to-end technical solutions into well-defined tasks and lead the development of specialized procedures for each phase, drawing on expertise in applicable tools, equipment, materials, and processes.
• Partner closely with the FPA Processing Group to oversee procedure execution, including metrology, data collection, and analysis before, during, and after processing steps as needed.
• Familiarity with semiconductor processing techniques such as photolithography, etching, deposition, bonding, grinding, or dicing.
• Ability to work in a cleanroom environment while wearing required protective garments, including a face mask, safety glasses, gloves, full coveralls, head covering, and boots.
• Proficiency with Microsoft PowerPoint, Word, and Excel.
• Lead and support technical problem-solving efforts using established corporate tools, processes, and procedures to iteratively achieve development objectives.
• Document and communicate technical results clearly through drawings, graphs, reports, and presentations, and publish findings through appropriate technical channels.
• Participate in technical discussions with customers and external collaboration partners.

Qualifications:

• Bachelor's degree in science or engineering with at least 2 years of related experience.
• Graduate Degree or equivalent with 0 to 2 years of prior related experience.
• In lieu of a degree, 6 years of related experience may be considered.

Preferred Additional Skills:

• Hands-on semiconductor processing experience with techniques such as thin-film coating, photolithography, etching, deposition, bonding, grinding, and dicing.
• Demonstrated scientific research and problem-solving skills related to advanced FPA and adjacent technologies.
• Experience with technical programming and physics-based modeling using commercial software packages.
• Strong technical writing and presentation skills, with the ability to communicate effectively to both technical and non-technical audiences.
• Experience supporting bids and proposals in accordance with best practices and applicable industry or military standards.
• Project management skills and familiarity with standard project management tools.

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