Role Overview
As a Principal Package Thermal & Mechanical Engineer at Astera Labs, you will serve as a technical leader driving the development and modeling of advanced IC packaging solutions that enable next-generation AI and high-performance connectivity systems.
In this highly visible role, you will define and execute thermal and mechanical modeling strategies across the chip-package-board system, influencing package architecture, material selection, and reliability design. You will partner closely with package design, SIPI, silicon, system, and manufacturing teams to ensure robust thermal/mechanical performance and first-pass success.
You will also drive modeling methodologies, correlation strategies, and best-known methods (BKMs), while engaging directly with customers to translate complex simulation insights into actionable system-level solutions.
Key Responsibilities
- Thermal & Mechanical Modeling Leadership
- Define and drive thermal and mechanical modeling strategies for advanced packages (FCBGA, FCCSP, multi-die, and chiplet-based architectures)
- Perform detailed thermal simulations including steady-state and transient heat transfer (conduction, convection, and interface resistances such as TIM1/TIM2)
- Develop and deploy compact thermal models (CTM), reduced-order models (ROM), and DELPHI-based models for system-level integration
- Analyze power density, hotspot behavior, and package-to-system thermal interactions across air and liquid cooling environments
- Perform thermo-mechanical stress/strain analysis including CTE mismatch, viscoelastic material behavior, and deformation
- Predict package warpage across process and use conditions (reflow, underfill cure, board attach, field operation)
- Model solder joint reliability and fatigue using industry standard models
- Package Architecture & Thermal Design Strategy
- Drive package design decisions including material selection (EMC, substrate, TIM, lid/heat spreader), thermal path optimization, and early-stage architecture definition across air and liquid cooling solutions (air, cold plate, CPO/CPC)
- Conduct DOE, sensitivity studies, and worst-case analysis to guide tradeoffs across performance, cost, reliability, and manufacturability
- System Co-Design & Automation
- Partner cross-functionally to drive chip-package-board co-design and resolve system-level thermal/mechanical challenges, including system integration constraints
- Serve as a technical interface for customers and internal teams, translating modeling results into actionable insights and leading design reviews and issue resolution
- Develop and scale modeling methodologies, workflows, and BKMs; mentor engineers and improve efficiency through automation and scripting (Python, MATLAB)
Basic Qualifications
- M.S. or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, or related field
- 8+ years of experience in semiconductor packaging with strong focus on thermal and mechanical modeling
- Deep expertise in thermal modeling and simulation, including steady-state and transient analysis, compact thermal modeling (CTM), DELPHI methodology, and system-level thermal integration using tools such as ANSYS Icepak, Flotherm, or equivalent
- Deep expertise in thermo-mechanical modeling and FEA simulation, including stress/strain analysis, warpage prediction, and reliability modeling (BLR/CLR), using tools such as ANSYS Mechanical, or equivalent
- Proven ability to correlate simulation results with lab measurements
- Experience influencing package design and delivering solutions to production
- Strong cross-functional collaboration across package design, SIPI, system, and manufacturing teams
Preferred Qualifications
- Experience with high-power AI / HPC packages and large FCBGA (>50mm)
- Familiarity with advanced packaging technologies:2.5D / 3D integration, Chiplet, CPO/CPC
- Experience with system-level cooling solutions: Liquid cooling, cold plates, immersion cooling
- Knowledge of JEDEC standards and reliability qualification methodologies
- Experience working with OSATs and substrate vendors on thermal/mechanical design optimization
- Proficiency in scripting (Python, MATLAB) for modeling automation
- Exposure to multi-physics coupling (electrical-thermal-mechanical interactions)
ย The base salary range is $185,000 USD - $230,000 USD. Your base salary will be determined based on location, experience, and employees' pay in similar positions.