Responsible for programming automated equipment to conduct a specific process (e.g. dice, die attach, wire bond, etc.) * Diagnose problems, replace or repair parts, test and make adjustments. * Able ...
Responsible for programming automated equipment to conduct a specific process (e.g. dice, die attach, wire bond, etc.) * Diagnose problems, replace or repair parts, test and make adjustments. * Able ...
Manufacturing Engineer
Torrance, CA · On-site
$80K - $130K/yr
Provide training in die-assembly, wire bond technology, problem analysis and resolution. * Knowledge and understanding of the following preferred: * Mechanical assembly of channel amplifiers ...
Manufacturing Engineer
Torrance, CA · On-site
$80K - $130K/yr
Provide training in die-assembly, wire bond technology, problem analysis and resolution. * Knowledge and understanding of the following preferred: * Mechanical assembly of channel amplifiers ...
Packaging Engineer, Sr.
San Diego, CA · On-site
Extensive expertise in Flip Chip, Wire Bond, and System in Package (SiP) assembly processes, as well as familiarity with related materials and equipment, is required. The role demands strong ...
Packaging Engineer, Sr.
San Diego, CA · On-site
Extensive expertise in Flip Chip, Wire Bond, and System in Package (SiP) assembly processes, as well as familiarity with related materials and equipment, is required. The role demands strong ...
Inspect wire bonds and micro-electronic assemblies using microscopes and measurement tools. * Perform rework, repair, and troubleshooting of assemblies. * Support engineering activities including ...
Inspect wire bonds and micro-electronic assemblies using microscopes and measurement tools. * Perform rework, repair, and troubleshooting of assemblies. * Support engineering activities including ...
Inspect wire bonds and micro-electronic assemblies using microscopes and measurement tools. * Perform rework, repair, and troubleshooting of assemblies. * Support engineering activities including ...
Inspect wire bonds and micro-electronic assemblies using microscopes and measurement tools. * Perform rework, repair, and troubleshooting of assemblies. * Support engineering activities including ...
Process Engineering Group Leader
Newburyport, MA · On-site
$141K/yr
In depth knowledge of wire bond equipment required, with direct experience with ASM Eagle and/or KnS ICONN systems. * Demonstrable knowledge on wafer processing, Wafer Saw, Die Attach, and Wire Bond ...
Process Engineering Group Leader
Newburyport, MA · On-site
$141K/yr
In depth knowledge of wire bond equipment required, with direct experience with ASM Eagle and/or KnS ICONN systems. * Demonstrable knowledge on wafer processing, Wafer Saw, Die Attach, and Wire Bond ...
Staff Package Design Engineer
Austin, TX · On-site
Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs. Responsibilities * Collaborate with cross-functional teams to drive package designs that meets ...
Staff Package Design Engineer
Austin, TX · On-site
Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs. Responsibilities * Collaborate with cross-functional teams to drive package designs that meets ...
Principal Reliability/FA Engineer
$108K - $136K/yr
Knowledge of IC packaging technologies (e.g., wire bond, flip-chip, molding) is preferred, with exposure to advanced packaging and emerging materials considered a plus. The ideal candidate ...
Principal Reliability/FA Engineer
$108K - $136K/yr
Knowledge of IC packaging technologies (e.g., wire bond, flip-chip, molding) is preferred, with exposure to advanced packaging and emerging materials considered a plus. The ideal candidate ...
Principal Packaging Engineer
Sunnyvale, CA · On-site
$170K - $220K/yr
Lead Frame (LF), design, clip design, wire bond * Experiences in RD concept development and novel power electronics packaging technologies * Experience with assembly manufacturing processes and ...
Quick apply
Principal Packaging Engineer
Sunnyvale, CA · On-site
$170K - $220K/yr
Lead Frame (LF), design, clip design, wire bond * Experiences in RD concept development and novel power electronics packaging technologies * Experience with assembly manufacturing processes and ...
Lead Frame (LF), design, clip design, wire bond * Experiences in RD concept development and novel power electronics packaging technologies * Experience with assembly manufacturing processes and ...
Lead Frame (LF), design, clip design, wire bond * Experiences in RD concept development and novel power electronics packaging technologies * Experience with assembly manufacturing processes and ...
Automatic/Manual Wire Bonding Operator
$16.75 - $20.25/hr
Operator is responsible for proper wire formation, bond appearance and bond strength. * Flexibility to be trained in multiple Microelectronics processes that involve ball & wedge wire bonding
Automatic/Manual Wire Bonding Operator
$16.75 - $20.25/hr
Operator is responsible for proper wire formation, bond appearance and bond strength. * Flexibility to be trained in multiple Microelectronics processes that involve ball & wedge wire bonding
Perform internal visual inspection and wire bond pull to operating various tools such as real time X-ray, XRF, scanning acoustic microscope, hermeticity test equipment and optical microscopes.
Quick apply
Perform internal visual inspection and wire bond pull to operating various tools such as real time X-ray, XRF, scanning acoustic microscope, hermeticity test equipment and optical microscopes.
Assembly/Build Technician (Contract Role)
Newbury Park, CA · On-site
$18.50 - $23.25/hr
Daily activities include building prototype semiconductor parts using assembly equipment such as SMT machine, reflow oven, dicing equipment, Die attach, wire bond, mold, laser marking strip grinder ...
Assembly/Build Technician (Contract Role)
Newbury Park, CA · On-site
$18.50 - $23.25/hr
Daily activities include building prototype semiconductor parts using assembly equipment such as SMT machine, reflow oven, dicing equipment, Die attach, wire bond, mold, laser marking strip grinder ...
Principal Packaging Engineer
Sunnyvale, CA · On-site
$170K - $220K/yr
Lead Frame (LF), design, clip design, wire bond * Experiences in RD concept development and novel power electronics packaging technologies * Experience with assembly manufacturing processes and ...
Principal Packaging Engineer
Sunnyvale, CA · On-site
$170K - $220K/yr
Lead Frame (LF), design, clip design, wire bond * Experiences in RD concept development and novel power electronics packaging technologies * Experience with assembly manufacturing processes and ...
Assembly/Build Technician (Contract Role)
Thousand Oaks, CA · On-site
$18.50 - $23.25/hr
Daily activities include building prototype semiconductor parts using assembly equipment such as SMT machine, reflow oven, dicing equipment, Die attach, wire bond, mold, laser marking strip grinder ...
Assembly/Build Technician (Contract Role)
Thousand Oaks, CA · On-site
$18.50 - $23.25/hr
Daily activities include building prototype semiconductor parts using assembly equipment such as SMT machine, reflow oven, dicing equipment, Die attach, wire bond, mold, laser marking strip grinder ...
Daily activities include building prototype semiconductor parts using assembly equipment such as SMT machine, reflow oven, dicing equipment, Die attach, wire bond, mold, laser marking strip grinder ...
Daily activities include building prototype semiconductor parts using assembly equipment such as SMT machine, reflow oven, dicing equipment, Die attach, wire bond, mold, laser marking strip grinder ...
Assembly/Build Technician (Contract Role)
Newbury Park, CA · On-site
$18.50 - $23.25/hr
Daily activities include building prototype semiconductor parts using assembly equipment such as SMT machine, reflow oven, dicing equipment, Die attach, wire bond, mold, laser marking strip grinder ...
Assembly/Build Technician (Contract Role)
Newbury Park, CA · On-site
$18.50 - $23.25/hr
Daily activities include building prototype semiconductor parts using assembly equipment such as SMT machine, reflow oven, dicing equipment, Die attach, wire bond, mold, laser marking strip grinder ...
Assembly/Build Technician (Contract Role)
$18.50 - $23/hr
Daily activities include building prototype semiconductor parts using assembly equipment such as SMT machine, reflow oven, dicing equipment, Die attach, wire bond, mold, laser marking strip grinder ...
Assembly/Build Technician (Contract Role)
$18.50 - $23/hr
Daily activities include building prototype semiconductor parts using assembly equipment such as SMT machine, reflow oven, dicing equipment, Die attach, wire bond, mold, laser marking strip grinder ...
$19.25 - $24/hr
Daily activities include building prototype semiconductor parts using assembly equipment such as SMT machine, reflow oven, dicing equipment, Die attach, wire bond, mold, laser marking strip grinder ...
$19.25 - $24/hr
Daily activities include building prototype semiconductor parts using assembly equipment such as SMT machine, reflow oven, dicing equipment, Die attach, wire bond, mold, laser marking strip grinder ...
$17.25 - $22/hr
... wire bond equipment per approved work instructions and travelers • Handle optoelectronic devices using proper ESD, cleanliness, and contamination (FOD) control techniques • Support engineering ...
$17.25 - $22/hr
... wire bond equipment per approved work instructions and travelers • Handle optoelectronic devices using proper ESD, cleanliness, and contamination (FOD) control techniques • Support engineering ...
Wire Bond information
See salary details
$12.02 - $13.02
5% of jobs
$13.02 - $14.03
3% of jobs
$14.03 - $15.03
11% of jobs
$15.42 is the 25th percentile. Wages below this are outliers.
$15.03 - $16.04
16% of jobs
The median wage is $16.77 / hr.
$16.04 - $17.05
21% of jobs
$17.05 - $18.05
17% of jobs
$18.26 is the 75th percentile. Wages above this are outliers.
$18.05 - $19.06
12% of jobs
$19.06 - $20.06
7% of jobs
$20.06 - $21.07
4% of jobs
$21.07 - $22.07
3% of jobs
$22.07 - $23.08
1% of jobs
$12
$17
$23
How much do wire bond jobs pay per hour?
What is the difference between Wire Bond vs Soldering Technician?
| Aspect | Wire Bond | Soldering Technician |
|---|---|---|
| Required Credentials | Technical training, certification in microelectronics | Technical training, soldering certifications |
| Work Environment | Cleanroom, electronics manufacturing | Electronics assembly, repair workshops |
| Industry Usage | Semiconductor, electronics manufacturing | Electronics repair, assembly |
| Common Tasks | Connecting tiny wires in microchips | Soldering components onto circuit boards |
Wire Bond and Soldering Technician roles both involve working with electronic components, but Wire Bond specialists focus on micro-scale wire connections in semiconductor devices, often in cleanroom environments. Soldering Technicians handle larger-scale soldering tasks in assembly or repair settings. While their skills overlap in electronics manufacturing, their specific tasks and environments differ significantly.
What does a wire bonder do?
What jobs pay 500,000 a year in the US?
What are the key skills and qualifications needed to thrive as a Wire Bond Technician, and why are they important?
What jobs pay 4000 a week without a degree?
What are some common challenges faced by wire bond operators, and how can they be overcome?
What are wire bonders?
What jobs make $1,000,000 a year?

Other
Posted 4 days ago
Job description
Manufacturing Equipment Technician
Reponsibilities:
- Responsible to set-up the equipment (tools) for operators to assist in the building of microelectronic packages
- Assists in reviewing process documentation, required to build a product
- Responsible for operating equipment to assist in the building of microelectronic packages where required
- Responsible for programming automated equipment to conduct a specific process (e.g. dice, die attach, wire bond, etc.)
- Diagnose problems, replace or repair parts, test and make adjustments.
- Able to multi-task daily and change priorities based on the production demand
- Perform regular preventive maintenance on machines, equipment, and plant facilities.
- Perform highly diversified duties to install and maintain production machines and the plant facility's equipment.
- Provide emergency/unscheduled repairs of production equipment during production and performs scheduled maintenance repairs of production equipment during machine service.
- Perform simple machinist duties and responsibilities.
- Perform mechanic skills including, but not limited to, mechanical, electrical, pneumatic, hydraulic, and troubleshooting and repair of production machines.
- Read and interpret equipment manuals and work orders to perform required maintenance and service.
- Comply with safety regulations and maintain clean and orderly work areas.
- Regular and consistent attendance.
- Perform all other related duties and assignments as requested.
Required Skills:
- Knowledge of Automated semiconductor manufacturing equipment related to Wire bonding, Epoxy Die attach and SMT manufacturing processes are key.
- Must have good mechanical background related to equipment maintenance and repair.
- Capable of following direction as related to a manufacturing environment.
- Capable of training others
- Knowledge in materials such as Epoxy, Solder and wire as related to micro-electronics manufacturing.
- Computer literate. Comfortable with Microsoft Word/PowerPoint/Excel .
- Understanding of or experience with LEAN Manufacturing, 5S, Six Sigma.
Job Complexity:
- Works on assignments that are difficult in nature, requiring judgment in resolving issues and making recommendations.
Supervision
- Normally receives minimal instructions on all work. Work under supervision.