... diffusion, implant, grind/polish, glassing, dicing or wafer electrical test). Essential Functions * Perform a variety of functions in the production of semiconductor devices in a cleanroom ...
... diffusion, implant, grind/polish, glassing, dicing or wafer electrical test). Essential Functions * Perform a variety of functions in the production of semiconductor devices in a cleanroom ...
... diffusion, implant, grind/polish, glassing, dicing or wafer electrical test). Essential Functions * Perform a variety of functions in the production of semiconductor devices in a cleanroom ...
... diffusion, implant, grind/polish, glassing, dicing or wafer electrical test). Essential Functions * Perform a variety of functions in the production of semiconductor devices in a cleanroom ...
... diffusion, implant, grind/polish, glassing, dicing or wafer electrical test). Essential Functions * Perform a variety of functions in the production of semiconductor devices in a cleanroom ...
... diffusion, implant, grind/polish, glassing, dicing or wafer electrical test). Essential Functions * Perform a variety of functions in the production of semiconductor devices in a cleanroom ...
Equipment Logistics Technician
Lowell, MA · On-site
$19 - $24/hr
... diffusion, implant, grind/polish, glassing, dicing or wafer electrical test). Essential Functions * Perform a variety of functions in the production of semiconductor devices in a cleanroom ...
Equipment Logistics Technician
Lowell, MA · On-site
$19 - $24/hr
... diffusion, implant, grind/polish, glassing, dicing or wafer electrical test). Essential Functions * Perform a variety of functions in the production of semiconductor devices in a cleanroom ...
Materials R&D Technician - Level 4/5
Bastrop, TX · On-site
$19.50 - $26/hr
Partner with engineering to rapidly bring online state-of-the art silicon wafer fab development lines that include wafer slicing, grinding, cleaning, degumming, and inspection stations. * Drive ...
Materials R&D Technician - Level 4/5
Bastrop, TX · On-site
$19.50 - $26/hr
Partner with engineering to rapidly bring online state-of-the art silicon wafer fab development lines that include wafer slicing, grinding, cleaning, degumming, and inspection stations. * Drive ...
Experience with wafer-level and chip-level integration processes, including wafer-to-wafer and die-to-wafer bonding, Cu-Cu hybrid bonding, wafer thinning, lap/grind, and TSV technologies * Experience ...
Experience with wafer-level and chip-level integration processes, including wafer-to-wafer and die-to-wafer bonding, Cu-Cu hybrid bonding, wafer thinning, lap/grind, and TSV technologies * Experience ...
Experience with wafer-level and chip-level integration processes, including wafer-to-wafer and die-to-wafer bonding, Cu-Cu hybrid bonding, wafer thinning, lap/grind, and TSV technologies * Experience ...
Experience with wafer-level and chip-level integration processes, including wafer-to-wafer and die-to-wafer bonding, Cu-Cu hybrid bonding, wafer thinning, lap/grind, and TSV technologies * Experience ...
Wafer thinning (grind, polish) * Wafer scribe, facet cleave, laser bar coating * Mask design and integration * Laser diode, photonics, or device development * GaN process development 70% - GaN Wafer ...
New
Wafer thinning (grind, polish) * Wafer scribe, facet cleave, laser bar coating * Mask design and integration * Laser diode, photonics, or device development * GaN process development 70% - GaN Wafer ...
New
Process Engineer, Principal
Lowell, MA · On-site
Thinning Process Engineer Thinning Process Engineer responsible for sustaining existing processes and developing new Grind and Polish processes in the wafer fab located in Lowell, MA. Product lines ...
Process Engineer, Principal
Lowell, MA · On-site
Thinning Process Engineer Thinning Process Engineer responsible for sustaining existing processes and developing new Grind and Polish processes in the wafer fab located in Lowell, MA. Product lines ...
Package Integration Engineer
Bodega Bay, CA · On-site
$184K - $324K/yr
Some hands-on knowledge in Wafer Bumping, Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach (including multilayer thin die stacking), encapsulation ...
Package Integration Engineer
Bodega Bay, CA · On-site
$184K - $324K/yr
Some hands-on knowledge in Wafer Bumping, Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach (including multilayer thin die stacking), encapsulation ...
Crystal Optics Fabrication Technician
Fremont, CA · On-site
$25 - $30/hr
... or wafer processing, or a related technical field. * Experience with slicing, dicing, lapping, grinding, polishing, or other precision material-removal processes preferred. * Strong mechanical ...
Quick apply
Crystal Optics Fabrication Technician
Fremont, CA · On-site
$25 - $30/hr
... or wafer processing, or a related technical field. * Experience with slicing, dicing, lapping, grinding, polishing, or other precision material-removal processes preferred. * Strong mechanical ...
Crystal Optics Fabrication Technician
Fremont, CA · On-site
$25 - $30/hr
... or wafer processing, or a related technical field. * Experience with slicing, dicing, lapping, grinding, polishing, or other precision material-removal processes preferred. * Strong mechanical ...
Crystal Optics Fabrication Technician
Fremont, CA · On-site
$25 - $30/hr
... or wafer processing, or a related technical field. * Experience with slicing, dicing, lapping, grinding, polishing, or other precision material-removal processes preferred. * Strong mechanical ...
Crystal Optics Fabrication Technician
$25 - $30/hr
... or wafer processing, or a related technical field. * Experience with slicing, dicing, lapping, grinding, polishing, or other precision material-removal processes preferred. * Strong mechanical ...
Crystal Optics Fabrication Technician
$25 - $30/hr
... or wafer processing, or a related technical field. * Experience with slicing, dicing, lapping, grinding, polishing, or other precision material-removal processes preferred. * Strong mechanical ...
Electrical Mechanical Technician
Danbury, CT · On-site
$39K - $68K/yr
Working to written standard work instructions to set up and run wafer fabrication/micro assembly ... Experience grinding or polishing small optics is a plus - What You Can Expect: A culture of ...
Electrical Mechanical Technician
Danbury, CT · On-site
$39K - $68K/yr
Working to written standard work instructions to set up and run wafer fabrication/micro assembly ... Experience grinding or polishing small optics is a plus - What You Can Expect: A culture of ...
Electrical Mechanical Technician
Danbury, CT · On-site
$39K - $68K/yr
Responsibilities: • Working to written standard work instructions to set up and run wafer ... Desired: • Experience grinding or polishing small optics is a plus What You Can Expect: A culture ...
Electrical Mechanical Technician
Danbury, CT · On-site
$39K - $68K/yr
Responsibilities: • Working to written standard work instructions to set up and run wafer ... Desired: • Experience grinding or polishing small optics is a plus What You Can Expect: A culture ...
Wet Process, CMP and Bond MDE Principal Lead Engineer
Boise, ID · On-site
$140 - $190/hr
Experience in at least one core area: wet process, CMP, wafer bonding, grinding, or edge trimming * Strong problem‑solving and interpersonal skills Preferred Qualifications * 5+ years of ...
Wet Process, CMP and Bond MDE Principal Lead Engineer
Boise, ID · On-site
$140 - $190/hr
Experience in at least one core area: wet process, CMP, wafer bonding, grinding, or edge trimming * Strong problem‑solving and interpersonal skills Preferred Qualifications * 5+ years of ...
Wet Process, CMP and Bond MDE Principal Lead Engineer
Boise, ID · On-site
$150 - $190/hr
Experience in at least one core area: wet process, CMP, wafer bonding, grinding, or edge trimming. * Strong problem‑solving and interpersonal skills. Preferred Qualifications * 5+ years of ...
Wet Process, CMP and Bond MDE Principal Lead Engineer
Boise, ID · On-site
$150 - $190/hr
Experience in at least one core area: wet process, CMP, wafer bonding, grinding, or edge trimming. * Strong problem‑solving and interpersonal skills. Preferred Qualifications * 5+ years of ...
Packaging Engineer
Bodega Bay, CA · On-site
$184K - $324K/yr
Some hands-on knowledge in Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach, encapsulation/molding, under-fill, ball attach, package singulation and Tape ...
Packaging Engineer
Bodega Bay, CA · On-site
$184K - $324K/yr
Some hands-on knowledge in Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach, encapsulation/molding, under-fill, ball attach, package singulation and Tape ...
Staff Process Development Engineer (Backend)
San Jose, CA · On-site
$65 - $90/hr
Backend Wafer Processing Develop and optimise backend wafer processing operations including wafer mounting, thinning, back grinding, chemical mechanical polishing (CMP), polishing, cleaving, and ...
Staff Process Development Engineer (Backend)
San Jose, CA · On-site
$65 - $90/hr
Backend Wafer Processing Develop and optimise backend wafer processing operations including wafer mounting, thinning, back grinding, chemical mechanical polishing (CMP), polishing, cleaving, and ...
Assembly - Die Attach
Salem, NH · On-site
The Senior Fabrication Engineer will manage the wafer processing operation in a semi-automated ... Grinding, Lapping, Polishing, Saw, Scribe * Datacentric approach for design, process control, and ...
Assembly - Die Attach
Salem, NH · On-site
The Senior Fabrication Engineer will manage the wafer processing operation in a semi-automated ... Grinding, Lapping, Polishing, Saw, Scribe * Datacentric approach for design, process control, and ...
Wafer Grinding information
See salary details
$13.46 - $14.62
15% of jobs
$14.62 - $15.78
9% of jobs
$16.65 is the 25th percentile. Wages below this are outliers.
$15.78 - $16.94
2% of jobs
$16.94 - $18.09
5% of jobs
The median wage is $19.19 / hr.
$18.09 - $19.25
20% of jobs
$19.25 - $20.41
22% of jobs
$20.53 is the 75th percentile. Wages above this are outliers.
$20.41 - $21.57
16% of jobs
$21.57 - $22.73
4% of jobs
$22.73 - $23.89
3% of jobs
$23.89 - $25.04
2% of jobs
$25.04 - $26.20
1% of jobs
$13
$19
$26
How much do wafer grinding jobs pay per hour?
As of Sep 2, 2026, the average hourly pay for wafer grinding in the United States is $19.16, according to ZipRecruiter salary data. Most workers in this role earn between $17.07 and $20.67 per hour, depending on experience, location, and employer.
What are the key skills and qualifications needed to thrive as a wafer grinding technician?
To excel as a Wafer Grinding Technician, you need a solid understanding of semiconductor manufacturing processes, precision measurement, and a high school diploma or technical certification. Familiarity with grinding machines, cleanroom protocols, and inspection tools like micrometers and profilometers is typically required. Attention to detail, problem-solving abilities, and effective communication are crucial soft skills in this role. These competencies ensure the production of high-quality wafers, minimize defects, and maintain efficiency in semiconductor fabrication.
What are some common challenges faced in wafer grinding roles, and how can they be addressed?
One common challenge in wafer grinding is maintaining tight tolerances and preventing wafer breakage, as the process requires extreme precision and careful handling. Operators must remain vigilant about equipment calibration, cleanliness, and monitoring for any signs of tool wear or contamination. Effective communication with quality assurance and maintenance teams is essential to quickly address issues and minimize downtime. Continuous on-the-job training and following strict safety protocols also help ensure high-quality output and a safe work environment.
What is the difference between Wafer Grinding vs Wafer Polishing?
| Aspect | Wafer Grinding | Wafer Polishing |
|---|---|---|
| Primary Purpose | Material removal to achieve desired thickness and flatness | Surface finishing to improve smoothness and reflectivity |
| Process | Mechanical grinding using abrasive wheels or belts | Chemical-mechanical polishing for fine surface finish |
| Equipment | Grinding machines, abrasive tools | Polishing pads, chemical slurry |
| Work Environment | Cleanroom, precision manufacturing | Cleanroom, surface finishing labs |
Wafer Grinding and Wafer Polishing are both essential in semiconductor manufacturing. Grinding primarily reduces wafer thickness and prepares the surface, while polishing enhances surface smoothness and quality. Both roles require precision, cleanroom environments, and similar technical skills, but focus on different stages of wafer preparation.
What is wafer grinding?
Wafer grinding is a process used in semiconductor manufacturing to thin silicon wafers by removing material with precision grinding equipment. It is typically performed before dicing and packaging, requiring knowledge of equipment operation and safety protocols. The job often involves working in cleanroom environments and may require certifications in equipment handling.
Full-time
Re-posted 21 days ago
Job description
Semiconductor Manufacturing Tech 2
Summary of Role
MACOM is seeking a self-motivated and enthusiastic semiconductor manufacturing operator/tech for our Wafer Fab. The operator/tech will report into the manufacturing team and perform general manufacturing duties on the production floor such as fabrication (lithography, etch, metals, diffusion, implant, grind/polish, glassing, dicing or wafer electrical test).
Essential Functions
- Perform a variety of functions in the production of semiconductor devices in a cleanroom environment.
- Set-up, operate, load, and monitor specialized equipment to ensure quality product is produced.
- May be responsible for monitoring equipment operation, inspecting final product, cleaning the work environment, and performing data entry.
- Work on one of our 12 hour compressed work week night shifts (6:00pm to 6:00am), or day shifts (6:00am to 6:00pm). All shifts alternate working 3, 12 hour shifts one week (36 hours) and 4, 12 hours shifts the following week (48 hours). Shifts will work either Sun, Mon, Tue alternating Wed or Thu, Fri, Sat alternating Wed.